FR3131075B1 - Structure semi-conductrice en nitrure du groupe iii sur silicium sur isolant et son procédé de croissance - Google Patents
Structure semi-conductrice en nitrure du groupe iii sur silicium sur isolant et son procédé de croissance Download PDFInfo
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- FR3131075B1 FR3131075B1 FR2113655A FR2113655A FR3131075B1 FR 3131075 B1 FR3131075 B1 FR 3131075B1 FR 2113655 A FR2113655 A FR 2113655A FR 2113655 A FR2113655 A FR 2113655A FR 3131075 B1 FR3131075 B1 FR 3131075B1
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- nitride semiconductor
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- 229910052710 silicon Inorganic materials 0.000 title abstract 5
- 239000010703 silicon Substances 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000009413 insulation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 5
- 239000012212 insulator Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000005533 two-dimensional electron gas Effects 0.000 abstract 1
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- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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Abstract
L’invention porte sur une structure semi-conductrice (1) comprenant : − un substrat de Silicium sur Isolant (101) comprenant : o une couche de base de silicium (10) ; o une couche intermédiaire (11) sur ladite couche de base (10) et comprenant : une couche riche en pièges (111) ; et un isolant enterré (121) sur la couche riche en pièges (111) ; et o une couche supérieure de silicium dopé de type n (12) sur ladite couche intermédiaire (11) ; et − un empilement (202) de couches semi-conductrices III-N épitaxiales sur ledit substrat (101) de Silicium sur Isolant, comprenant : o une première couche III-N active (21) sur ladite couche supérieure (12) ; o une deuxième couche III-N active (22) sur ladite première couche III-N active (21) ; avec un Gaz d’Electrons bidimensionnel (200) entre ladite première couche III-N active (21) et ladite deuxième couche III-N active (22). Figure à publier avec l’abrégé : Fig. 3
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2113655A FR3131075B1 (fr) | 2021-12-16 | 2021-12-16 | Structure semi-conductrice en nitrure du groupe iii sur silicium sur isolant et son procédé de croissance |
PCT/EP2022/082085 WO2023110267A1 (fr) | 2021-12-16 | 2022-11-16 | Structure semi-conductrice au nitrure du groupe iii sur silicium sur isolant et son procédé de croissance |
TW111144574A TW202341486A (zh) | 2021-12-16 | 2022-11-22 | 絕緣體上矽上的ⅲ族氮化物半導體結構及其生長方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2113655A FR3131075B1 (fr) | 2021-12-16 | 2021-12-16 | Structure semi-conductrice en nitrure du groupe iii sur silicium sur isolant et son procédé de croissance |
FR2113655 | 2021-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3131075A1 FR3131075A1 (fr) | 2023-06-23 |
FR3131075B1 true FR3131075B1 (fr) | 2023-12-22 |
Family
ID=81648394
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Application Number | Title | Priority Date | Filing Date |
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FR2113655A Active FR3131075B1 (fr) | 2021-12-16 | 2021-12-16 | Structure semi-conductrice en nitrure du groupe iii sur silicium sur isolant et son procédé de croissance |
Country Status (3)
Country | Link |
---|---|
FR (1) | FR3131075B1 (fr) |
TW (1) | TW202341486A (fr) |
WO (1) | WO2023110267A1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7999288B2 (en) * | 2007-11-26 | 2011-08-16 | International Rectifier Corporation | High voltage durability III-nitride semiconductor device |
JP5117588B2 (ja) * | 2010-09-07 | 2013-01-16 | 株式会社東芝 | 窒化物半導体結晶層の製造方法 |
JP5903818B2 (ja) * | 2011-09-26 | 2016-04-13 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US9721969B2 (en) * | 2015-06-30 | 2017-08-01 | Globalfoundries Singapore Pte. Ltd. | Creation of wide band gap material for integration to SOI thereof |
US10644142B2 (en) * | 2017-12-22 | 2020-05-05 | Nxp Usa, Inc. | Semiconductor devices with doped regions functioning as enhanced resistivity regions or diffusion barriers, and methods of fabrication therefor |
-
2021
- 2021-12-16 FR FR2113655A patent/FR3131075B1/fr active Active
-
2022
- 2022-11-16 WO PCT/EP2022/082085 patent/WO2023110267A1/fr unknown
- 2022-11-22 TW TW111144574A patent/TW202341486A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023110267A1 (fr) | 2023-06-22 |
TW202341486A (zh) | 2023-10-16 |
FR3131075A1 (fr) | 2023-06-23 |
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