GB0100958D0 - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number
GB0100958D0
GB0100958D0 GBGB0100958.8A GB0100958A GB0100958D0 GB 0100958 D0 GB0100958 D0 GB 0100958D0 GB 0100958 A GB0100958 A GB 0100958A GB 0100958 D0 GB0100958 D0 GB 0100958D0
Authority
GB
United Kingdom
Prior art keywords
processing apparatus
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0100958.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Surface Technology Systems Ltd
Original Assignee
Surface Technology Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surface Technology Systems Ltd filed Critical Surface Technology Systems Ltd
Priority to GBGB0100958.8A priority Critical patent/GB0100958D0/en
Publication of GB0100958D0 publication Critical patent/GB0100958D0/en
Priority to PCT/GB2002/000115 priority patent/WO2002056333A1/en
Priority to US10/043,265 priority patent/US20020185226A1/en
Priority to EP02710094A priority patent/EP1350260A1/en
Priority to JP2002556905A priority patent/JP4623932B2/en
Priority to KR1020037009324A priority patent/KR100847630B1/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357Generation remote from the workpiece, e.g. down-stream
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422Arrangement for selecting ions or species in the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
GBGB0100958.8A 2000-08-10 2001-01-13 Plasma processing apparatus Ceased GB0100958D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GBGB0100958.8A GB0100958D0 (en) 2001-01-13 2001-01-13 Plasma processing apparatus
PCT/GB2002/000115 WO2002056333A1 (en) 2001-01-13 2002-01-14 Plasma processing apparatus
US10/043,265 US20020185226A1 (en) 2000-08-10 2002-01-14 Plasma processing apparatus
EP02710094A EP1350260A1 (en) 2001-01-13 2002-01-14 Plasma processing apparatus
JP2002556905A JP4623932B2 (en) 2001-01-13 2002-01-14 Plasma processing equipment
KR1020037009324A KR100847630B1 (en) 2001-01-13 2002-01-14 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0100958.8A GB0100958D0 (en) 2001-01-13 2001-01-13 Plasma processing apparatus

Publications (1)

Publication Number Publication Date
GB0100958D0 true GB0100958D0 (en) 2001-02-28

Family

ID=9906801

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0100958.8A Ceased GB0100958D0 (en) 2000-08-10 2001-01-13 Plasma processing apparatus

Country Status (5)

Country Link
EP (1) EP1350260A1 (en)
JP (1) JP4623932B2 (en)
KR (1) KR100847630B1 (en)
GB (1) GB0100958D0 (en)
WO (1) WO2002056333A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0323001D0 (en) 2003-10-01 2003-11-05 Oxford Instr Plasma Technology Apparatus and method for plasma treating a substrate
KR20070065684A (en) * 2005-12-20 2007-06-25 주식회사 케이씨텍 Antenna for generating plasma and manufacturing method of the same, plasma processing apparatus of the same
RU2523773C2 (en) 2009-05-13 2014-07-20 СиО2 Медикал Продактс, Инк., Gas release process for inspection of coated surfaces
WO2013170052A1 (en) 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
KR101028215B1 (en) * 2010-09-28 2011-04-11 송웅섭 Plasma generation apparatus
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
US9554968B2 (en) 2013-03-11 2017-01-31 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging
JP6095678B2 (en) 2011-11-11 2017-03-15 エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド Passivation, pH protection or slippery coatings for pharmaceutical packages, coating processes and equipment
JP6509734B2 (en) 2012-11-01 2019-05-08 エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド Film inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
WO2014085348A2 (en) 2012-11-30 2014-06-05 Sio2 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
US20160017490A1 (en) 2013-03-15 2016-01-21 Sio2 Medical Products, Inc. Coating method
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
US11077233B2 (en) 2015-08-18 2021-08-03 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
US10854448B2 (en) 2017-01-31 2020-12-01 Tohoku University Plasma generating device, plasma sputtering device, and plasma sputtering method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100255703B1 (en) * 1991-06-27 2000-05-01 조셉 제이. 스위니 Device of plasma using electromagnetic rf
DE69226253T2 (en) * 1992-01-24 1998-12-17 Applied Materials, Inc., Santa Clara, Calif. Plasma etching process and reactor for plasma processing
JP2625072B2 (en) * 1992-09-08 1997-06-25 アプライド マテリアルズ インコーポレイテッド Plasma reactor using electromagnetic RF coupling and method thereof
JP3234321B2 (en) * 1993-01-11 2001-12-04 三菱電機株式会社 Method of using plasma reactor, plasma processing method of substrate, and method of manufacturing semiconductor device using the processing method
JP3365067B2 (en) * 1994-02-10 2003-01-08 ソニー株式会社 Plasma apparatus and plasma processing method using the same
JPH08288259A (en) * 1995-04-18 1996-11-01 Sony Corp Helicon plasma system and dry etching method using the same
US5910221A (en) * 1997-06-18 1999-06-08 Applied Materials, Inc. Bonded silicon carbide parts in a plasma reactor
JPH11135297A (en) * 1997-10-31 1999-05-21 Kumagai Hiromi Plasma generator
KR100829288B1 (en) * 1998-12-11 2008-05-13 서페이스 테크놀로지 시스템스 피엘씨 Plasma processing apparatus

Also Published As

Publication number Publication date
JP2004523890A (en) 2004-08-05
KR100847630B1 (en) 2008-07-21
EP1350260A1 (en) 2003-10-08
JP4623932B2 (en) 2011-02-02
WO2002056333A1 (en) 2002-07-18
KR20030079948A (en) 2003-10-10

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)