GB1040990A - Low cost transistor - Google Patents

Low cost transistor

Info

Publication number
GB1040990A
GB1040990A GB15671/64A GB1567164A GB1040990A GB 1040990 A GB1040990 A GB 1040990A GB 15671/64 A GB15671/64 A GB 15671/64A GB 1567164 A GB1567164 A GB 1567164A GB 1040990 A GB1040990 A GB 1040990A
Authority
GB
United Kingdom
Prior art keywords
carrier
pellet
lead
pellets
segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15671/64A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1040990A publication Critical patent/GB1040990A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
GB15671/64A 1963-05-10 1964-04-15 Low cost transistor Expired GB1040990A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US279476A US3235937A (en) 1963-05-10 1963-05-10 Low cost transistor

Publications (1)

Publication Number Publication Date
GB1040990A true GB1040990A (en) 1966-09-01

Family

ID=23069133

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15671/64A Expired GB1040990A (en) 1963-05-10 1964-04-15 Low cost transistor

Country Status (4)

Country Link
US (1) US3235937A (cg-RX-API-DMAC7.html)
DE (1) DE1255819B (cg-RX-API-DMAC7.html)
GB (1) GB1040990A (cg-RX-API-DMAC7.html)
NL (1) NL6405157A (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3439238A (en) * 1963-12-16 1969-04-15 Texas Instruments Inc Semiconductor devices and process for embedding same in plastic
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
US3346787A (en) * 1965-04-09 1967-10-10 Gen Electric High frequency transistor with internal angular posts and divergent, stiff leads to reduce inter-electrode capacitance
US3474301A (en) * 1965-04-30 1969-10-21 Hitachi Ltd Semiconductor devices having insulating protective films and sealed with resinous materials
US3444441A (en) * 1965-06-18 1969-05-13 Motorola Inc Semiconductor devices including lead and plastic housing structure suitable for automated process construction
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
US3444614A (en) * 1966-01-12 1969-05-20 Bendix Corp Method of manufacturing semiconductor devices
US3492157A (en) * 1966-06-20 1970-01-27 Tokyo Shibaura Electric Co Resin-sealed semiconductor device and manufacturing method for the same
GB1196452A (en) * 1967-01-19 1970-06-24 Lucas Industries Ltd Semiconductor Circuits
US3465210A (en) * 1967-05-23 1969-09-02 Rca Corp Housing and lead assembly for high-frequency semiconductor devices
US3737983A (en) * 1969-06-30 1973-06-12 Texas Instruments Inc Automated method and system for fabricating semiconductor devices
US3982317A (en) * 1975-07-31 1976-09-28 Sprague Electric Company Method for continuous assembly and batch molding of transistor packages
EP0401211B1 (de) * 1988-02-20 1993-05-19 Deutsche ITT Industries GmbH Halbleiterbauelement, herstellungsverfahren, vorrichtung und montageplatz

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2758261A (en) * 1952-06-02 1956-08-07 Rca Corp Protection of semiconductor devices
NL212855A (cg-RX-API-DMAC7.html) * 1955-03-10
US2888736A (en) * 1955-03-31 1959-06-02 Raytheon Mfg Co Transistor packages
US2948951A (en) * 1957-11-19 1960-08-16 Edwin F Dillaby Formation of point contact transistors
NL242895A (cg-RX-API-DMAC7.html) * 1958-09-02
US2982002A (en) * 1959-03-06 1961-05-02 Shockley William Fabrication of semiconductor elements
NL130054C (cg-RX-API-DMAC7.html) * 1960-02-12
US3123750A (en) * 1961-10-31 1964-03-03 Multiple junction semiconductor device

Also Published As

Publication number Publication date
DE1255819B (de) 1967-12-07
NL6405157A (cg-RX-API-DMAC7.html) 1964-11-11
US3235937A (en) 1966-02-22

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