GB1113186A - Improvements in or relating to the manufacture of electrical component assemblies - Google Patents
Improvements in or relating to the manufacture of electrical component assembliesInfo
- Publication number
- GB1113186A GB1113186A GB10603/67A GB1060367A GB1113186A GB 1113186 A GB1113186 A GB 1113186A GB 10603/67 A GB10603/67 A GB 10603/67A GB 1060367 A GB1060367 A GB 1060367A GB 1113186 A GB1113186 A GB 1113186A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- layers
- capacitor
- resistors
- march
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
- H01C17/265—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
1,113,186. Printed circuits. SIEMENS A.G. 7 March, 1967 [8 March, 1966], No. 10603/67. Heading H1R. In a process for making a thin film circuit comprising at least one resistor and at least one capacitor, one surface of an insulating carrier 1 (e.g. glass or ceramic) is covered with a highresistance metal layer 2; a lower-resistance metal layer 3 is then deposited, followed by etching away of unwanted parts of the layers 2, 3; layer 3 is partially oxidized where resistors and capacitors are required, to produce a capacitor dielectric layer 6 overlying a lowresistance electrode 5; and the areas designed as resistors are further treated so as completely to oxidize at least layer 3 at 4. Where conductors are required, layer 3 is protected from any oxidation. The preferred metal for layers 2, 3 is Ta, the difference in resistivity of the layers being produced at the sputtering-on stage; alternatively, layers 2, 3 may comprise Ta/A1; Ni-Cr/Ta; or Ni-Cr/A1. The oxidation steps are preferably carried out by anodization. A second electrode 7 for the capacitor may be of Au applied by vapour deposition.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0102413 | 1966-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1113186A true GB1113186A (en) | 1968-05-08 |
Family
ID=7524420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB10603/67A Expired GB1113186A (en) | 1966-03-08 | 1967-03-07 | Improvements in or relating to the manufacture of electrical component assemblies |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1665571B1 (en) |
FR (1) | FR1516407A (en) |
GB (1) | GB1113186A (en) |
NL (1) | NL142286B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2110987B2 (en) * | 1971-03-08 | 1978-11-16 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Process for producing thin layers of tantalum |
DE2906813C2 (en) * | 1979-02-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Electronic thin-film circuit |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3217209A (en) * | 1960-05-12 | 1965-11-09 | Xerox Corp | Printed circuits with resistive and capacitive elements |
-
1966
- 1966-03-08 DE DE19661665571 patent/DE1665571B1/en not_active Withdrawn
-
1967
- 1967-02-02 NL NL676701626A patent/NL142286B/en not_active IP Right Cessation
- 1967-03-03 FR FR97318A patent/FR1516407A/en not_active Expired
- 1967-03-07 GB GB10603/67A patent/GB1113186A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL142286B (en) | 1974-05-15 |
FR1516407A (en) | 1968-03-08 |
NL6701626A (en) | 1967-09-11 |
DE1665571B1 (en) | 1971-09-09 |
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