GB0228206D0 - Means and method of circuit component protection - Google Patents

Means and method of circuit component protection

Info

Publication number
GB0228206D0
GB0228206D0 GB0228206A GB0228206A GB0228206D0 GB 0228206 D0 GB0228206 D0 GB 0228206D0 GB 0228206 A GB0228206 A GB 0228206A GB 0228206 A GB0228206 A GB 0228206A GB 0228206 D0 GB0228206 D0 GB 0228206D0
Authority
GB
United Kingdom
Prior art keywords
components
housing
component
circuit component
component protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0228206A
Other versions
GB2382931B (en
GB2382931A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Ltd
Original Assignee
Semikron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Ltd filed Critical Semikron Ltd
Publication of GB0228206D0 publication Critical patent/GB0228206D0/en
Publication of GB2382931A publication Critical patent/GB2382931A/en
Application granted granted Critical
Publication of GB2382931B publication Critical patent/GB2382931B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Components of a circuit on a printed circuit board <B>3</B> are protected from the effects of destructive breakdown of a component or components <B>1, 2</B> that is or are likely to undergo destructive breakdown by encasing the component or components <B>1, 2</B> in a housing <B>8</B>. If a heat sink assembly <B>6</B> is mounted in contact with a face of the component or components the housing <B>8</B> may be arranged to shield the remaining exposed faces of the component or components <B>1, 2</B> . The housing <B>8</B> may comprise a tray having a base which may be interposed between the component or components <B>1, 2</B> and the printed circuit board <B>3</B>. The housing <B>8</B> may be formed from a folded blank of non-flammable material. The housing <B>8</B> may also comprise a lid formation.
GB0228206A 2001-12-05 2002-12-04 Means for and methods of circuit component protection Expired - Fee Related GB2382931B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0129043A GB0129043D0 (en) 2001-12-05 2001-12-05 Means and methods of circuit component protection

Publications (3)

Publication Number Publication Date
GB0228206D0 true GB0228206D0 (en) 2003-01-08
GB2382931A GB2382931A (en) 2003-06-11
GB2382931B GB2382931B (en) 2005-09-07

Family

ID=9926992

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0129043A Ceased GB0129043D0 (en) 2001-12-05 2001-12-05 Means and methods of circuit component protection
GB0228206A Expired - Fee Related GB2382931B (en) 2001-12-05 2002-12-04 Means for and methods of circuit component protection

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0129043A Ceased GB0129043D0 (en) 2001-12-05 2001-12-05 Means and methods of circuit component protection

Country Status (1)

Country Link
GB (2) GB0129043D0 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718172A1 (en) * 1987-02-05 1988-12-08 Eldo Elektronik Service Gmbh Encapsulation of an electronic component
CN1167313C (en) * 2000-01-10 2004-09-15 神达电脑股份有限公司 Heat-proofing insulating shield sleeve

Also Published As

Publication number Publication date
GB2382931B (en) 2005-09-07
GB2382931A (en) 2003-06-11
GB0129043D0 (en) 2002-01-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20061204