FR3144697A1 - Process for manufacturing an image sensor - Google Patents
Process for manufacturing an image sensor Download PDFInfo
- Publication number
- FR3144697A1 FR3144697A1 FR2214569A FR2214569A FR3144697A1 FR 3144697 A1 FR3144697 A1 FR 3144697A1 FR 2214569 A FR2214569 A FR 2214569A FR 2214569 A FR2214569 A FR 2214569A FR 3144697 A1 FR3144697 A1 FR 3144697A1
- Authority
- FR
- France
- Prior art keywords
- cavities
- sensitive
- visible light
- manufacturing
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011241 protective layer Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14694—The active layers comprising only AIIIBV compounds, e.g. GaAs, InP
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
L’invention concerne un procédé de fabrication d’un capteur d’image pour la détection de la lumière visible et des rayons infrarouges à ondes courtes, caractérisé en ce qu’il comprend les étapes suivantes : fourniture d’un substrat support (1, 1’) comprenant un premier matériau semiconducteur ;formation, dans le substrat support (1, 1’), de cavités (5) afin de définir des pixels (11, 11’) sensibles à la lumière visible dans le premier matériau semiconducteur entre lesdites cavités (5) ;formation d’une couche protectrice (4) électriquement isolante au moins sur les surfaces latérales de chaque pixel (11, 11’) sensible à la lumière visible ; croissance, dans les cavités (5), d’un second matériau, différent du premier matériau, de sorte à former des pixels (12, 12’) sensibles aux rayons infrarouges à ondes courtes Figure d’abrégé : Figure 4fThe invention relates to a method for manufacturing an image sensor for detecting visible light and short-wave infrared rays, characterized in that it comprises the following steps: providing a support substrate (1, 1') comprising a first semiconductor material; formation, in the support substrate (1, 1'), of cavities (5) in order to define pixels (11, 11') sensitive to visible light in the first semiconductor material between said cavities (5);formation of an electrically insulating protective layer (4) at least on the side surfaces of each pixel (11, 11') sensitive to visible light; growth, in the cavities (5), of a second material, different from the first material, so as to form pixels (12, 12') sensitive to short-wave infrared rays Abstract figure: Figure 4f
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2214569A FR3144697A1 (en) | 2022-12-28 | 2022-12-28 | Process for manufacturing an image sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2214569A FR3144697A1 (en) | 2022-12-28 | 2022-12-28 | Process for manufacturing an image sensor |
FR2214569 | 2022-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR3144697A1 true FR3144697A1 (en) | 2024-07-05 |
Family
ID=86657658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2214569A Pending FR3144697A1 (en) | 2022-12-28 | 2022-12-28 | Process for manufacturing an image sensor |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3144697A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015048304A2 (en) | 2013-09-25 | 2015-04-02 | Princeton Infrared Technologies, Inc. | LOW NOISE InGaAs PHOTODIODE ARRAY |
US20170040362A1 (en) * | 2015-08-04 | 2017-02-09 | Artilux Corporation | Germanium-silicon light sensing apparatus |
US20210391378A1 (en) * | 2020-06-15 | 2021-12-16 | Taiwan Semiconductor Manufacturing Company Limited | Image sensor device and methods of forming the same |
US20220320173A1 (en) * | 2021-03-30 | 2022-10-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reduced cross-talk in color and infrared image sensor |
-
2022
- 2022-12-28 FR FR2214569A patent/FR3144697A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015048304A2 (en) | 2013-09-25 | 2015-04-02 | Princeton Infrared Technologies, Inc. | LOW NOISE InGaAs PHOTODIODE ARRAY |
US20170040362A1 (en) * | 2015-08-04 | 2017-02-09 | Artilux Corporation | Germanium-silicon light sensing apparatus |
US20210391378A1 (en) * | 2020-06-15 | 2021-12-16 | Taiwan Semiconductor Manufacturing Company Limited | Image sensor device and methods of forming the same |
US20220320173A1 (en) * | 2021-03-30 | 2022-10-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reduced cross-talk in color and infrared image sensor |
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