GB1024633A - Semiconductor components - Google Patents
Semiconductor componentsInfo
- Publication number
- GB1024633A GB1024633A GB1541063A GB1541063A GB1024633A GB 1024633 A GB1024633 A GB 1024633A GB 1541063 A GB1541063 A GB 1541063A GB 1541063 A GB1541063 A GB 1541063A GB 1024633 A GB1024633 A GB 1024633A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- nickel
- blocks
- facings
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01045—Rhodium [Rh]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
Abstract
1,024,633. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE, A.G. April 18, 1963 [April 18, 1962], No. 15410/63. Heading H1K. A semi-conductor body with doped regions has superposed layers of nickel and gold on a face which is held in pressure contact with a contact member. A typical device is made by diffusion of phosphorus and boron respectively from coatings into opposite faces of a P-type silicon wafer. Nickel is then deposited by electroless plating on both faces to a depth of up to 3 Á from a specified solution of nickel salts, and gold deposited from solution on the nickel. The resulting arrangement is finally clamped between two copper blocks. Between the blocks and gold layers there are provided silver facings on the blocks and/or silver sheets. Alternatively facings and sheets of gold, platinum, rhodium or iridium may be used.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1962S0079056 DE1273073B (en) | 1962-04-18 | 1962-04-18 | Semiconductor component with pressure contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1024633A true GB1024633A (en) | 1966-03-30 |
Family
ID=7507915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1541063A Expired GB1024633A (en) | 1962-04-18 | 1963-04-18 | Semiconductor components |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH420388A (en) |
DE (1) | DE1273073B (en) |
GB (1) | GB1024633A (en) |
NL (2) | NL142823B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2015247A1 (en) * | 1969-03-31 | 1970-10-08 | ||
EP3240125A4 (en) * | 2014-12-26 | 2018-01-03 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4953003A (en) * | 1987-05-21 | 1990-08-28 | Siemens Aktiengesellschaft | Power semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2784121A (en) * | 1952-11-20 | 1957-03-05 | Bell Telephone Labor Inc | Method of fabricating semiconductor bodies for translating devices |
DE1095615B (en) * | 1958-04-23 | 1960-12-22 | Licentia Gmbh | Process for electroplating molybdenum sheet |
NL243218A (en) * | 1958-12-24 |
-
0
- NL NL291606D patent/NL291606A/xx unknown
-
1962
- 1962-04-18 DE DE1962S0079056 patent/DE1273073B/en not_active Withdrawn
-
1963
- 1963-02-21 CH CH219663A patent/CH420388A/en unknown
- 1963-04-17 NL NL291606A patent/NL142823B/en unknown
- 1963-04-18 GB GB1541063A patent/GB1024633A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2015247A1 (en) * | 1969-03-31 | 1970-10-08 | ||
EP3240125A4 (en) * | 2014-12-26 | 2018-01-03 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
US10290560B2 (en) | 2014-12-26 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
EP3660989A1 (en) * | 2014-12-26 | 2020-06-03 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
NL142823B (en) | 1974-07-15 |
DE1273073B (en) | 1968-07-18 |
CH420388A (en) | 1966-09-15 |
NL291606A (en) |
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