GB1039734A - Improvements in or relating to electrical apparatus - Google Patents

Improvements in or relating to electrical apparatus

Info

Publication number
GB1039734A
GB1039734A GB1646063A GB1646063A GB1039734A GB 1039734 A GB1039734 A GB 1039734A GB 1646063 A GB1646063 A GB 1646063A GB 1646063 A GB1646063 A GB 1646063A GB 1039734 A GB1039734 A GB 1039734A
Authority
GB
United Kingdom
Prior art keywords
semi
adhesive material
members
plates
conductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1646063A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1039734A publication Critical patent/GB1039734A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Conversion In General (AREA)
GB1646063A 1962-04-26 1963-04-26 Improvements in or relating to electrical apparatus Expired GB1039734A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0079177 DE1273074B (de) 1962-04-26 1962-04-26 Stromrichteranlage mit an Profilkoerpern aus Isoliermaterial anmontierten Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
GB1039734A true GB1039734A (en) 1966-08-17

Family

ID=7508003

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1646063A Expired GB1039734A (en) 1962-04-26 1963-04-26 Improvements in or relating to electrical apparatus

Country Status (4)

Country Link
BE (1) BE631403A (enrdf_load_stackoverflow)
CH (1) CH418449A (enrdf_load_stackoverflow)
DE (1) DE1273074B (enrdf_load_stackoverflow)
GB (1) GB1039734A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3638073A (en) * 1970-02-19 1972-01-25 Gen Instrument Corp Semiconductor assembly with heat sink and connector bodies
DE2812699C2 (de) * 1978-03-23 1987-04-09 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichter in Brückenschaltung mit einseitig gekühlten Scheibenthyristoren
DE3007306A1 (de) * 1980-02-01 1981-08-06 BBC AG Brown, Boveri & Cie., Baden, Aargau Luftgekuehlter stromrichter
US4710850A (en) * 1986-02-19 1987-12-01 Siemens Aktiengesellschaft Tower design for high-voltage systems
DE3802593A1 (de) * 1988-01-29 1989-08-10 Heidelberger Druckmasch Ag Umrichter mit gleichspannungs-zwischenkreis
DE102008050487A1 (de) * 2008-10-01 2010-04-15 Siemens Aktiengesellschaft Elektrische Vorrichtung mit einem Haltegerüst

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE896392C (de) * 1951-11-13 1953-11-12 Licentia Gmbh Gehaeuse fuer ein elektrisch unsymmetrisch leitendes System vom Kristalltyp
DE971168C (de) * 1953-08-23 1958-12-18 Siemens Ag Trockengleichrichteranordnung fuer Hochspannungszwecke
DE1037017B (de) * 1956-01-23 1958-08-21 Siemens Reiniger Werke Ag Trockengleichrichter-Hochspannungseinheit
DE1062822B (de) * 1957-04-20 1959-08-06 Licentia Gmbh Trockengleichrichtereinheit fuer Trockengleichrichter hoher Belastbarkeit

Also Published As

Publication number Publication date
CH418449A (de) 1966-08-15
BE631403A (enrdf_load_stackoverflow)
DE1273074B (de) 1968-07-18

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