AU2003252470A1 - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number
AU2003252470A1
AU2003252470A1 AU2003252470A AU2003252470A AU2003252470A1 AU 2003252470 A1 AU2003252470 A1 AU 2003252470A1 AU 2003252470 A AU2003252470 A AU 2003252470A AU 2003252470 A AU2003252470 A AU 2003252470A AU 2003252470 A1 AU2003252470 A1 AU 2003252470A1
Authority
AU
Australia
Prior art keywords
processing apparatus
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003252470A
Inventor
Tsutomu Higashiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003252470A1 publication Critical patent/AU2003252470A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
AU2003252470A 2002-07-03 2003-07-03 Plasma processing apparatus Abandoned AU2003252470A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002194431A JP4127488B2 (en) 2002-07-03 2002-07-03 Plasma processing equipment
JP2002-194431 2002-07-03
PCT/JP2003/008494 WO2004006320A1 (en) 2002-07-03 2003-07-03 Plasma processing apparatus

Publications (1)

Publication Number Publication Date
AU2003252470A1 true AU2003252470A1 (en) 2004-01-23

Family

ID=30112304

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003252470A Abandoned AU2003252470A1 (en) 2002-07-03 2003-07-03 Plasma processing apparatus

Country Status (3)

Country Link
JP (1) JP4127488B2 (en)
AU (1) AU2003252470A1 (en)
WO (1) WO2004006320A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4904202B2 (en) * 2006-05-22 2012-03-28 ジーイーエヌ カンパニー リミッテッド Plasma reactor
TW201325326A (en) * 2011-10-05 2013-06-16 Applied Materials Inc Plasma processing apparatus and substrate support assembly thereof
CN110098138B (en) * 2013-09-25 2023-07-18 Ev 集团 E·索尔纳有限责任公司 Apparatus and method for bonding substrates
JP5850581B2 (en) 2013-11-29 2016-02-03 株式会社京三製作所 Plasma non-ignition state discrimination device and plasma non-ignition discrimination method
JP6574547B2 (en) 2013-12-12 2019-09-11 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
KR102352739B1 (en) * 2014-04-09 2022-01-17 어플라이드 머티어리얼스, 인코포레이티드 Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductance
JP6638031B2 (en) * 2018-07-30 2020-01-29 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Apparatus and method for bonding substrates
JP7308330B2 (en) * 2021-05-10 2023-07-13 ピコサン オーワイ Substrate processing apparatus and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2593282Y2 (en) * 1992-11-10 1999-04-05 株式会社島津製作所 Plasma CVD equipment
JP3425009B2 (en) * 1995-05-30 2003-07-07 アネルバ株式会社 Surface treatment equipment
JP3396399B2 (en) * 1997-06-26 2003-04-14 シャープ株式会社 Electronic device manufacturing equipment
JP3377773B2 (en) * 2000-03-24 2003-02-17 三菱重工業株式会社 Power supply method to discharge electrode, high-frequency plasma generation method, and semiconductor manufacturing method
JP2002110566A (en) * 2000-10-02 2002-04-12 Mitsubishi Heavy Ind Ltd High frequency plasma generator
JP3847581B2 (en) * 2001-06-29 2006-11-22 アルプス電気株式会社 Plasma processing apparatus and plasma processing system

Also Published As

Publication number Publication date
JP4127488B2 (en) 2008-07-30
JP2004039844A (en) 2004-02-05
WO2004006320A1 (en) 2004-01-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase