CN1167313C - Heat-proofing insulating shield sleeve - Google Patents
Heat-proofing insulating shield sleeve Download PDFInfo
- Publication number
- CN1167313C CN1167313C CNB001010166A CN00101016A CN1167313C CN 1167313 C CN1167313 C CN 1167313C CN B001010166 A CNB001010166 A CN B001010166A CN 00101016 A CN00101016 A CN 00101016A CN 1167313 C CN1167313 C CN 1167313C
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- insulating shield
- shield sleeve
- proofing insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a heatproof insulating shield sleeve which makes two adjacent heat radiation devices respectively connected with pins of a power transistor not generate a contact short circuit for burning a wafer. In addition, the heatproof insulating shield sleeve can be applied to the manufacturing process of a circuit board for keeping the fixed positions of the heat radiation devices of the circuit board.
Description
Technical field
The present invention relates to the high temperature insulation device on a kind of circuit board, and be particularly related to the heat-proofing insulating shield sleeve on a kind of circuit board.
Background technology
Computer industrial boom in recent years, the demand of various circuit board also increase gradually.Yet under the trend of electronic installation downsizing, also reduce thereupon the inner space of device.In this case, circuit board also must dwindle, and it is tight more that the result causes the electronic component on the circuit board to be arranged.Therefore, the insulating radiation problem of electronic component more notes on the circuit board.
Power electronic element, for example power regulator or power transistor are elements commonly used in the general electronic installation.Because it consumes large power supply power, therefore, need as fin, get rid of the heat that is produced by some heat abstractors usually, so that power electronic element can operate as normal and life-saving.
Yet, because the design meeting of some circuit board is connected on the electronic component pin on its heat abstractor, therefore, when electronic installation dwindles its inner space because of miniaturization, when the adjacent arrangement of electronic component more than two is arranged again simultaneously, be easy in the production process of circuit board, during as mistake tin stove, because of collision or careless taking and placing contact, cause at ATE, cause short circuit in the energising of F/T and the OQA test and burn wafer.The circuit board that burns gently then keeps in repair and resurveys; Heavy then whole blackboard newspaper gives up, and therefore, often causes the burden of production management.
Summary of the invention
Therefore the purpose of this invention is to provide a kind of heat-proofing insulating shield sleeve, make two heat abstractors adjacent and that be connected with a pin of power transistor respectively can not produce contact short circuit and burn wafer.
For achieving the above object, the invention provides a circuit board, this circuit board has the power transistor of a plurality of adjacent arrangements, and wherein, these transistorized segment polarity pins are connected electrically on its heat abstractor.One heat-proofing insulating shield sleeve of making according to the heat abstractor external form is placed on the heat abstractor with machinery or manual type, uses the location that produces insulating effect and keep heat abstractor with adjacent heat abstractor.
According to heat-proofing insulating shield sleeve provided by the invention can be the simplest and easy and effective and efficient manner allow and have electrical power transistor heat abstractor and can not contact and produce short circuit.In addition, this heat-proofing insulating shield sleeve can prevent collision or the careless taking and placing in the circuit board making process, allows heat abstractor keep the location in the circuit board making process.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. is described in detail below, wherein
Fig. 1 is power transistor and the heat abstractor that illustrates according to one preferred embodiment of the present invention on circuit board;
Fig. 2 represents heat-proofing insulating shield sleeve according to one preferred embodiment of the present invention;
Fig. 3 is the scheme of installation of heat-proofing insulating shield sleeve according to one preferred embodiment of the present invention; And
Fig. 4 is heat-proofing insulating shield sleeve installation figure according to one preferred embodiment of the present invention.
Embodiment
Fig. 1 illustrates a power transistor and a heat abstractor on circuit board according to one preferred embodiment of the present invention.
As shown in Figure 1, according to the invention provides a circuit board 10.Wherein, on this circuit board 10, be furnished with power transistor 12a, 12b and the 12c of a plurality of adjacent arrangements.Because these power transistors 12a, 12b and 12c consume large power supply power, and for allowing these power transistors 12a, 12b and 12c can operate as normal and life-savings, and must install additional for example is the heat abstractor of fin 14a, 14b, 14c.Wherein, be numbered 12a, a polarity pin of the power transistor of 12b is electrically connected to respectively on fin 14a and the 14b, for example the part transistor drain is connected on this fin 14a, the 14b.
As shown in Figure 2, provide the external form of fin 14a (being presented at Fig. 1) of the preferred embodiment and the heat-proofing insulating shield sleeve 16 made according to the present invention.Because this heat-proofing insulating shield sleeve 16 will be placed on this fin 14a, therefore, the material that it must be selected must can bear that fin 14a distributes aspect heat-resisting hot for use and can not influence its heat dispersion; Aspect insulation, owing to fin 14a has electrically, so its material must have the appropriate insulation performance.That is to say, according to the present invention, heat-proofing insulating shield sleeve must be made according to the external form of heat abstractor, the radiating effect of heat-proofing insulating shield sleeve and the aspects such as insulation effect of heat-proofing insulating shield sleeve, for example can adopt thermal endurance plastic cement or more durable ceramic material.
