FR3089055B1 - Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré. - Google Patents

Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré. Download PDF

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Publication number
FR3089055B1
FR3089055B1 FR1871795A FR1871795A FR3089055B1 FR 3089055 B1 FR3089055 B1 FR 3089055B1 FR 1871795 A FR1871795 A FR 1871795A FR 1871795 A FR1871795 A FR 1871795A FR 3089055 B1 FR3089055 B1 FR 3089055B1
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France
Prior art keywords
integrated circuit
flexible
carrier
module
manufacturing
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Active
Application number
FR1871795A
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English (en)
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FR3089055A1 (fr
Inventor
Simon Vassal
Didier Courtecuisse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
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Linxens Holding SAS
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Publication date
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Priority to FR1871795A priority Critical patent/FR3089055B1/fr
Priority to PCT/FR2019/052797 priority patent/WO2020104759A1/fr
Publication of FR3089055A1 publication Critical patent/FR3089055A1/fr
Application granted granted Critical
Publication of FR3089055B1 publication Critical patent/FR3089055B1/fr
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
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    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L’invention concerne un procédé de fabrication d’un support (2) flexible de circuit intégré (7). Ce procédé comprend la réalisation d’au moins une cavité (12) sur la première face principale (13a) d’une feuille de matériau conducteur (13), préalablement à la fixation d’au moins un circuit intégré (7) dans cette cavité (12). L’invention concerne également un support (2) flexible de circuit intégré (7) réalisé selon ce procédé et un module comprenant un support (2) et un circuit intégré (7) logé dans la cavité (12). Figure à publier avec l’abrégé : Fig 4
FR1871795A 2018-11-23 2018-11-23 Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré. Active FR3089055B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1871795A FR3089055B1 (fr) 2018-11-23 2018-11-23 Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré.
PCT/FR2019/052797 WO2020104759A1 (fr) 2018-11-23 2019-11-25 Procédé de fabrication d'un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1871795A FR3089055B1 (fr) 2018-11-23 2018-11-23 Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré.

Publications (2)

Publication Number Publication Date
FR3089055A1 FR3089055A1 (fr) 2020-05-29
FR3089055B1 true FR3089055B1 (fr) 2021-08-27

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Application Number Title Priority Date Filing Date
FR1871795A Active FR3089055B1 (fr) 2018-11-23 2018-11-23 Procédé de fabrication d’un support flexible de circuit intégré, support flexible de circuit intégré, module comprenant un support flexible et un circuit intégré.

Country Status (2)

Country Link
FR (1) FR3089055B1 (fr)
WO (1) WO2020104759A1 (fr)

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US6585905B1 (en) * 1998-06-10 2003-07-01 Asat Ltd. Leadless plastic chip carrier with partial etch die attach pad
US6452255B1 (en) * 2000-03-20 2002-09-17 National Semiconductor, Corp. Low inductance leadless package
JP2006253732A (ja) * 2000-12-28 2006-09-21 Renesas Technology Corp 半導体装置
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