GB1107620A - Method of manufacturing semiconductor devices - Google Patents

Method of manufacturing semiconductor devices

Info

Publication number
GB1107620A
GB1107620A GB1169867A GB1169867A GB1107620A GB 1107620 A GB1107620 A GB 1107620A GB 1169867 A GB1169867 A GB 1169867A GB 1169867 A GB1169867 A GB 1169867A GB 1107620 A GB1107620 A GB 1107620A
Authority
GB
United Kingdom
Prior art keywords
hydrogen
semiconductor devices
manufacturing semiconductor
contact
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1169867A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of GB1107620A publication Critical patent/GB1107620A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor

Abstract

A rectifying Schottky contact is formed on a body of silicon, germanium or gallium arsenide by heating the body to 250-500 DEG C. and depositing molybdenum or tungsten on it by the thermal decomposition or hydrogen reduction of a carbonyl compound thereof e.g. a hexacarbonyl compound or cyclopentadienyl derivative thereof. Typically the semi-conductor surface is etched in hydrogen chloride prior to the deposition which is effected in vacuum or under a small partial pressure of hydrogen. The contact may be plated with nickel and then reduced to the required area by photo-resist and etching steps.
GB1169867A 1966-03-29 1967-03-13 Method of manufacturing semiconductor devices Expired GB1107620A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020966 1966-03-29

Publications (1)

Publication Number Publication Date
GB1107620A true GB1107620A (en) 1968-03-27

Family

ID=12020759

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1169867A Expired GB1107620A (en) 1966-03-29 1967-03-13 Method of manufacturing semiconductor devices

Country Status (7)

Country Link
BE (1) BE696171A (en)
CH (1) CH474854A (en)
DE (1) DE1614136B1 (en)
FR (1) FR1515732A (en)
GB (1) GB1107620A (en)
NL (1) NL148360B (en)
SE (1) SE325338B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112969814A (en) * 2018-11-14 2021-06-15 Dnf有限公司 Method for producing molybdenum-containing thin film and molybdenum-containing thin film produced by the method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562606A (en) * 1969-08-13 1971-02-09 Varian Associates Subsurface gallium arsenide schottky-type diode and method of fabricating same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE624959A (en) * 1961-11-20
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112969814A (en) * 2018-11-14 2021-06-15 Dnf有限公司 Method for producing molybdenum-containing thin film and molybdenum-containing thin film produced by the method

Also Published As

Publication number Publication date
NL6704404A (en) 1967-10-02
FR1515732A (en) 1968-03-01
DE1614136B1 (en) 1971-08-12
BE696171A (en) 1967-09-01
CH474854A (en) 1969-06-30
SE325338B (en) 1970-06-29
NL148360B (en) 1976-01-15

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