GB1108715A - Protective coatings for semiconductor devices - Google Patents

Protective coatings for semiconductor devices

Info

Publication number
GB1108715A
GB1108715A GB37487/66A GB3748766A GB1108715A GB 1108715 A GB1108715 A GB 1108715A GB 37487/66 A GB37487/66 A GB 37487/66A GB 3748766 A GB3748766 A GB 3748766A GB 1108715 A GB1108715 A GB 1108715A
Authority
GB
United Kingdom
Prior art keywords
semi
coated
conductor
layer
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37487/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1108715A publication Critical patent/GB1108715A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
GB37487/66A 1965-09-13 1966-08-22 Protective coatings for semiconductor devices Expired GB1108715A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48661365A 1965-09-13 1965-09-13

Publications (1)

Publication Number Publication Date
GB1108715A true GB1108715A (en) 1968-04-03

Family

ID=23932553

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37487/66A Expired GB1108715A (en) 1965-09-13 1966-08-22 Protective coatings for semiconductor devices

Country Status (5)

Country Link
US (1) US3447975A (enExample)
BE (1) BE686512A (enExample)
CH (1) CH453508A (enExample)
DE (1) DE1589063A1 (enExample)
GB (1) GB1108715A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1816841A1 (de) * 1968-12-04 1970-07-02 Siemens Ag Verfahren zum Stabilisieren der Kennlinie eines Halbleiterbauelements
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US3775215A (en) * 1971-12-22 1973-11-27 Sperry Rand Corp Method of thin coating a memory stack
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
JPS5336997B2 (enExample) * 1973-10-12 1978-10-05
US4198444A (en) * 1975-08-04 1980-04-15 General Electric Company Method for providing substantially hermetic sealing means for electronic components
US4040874A (en) * 1975-08-04 1977-08-09 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4017340A (en) * 1975-08-04 1977-04-12 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4173683A (en) * 1977-06-13 1979-11-06 Rca Corporation Chemically treating the overcoat of a semiconductor device
US5026667A (en) * 1987-12-29 1991-06-25 Analog Devices, Incorporated Producing integrated circuit chips with reduced stress effects

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE465549A (enExample) * 1940-11-16 1900-01-01
US3012006A (en) * 1958-04-24 1961-12-05 Dow Corning Fluorinated alkyl silanes and their use
US3114663A (en) * 1960-03-29 1963-12-17 Rca Corp Method of providing semiconductor wafers with protective and masking coatings
US3242007A (en) * 1961-11-15 1966-03-22 Texas Instruments Inc Pyrolytic deposition of protective coatings of semiconductor surfaces

Also Published As

Publication number Publication date
CH453508A (de) 1968-06-14
DE1589063A1 (de) 1970-03-19
BE686512A (enExample) 1967-02-15
US3447975A (en) 1969-06-03

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