Shown in Fig. 3 and 4, because this heat-proofing insulating shield sleeve 16 is the shape fabricating according to fin 14a, therefore, this heat-proofing insulating shield sleeve 16 can be simple and easy and directly be arranged to the fin outside of numbering 14a from the top of numbering the fin of 14a with machinery or artificial mode.By this, have electrically and the fin that is numbered 14a and 14b can be isolated and can be produced short circuit because of contact by to be allowed the fin of numbering 14a and 14b by this heat-proofing insulating shield sleeve 16.
This heat-proofing insulating shield sleeve 16 also has and allows fin 14a keep the location in case the inclination that causes because of collision or careless taking and placing in the circuit board making process except playing the high temperature insulation effect.Therefore, can before the circuit board making process begins, be placed on the fin, after finishing, take off recycling then with machinery or artificial mode.So this heat-proofing insulating shield sleeve decapacitation this moment is born outside the temperature of this heat abstractor, also must can bear the tin furnace temperature.
Though the present invention is illustrated in conjunction with a preferred embodiment, so it is not to be used to limit the present invention, for the industry, and without departing from the spirit and scope of the present invention, can do various changes and retouching.
Claims (5)
1. circuit board, this circuit board comprises:
A plurality of power transistors;
A plurality of heat abstractors is characterized in that, these heat abstractors are configured in respectively on the described power transistor; Described circuit board also comprises at least one heat-proofing insulating shield sleeve, and this heat-proofing insulating shield sleeve is configured in the outside of one of two adjacent heat abstractors, uses to prevent that adjacent heat abstractor from producing short circuit because of contact.
2. circuit board as claimed in claim 1 is characterized in that, the heat abstractor that the polarity pin of at least two adjacent power transistors in the described power transistor is corresponding with it connects.
3. the manufacture method of a circuit board comprises:
Insert electronic component on a printed circuit board (PCB), wherein the electronic component of Cha Ruing comprises:
A plurality of power transistors; And
A plurality of heat abstractors, wherein these heat abstractors are configured in respectively on the described power transistor;
Dispose a heat-proofing insulating shield sleeve in the outside of one of two adjacent heat abstractors; And
This printed circuit board (PCB) is sent into a tin stove, make these power transistors be fixed on the described printed circuit board (PCB).
4. the manufacture method of circuit board as claimed in claim 3 is characterized in that, the described heat abstractor that the polarity pin of at least two adjacent power transistors in the described power transistor is corresponding with it is electrically connected.
5. the manufacture method of circuit board as claimed in claim 3 is characterized in that, also comprises taking off this heat-proofing insulating shield sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001010166A CN1167313C (en) | 2000-01-10 | 2000-01-10 | Heat-proofing insulating shield sleeve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001010166A CN1167313C (en) | 2000-01-10 | 2000-01-10 | Heat-proofing insulating shield sleeve |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1304141A CN1304141A (en) | 2001-07-18 |
| CN1167313C true CN1167313C (en) | 2004-09-15 |
Family
ID=4575750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001010166A Expired - Fee Related CN1167313C (en) | 2000-01-10 | 2000-01-10 | Heat-proofing insulating shield sleeve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1167313C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0129043D0 (en) * | 2001-12-05 | 2002-01-23 | Semikron Ltd | Means and methods of circuit component protection |
| JP2022010604A (en) * | 2020-06-29 | 2022-01-17 | 日本電産サンキョー株式会社 | Electronic apparatus |
-
2000
- 2000-01-10 CN CNB001010166A patent/CN1167313C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1304141A (en) | 2001-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1722215A (en) | Display device and driving method thereof | |
| CN100592181C (en) | Recoverable image element structure | |
| US20080123236A1 (en) | Computer apparatus with over-voltage protection function | |
| CN1167313C (en) | Heat-proofing insulating shield sleeve | |
| CN1797784A (en) | Metal oxide semiconductor transistor and method for manufacturing the same | |
| US10197231B2 (en) | Lighting arrangement | |
| CN103775983B (en) | LED manufacture method | |
| CN101754639A (en) | Fixing structure of radiator | |
| TWI249842B (en) | Integrated circuit structure and design method | |
| JP3146870U (en) | Balance transformer and backlight device | |
| TWM443324U (en) | Power supply devices of low temperature led lighting | |
| CN104159393A (en) | High heat dissipation PCB plate | |
| CN206005025U (en) | A kind of PCBA board card keeps in repair preheating apparatus | |
| CN211509412U (en) | Circuit board | |
| CN101361411A (en) | Chip member mounting construction, mounting method and electronic apparatus | |
| KR200453684Y1 (en) | Balance transformer and backlight apparatus | |
| CN220232183U (en) | TFT-LCD display area heating layer static protection structure and display module | |
| CN208210456U (en) | A kind of tool for crossing Reflow Soldering for assembling patch contact pin | |
| CN206674297U (en) | A kind of Novel circuit board | |
| CN204792887U (en) | COB LED module of ceramic honey comb base | |
| CN100426555C (en) | Pixel structure of electroluminescent device and method for manufacturing same | |
| US20070103932A1 (en) | Light module | |
| CN216715882U (en) | High-voltage-resistance light source plate for LED lamp | |
| CN2932081Y (en) | HID electronic ballast having split structure | |
| CN206908947U (en) | Power supply unit and its circuit board export structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |