FR3116945B1 - Montage electronique avec source lumineuse pour vehicule automobile - Google Patents

Montage electronique avec source lumineuse pour vehicule automobile Download PDF

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Publication number
FR3116945B1
FR3116945B1 FR2012296A FR2012296A FR3116945B1 FR 3116945 B1 FR3116945 B1 FR 3116945B1 FR 2012296 A FR2012296 A FR 2012296A FR 2012296 A FR2012296 A FR 2012296A FR 3116945 B1 FR3116945 B1 FR 3116945B1
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Prior art keywords
electronic assembly
electronic
protective layer
motor vehicle
light
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FR2012296A
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FR3116945A1 (fr
Inventor
Arnaud Robert
Patrick Chini
Sebastien Roels
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Valeo Vision SAS
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Valeo Vision SAS
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Priority to FR2012296A priority Critical patent/FR3116945B1/fr
Publication of FR3116945A1 publication Critical patent/FR3116945A1/fr
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L’invention propose un montage électronique (2) de véhicule automobile exposé au rayonnement solaire. Le montage électronique comprend un substrat (8) avec un circuit électronique (10), un composant électronique (14) telle une diode électroluminescente (LED), une connexion filaire point à point comprenant deux extrémités et connectant électriquement le composant électronique au substrat. Le montage électronique comporte en outre une couche de protection aux extrémités de la connexion filaire afin de les protéger de la corrosion. La couche de protection comprend un coefficient d’Albedo supérieur ou égal à 0.4. La couche de protection comprend un matériau au moins partiellement organique, tel un hybride époxyde siloxane. L’invention propose également un dispositif lumineux avec une lentille focalisant la lumière du soleil sur la couche de protection, qui en retour, renvoie ladite lumière. L’invention offre également un procédé de fabrication d’un montage électronique (2). Figure pour l’abrégé : Fig. 1
FR2012296A 2020-11-27 2020-11-27 Montage electronique avec source lumineuse pour vehicule automobile Active FR3116945B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2012296A FR3116945B1 (fr) 2020-11-27 2020-11-27 Montage electronique avec source lumineuse pour vehicule automobile

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2012296A FR3116945B1 (fr) 2020-11-27 2020-11-27 Montage electronique avec source lumineuse pour vehicule automobile
FR2012296 2020-11-27

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FR3116945A1 FR3116945A1 (fr) 2022-06-03
FR3116945B1 true FR3116945B1 (fr) 2023-10-27

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032885A (ja) * 2003-11-18 2006-02-02 Sharp Corp 光源装置およびそれを用いた光通信装置
DE102010027253B4 (de) * 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
WO2013073181A1 (fr) * 2011-11-15 2013-05-23 パナソニック株式会社 Module électroluminescent et lampe utilisant ledit module
JP2016018960A (ja) 2014-07-10 2016-02-01 エムテックスマート株式会社 Ｌｅｄの製造方法及びｌｅｄ

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