GB1047390A - - Google Patents

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Publication number
GB1047390A
GB1047390A GB1047390DA GB1047390A GB 1047390 A GB1047390 A GB 1047390A GB 1047390D A GB1047390D A GB 1047390DA GB 1047390 A GB1047390 A GB 1047390A
Authority
GB
United Kingdom
Prior art keywords
terminal areas
wafer
conductive
areas
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
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English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of GB1047390A publication Critical patent/GB1047390A/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2224/487—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB1047390D 1963-05-20 Expired GB1047390A (US06373033-20020416-M00002.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US281419A US3258898A (en) 1963-05-20 1963-05-20 Electronic subassembly

Publications (1)

Publication Number Publication Date
GB1047390A true GB1047390A (US06373033-20020416-M00002.png) 1900-01-01

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ID=23077216

Family Applications (1)

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GB1047390D Expired GB1047390A (US06373033-20020416-M00002.png) 1963-05-20

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US (1) US3258898A (US06373033-20020416-M00002.png)
GB (1) GB1047390A (US06373033-20020416-M00002.png)

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US3393349A (en) * 1964-04-30 1968-07-16 Motorola Inc Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island
DE1201887B (de) * 1964-08-01 1965-09-30 Telefunken Patent Verfahren und Vorrichtung zum Einloeten von Transistoren od. dgl.
US3397447A (en) * 1964-10-22 1968-08-20 Dow Corning Method of making semiconductor circuits
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US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections
US3436614A (en) * 1965-04-20 1969-04-01 Nippon Telegraph & Telephone Nonrectifying laminated ohmic contact for semiconductors consisting of chromium and 80% nickel
FR1486855A (US06373033-20020416-M00002.png) * 1965-07-17 1967-10-05
US3442003A (en) * 1965-07-26 1969-05-06 Teledyne Inc Method for interconnecting thin films
US3413711A (en) * 1966-09-07 1968-12-03 Western Electric Co Method of making palladium copper contact for soldering
US3423822A (en) * 1967-02-27 1969-01-28 Northern Electric Co Method of making large scale integrated circuit
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3601745A (en) * 1969-12-24 1971-08-24 Sprague Electric Co Standardized resistor blank
US3627597A (en) * 1970-01-05 1971-12-14 Nathan A Tiner Engraving
US3754168A (en) * 1970-03-09 1973-08-21 Texas Instruments Inc Metal contact and interconnection system for nonhermetic enclosed semiconductor devices
US3924321A (en) * 1970-11-23 1975-12-09 Harris Corp Radiation hardened mis devices
DE2259133C3 (de) * 1972-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer Halbleiteranordnung und Anwendung des Verfahrens
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