FR3096864B1 - Montage avec transistors bipolaires et procede d’assemblage - Google Patents

Montage avec transistors bipolaires et procede d’assemblage Download PDF

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Publication number
FR3096864B1
FR3096864B1 FR1905626A FR1905626A FR3096864B1 FR 3096864 B1 FR3096864 B1 FR 3096864B1 FR 1905626 A FR1905626 A FR 1905626A FR 1905626 A FR1905626 A FR 1905626A FR 3096864 B1 FR3096864 B1 FR 3096864B1
Authority
FR
France
Prior art keywords
electrical
assembly
cooler
heat dissipation
dissipation portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1905626A
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English (en)
Other versions
FR3096864A1 (fr
Inventor
Alexandre Korbaa
Pierre Placais
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Priority to FR1905626A priority Critical patent/FR3096864B1/fr
Publication of FR3096864A1 publication Critical patent/FR3096864A1/fr
Application granted granted Critical
Publication of FR3096864B1 publication Critical patent/FR3096864B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

L’invention propose un montage électrique (101), notamment pour dispositif lumineux de véhicule automobile, le montage électrique comprenant : un substrat (102) avec une portion de dissipation thermique (112), et un transistor bipolaire (106) comprenant un corps, trois connecteurs électriques et un refroidisseur (114) au potentiel électrique de l’un des trois connecteurs électriques, ledit un des trois connecteurs électriques étant notamment un connecteur de collecteur, une jonction thermique (116) entre la portion de dissipation thermique et le refroidisseur. La jonction thermique (116) comprend des moyens d’isolation électrique (118) internes ou externes au corps. Les moyens d’isolation électrique (118) sont configurés pour isoler électriquement le refroidisseur (114) de la portion de dissipation thermique (112). L’invention propose également un dispositif lumineux pour véhicule automobile, et un procédé d’assemblage d’un montage électrique avec un transistor bipolaire refroidi par une plage de dissipation en contact d’une quatrième patte. Figure pour l’abrégé : figure 3
FR1905626A 2019-05-28 2019-05-28 Montage avec transistors bipolaires et procede d’assemblage Active FR3096864B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1905626A FR3096864B1 (fr) 2019-05-28 2019-05-28 Montage avec transistors bipolaires et procede d’assemblage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1905626A FR3096864B1 (fr) 2019-05-28 2019-05-28 Montage avec transistors bipolaires et procede d’assemblage
FR1905626 2019-05-28

Publications (2)

Publication Number Publication Date
FR3096864A1 FR3096864A1 (fr) 2020-12-04
FR3096864B1 true FR3096864B1 (fr) 2022-08-05

Family

ID=69172826

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1905626A Active FR3096864B1 (fr) 2019-05-28 2019-05-28 Montage avec transistors bipolaires et procede d’assemblage

Country Status (1)

Country Link
FR (1) FR3096864B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147467A (ja) * 1993-11-25 1995-06-06 Hitachi Ltd 電子部品の放熱方法
JP6073637B2 (ja) * 2012-10-18 2017-02-01 株式会社小糸製作所 電子ユニット
CN106416447A (zh) * 2015-01-22 2017-02-15 华为技术有限公司 一种小尺寸器件的散热装置和电路板散热系统
JP6686467B2 (ja) * 2016-01-22 2020-04-22 株式会社Ihi 電子部品放熱構造
JP6941989B2 (ja) * 2017-07-04 2021-09-29 Ａｓｔｉ株式会社 半導体取付構造と充電器

Also Published As

Publication number Publication date
FR3096864A1 (fr) 2020-12-04

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