FR3134021B1 - Procédé de soudage par ultrasons - Google Patents

Procédé de soudage par ultrasons Download PDF

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Publication number
FR3134021B1
FR3134021B1 FR2202825A FR2202825A FR3134021B1 FR 3134021 B1 FR3134021 B1 FR 3134021B1 FR 2202825 A FR2202825 A FR 2202825A FR 2202825 A FR2202825 A FR 2202825A FR 3134021 B1 FR3134021 B1 FR 3134021B1
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France
Prior art keywords
ultrasonic welding
substrate
welding process
nanoporous film
kpa
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Active
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FR2202825A
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English (en)
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FR3134021A1 (fr
Inventor
Rabih Khazaka
Rémi Daudin
Didier Bouvard
Jean-Michel Missiaen
Lucas Chachay
Jean-Yves Hihn
Jonathan Schoenleber
Marie-Pierre Gigandet
Goulven Janod
Stéphane Joseph Azzopardi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Institut Polytechnique de Grenoble
Safran SA
Universite de Franche-Comte
Universite Grenoble Alpes
Original Assignee
Centre National de la Recherche Scientifique CNRS
Institut Polytechnique de Grenoble
Safran SA
Universite de Franche-Comte
Universite Grenoble Alpes
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Application filed by Centre National de la Recherche Scientifique CNRS, Institut Polytechnique de Grenoble, Safran SA, Universite de Franche-Comte, Universite Grenoble Alpes filed Critical Centre National de la Recherche Scientifique CNRS
Priority to FR2202825A priority Critical patent/FR3134021B1/fr
Publication of FR3134021A1 publication Critical patent/FR3134021A1/fr
Application granted granted Critical
Publication of FR3134021B1 publication Critical patent/FR3134021B1/fr
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27Manufacturing methods
    • H01L2224/271Manufacture and pre-treatment of the layer connector preform
    • H01L2224/2711Shaping
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    • H01L2224/27Manufacturing methods
    • H01L2224/273Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2733Manufacturing methods by local deposition of the material of the layer connector in solid form
    • H01L2224/27334Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
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    • H01L2224/29117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
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    • H01L2224/832Applying energy for connecting
    • H01L2224/83201Compression bonding
    • H01L2224/83205Ultrasonic bonding
    • H01L2224/83207Thermosonic bonding
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    • H01L2224/838Bonding techniques
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Procédé de soudage par ultrasons L’invention concerne un procédé d’assemblage d’un objet (13) à un substrat (11) comprenant les étapes suivantes : Le dépôt d’un film nanoporeux entre une surface d’au moins un substrat et au moins une surface d’un objet ; L’application conjointe d’une pression comprise entre 100 kPa et 10 MPa appliquée perpendiculairement au film nanoporeux et d’un signal ultrason, pour former une soudure (12) entre l’objet et le substrat du film nanoporeux. Figure pour l’abrégé : Fig. 1
FR2202825A 2022-03-29 2022-03-29 Procédé de soudage par ultrasons Active FR3134021B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2202825A FR3134021B1 (fr) 2022-03-29 2022-03-29 Procédé de soudage par ultrasons

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2202825 2022-03-29
FR2202825A FR3134021B1 (fr) 2022-03-29 2022-03-29 Procédé de soudage par ultrasons

Publications (2)

Publication Number Publication Date
FR3134021A1 FR3134021A1 (fr) 2023-10-06
FR3134021B1 true FR3134021B1 (fr) 2024-05-31

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FR2202825A Active FR3134021B1 (fr) 2022-03-29 2022-03-29 Procédé de soudage par ultrasons

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Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747846A1 (de) * 1997-10-30 1999-05-06 Daimler Benz Ag Bauelement und Verfahren zum Herstellen des Bauelements
WO2007034893A1 (fr) * 2005-09-22 2007-03-29 Nihon Handa Co., Ltd. Composition particulaire metallique pateuse, son procede de durcissement, procede de liaison d'un element metallique, processus de production de carte imprimee
DE102007055017B4 (de) * 2007-11-14 2010-11-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Verbinden zweier Fügeflächen und Bauteil mit zwei verbundenen Fügeflächen

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