FR3112450B1 - Boitier électronique comportant un composant à refroidir et procédé de montage associé - Google Patents

Boitier électronique comportant un composant à refroidir et procédé de montage associé Download PDF

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Publication number
FR3112450B1
FR3112450B1 FR2007159A FR2007159A FR3112450B1 FR 3112450 B1 FR3112450 B1 FR 3112450B1 FR 2007159 A FR2007159 A FR 2007159A FR 2007159 A FR2007159 A FR 2007159A FR 3112450 B1 FR3112450 B1 FR 3112450B1
Authority
FR
France
Prior art keywords
radiator
component
fixed
cooled
electronic box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2007159A
Other languages
English (en)
Other versions
FR3112450A1 (fr
Inventor
Jean-Philippe Bekaert
Roy Gilles Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive Technologies GmbH
Original Assignee
Continental Automotive France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive France SAS filed Critical Continental Automotive France SAS
Priority to FR2007159A priority Critical patent/FR3112450B1/fr
Priority to US18/012,350 priority patent/US11856734B2/en
Priority to CN202180048597.5A priority patent/CN115836595A/zh
Priority to PCT/EP2021/068751 priority patent/WO2022008558A1/fr
Publication of FR3112450A1 publication Critical patent/FR3112450A1/fr
Application granted granted Critical
Publication of FR3112450B1 publication Critical patent/FR3112450B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente divulgation concerne un ensemble d’éléments de boitier électronique (1) destinés à être montés sur une carte électronique (4) comportant un composant (5) à refroidir comprenant:* un châssis (2),* un radiateur (7) fixé par une pièce de maintien (9) à l’intérieur du châssis (2), * un capot (3) configuré pour être fixé sur le châssis (2) de manière à maintenir la carte électronique (4) dans le boitier (1).Le radiateur (7) est configuré pour être fixé sur la carte électronique (4) en maintenant une distance prédéterminée entre une face inférieure du radiateur (7) et le composant (5), et le capot (3) est configuré pour pouvoir être fixé par un point de fixation au radiateur (7). La pièce de maintien (9) est reliée au radiateur (7) de façon à permettre une translation du radiateur (7) par rapport au châssis (2) selon trois directions orthogonales. Figure de l’abrégé : Figure 1
FR2007159A 2020-07-07 2020-07-07 Boitier électronique comportant un composant à refroidir et procédé de montage associé Active FR3112450B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2007159A FR3112450B1 (fr) 2020-07-07 2020-07-07 Boitier électronique comportant un composant à refroidir et procédé de montage associé
US18/012,350 US11856734B2 (en) 2020-07-07 2021-07-07 Electronic package comprising a component to be cooled and associated mounting method
CN202180048597.5A CN115836595A (zh) 2020-07-07 2021-07-07 包括待冷却部件的电子封装和相关联的安装方法
PCT/EP2021/068751 WO2022008558A1 (fr) 2020-07-07 2021-07-07 Boitier électronique comportant un composant à refroidir et procédé de montage associé

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2007159A FR3112450B1 (fr) 2020-07-07 2020-07-07 Boitier électronique comportant un composant à refroidir et procédé de montage associé
FR2007159 2020-07-07

Publications (2)

Publication Number Publication Date
FR3112450A1 FR3112450A1 (fr) 2022-01-14
FR3112450B1 true FR3112450B1 (fr) 2022-06-03

Family

ID=72801674

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2007159A Active FR3112450B1 (fr) 2020-07-07 2020-07-07 Boitier électronique comportant un composant à refroidir et procédé de montage associé

Country Status (4)

Country Link
US (1) US11856734B2 (fr)
CN (1) CN115836595A (fr)
FR (1) FR3112450B1 (fr)
WO (1) WO2022008558A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
US20060060328A1 (en) * 2004-09-21 2006-03-23 Ingo Ewes Heat-transfer devices
US8295050B2 (en) * 2010-11-05 2012-10-23 Portwell Inc. Dual CPU and heat dissipating structure thereof
FR2995172B1 (fr) * 2012-09-06 2015-11-20 Sagemcom Broadband Sas Equipement electronique a refroidissement par air et dispositif de refroidissement d'un composant electronique
US9750126B2 (en) * 2012-10-22 2017-08-29 Thomson Licensing Electronic device with combination heat sink/blower or fan assembly having air duct
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US10721840B2 (en) * 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly

Also Published As

Publication number Publication date
CN115836595A (zh) 2023-03-21
FR3112450A1 (fr) 2022-01-14
WO2022008558A1 (fr) 2022-01-13
US20230232591A1 (en) 2023-07-20
US11856734B2 (en) 2023-12-26

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Owner name: CONTINENTAL AUTOMOTIVE TECHNOLOGIES GMBH, DE

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