GB1004588A - Process of manufacturing a semiconductor element - Google Patents
Process of manufacturing a semiconductor elementInfo
- Publication number
- GB1004588A GB1004588A GB4383661A GB4383661A GB1004588A GB 1004588 A GB1004588 A GB 1004588A GB 4383661 A GB4383661 A GB 4383661A GB 4383661 A GB4383661 A GB 4383661A GB 1004588 A GB1004588 A GB 1004588A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductivity type
- recrystallized
- monocrystal
- melt
- doped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Abstract
1,004,588. Transistors. COMPAGNIE FRANCAISE THOMSON-HOUSTON. Dec. 7, 1961 [Dec. 7, 1960], No. 43836/61. Heading H1K. A PNIP or NPIN monocrystalline element for use in a transistor, is formed from a monocrystal doped with a donor and acceptor impurity of which the one determining the conductivity type has the lower diffusion coefficient by bringing it into contact with a molten mass of lightly doped semi-conductor of the same conductivity type. After partial recrystallisation further doping material is added so that the subsequently recrystallizing material is of the same conductivity type but of lower resistivity. During crystallization and, if necessary, in a subsequent heating step, the minor impurity diffuses from the original monocrystal to form a zone of opposite conductivity type in the recrystallized part. The crystal pulling technique may be used or the melt formed on the surface of the monocrystal in an inert gas and recrystallized there. Typically a grown P-type germanium monocrystalline wafer containing 10<SP>18</SP> atoms/c.c. of indium and 10<SP>17</SP> atoms/c.c. of antimony is dipped in a melt of gallium doped 5 ohm cm. P germanium and withdrawn until the recrystallized layer is 100 Á thick when more gallium is added to the melt to provide a zone of 0À005 ohm cm. resistivity. During recrystallization which typically takes 30 seconds a 6 Á thick N layer is formed adjacent the base crystal by diffusion of antimony into the recrystallized region. Specification 963,275 is referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR846181A FR1282094A (en) | 1960-12-07 | 1960-12-07 | Method of manufacturing a semiconductor element with several junctions and semiconductor element produced according to this method |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1004588A true GB1004588A (en) | 1965-09-15 |
Family
ID=8744243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4383661A Expired GB1004588A (en) | 1960-12-07 | 1961-12-07 | Process of manufacturing a semiconductor element |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1282094A (en) |
GB (1) | GB1004588A (en) |
-
1960
- 1960-12-07 FR FR846181A patent/FR1282094A/en not_active Expired
-
1961
- 1961-12-07 GB GB4383661A patent/GB1004588A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1282094A (en) | 1962-01-19 |
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