FR3062546B1 - Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci - Google Patents
Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci Download PDFInfo
- Publication number
- FR3062546B1 FR3062546B1 FR1750852A FR1750852A FR3062546B1 FR 3062546 B1 FR3062546 B1 FR 3062546B1 FR 1750852 A FR1750852 A FR 1750852A FR 1750852 A FR1750852 A FR 1750852A FR 3062546 B1 FR3062546 B1 FR 3062546B1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- manufacturing
- diffraction structure
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/024—Hologram nature or properties
- G03H1/0244—Surface relief holograms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/32—Holograms used as optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2260/00—Recording materials or recording processes
- G03H2260/50—Reactivity or recording processes
- G03H2260/62—Direct etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2260/00—Recording materials or recording processes
- G03H2260/50—Reactivity or recording processes
- G03H2260/63—Indirect etching, e.g. lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Transmitters (AREA)
Abstract
La structure de diffraction selon l'invention est intégrée dans une carte de circuit imprimé (1) et comprend une plaque de diffraction (17) formée sur une face extérieure de la carte de circuit imprimé et une cavité (15) formée dans l'épaisseur de la carte de circuit imprimé (1) et située sous la plaque de diffraction. L'invention est applicable pour des dispositifs émetteurs ou récepteurs, des transducteurs, des capteurs, des détecteurs et autres, dans les domaines des micro-ondes, de l'optique et de l'acoustique.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1750852A FR3062546B1 (fr) | 2017-02-01 | 2017-02-01 | Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
CN201880009838.3A CN110383958A (zh) | 2017-02-01 | 2018-01-30 | 包括集成衍射结构的电子印刷电路板及其制造方法 |
US16/480,303 US10912191B2 (en) | 2017-02-01 | 2018-01-30 | Electronic card with printed circuit comprising an integrated diffraction structure and method for the production thereof |
EP18706787.1A EP3578018A1 (fr) | 2017-02-01 | 2018-01-30 | Carte électronique à circuit imprimé comprenant une structure de diffraction integrée et procédé de fabrication de celle-ci |
JP2019541226A JP2020511774A (ja) | 2017-02-01 | 2018-01-30 | 一体化された回折構造を含む印刷回路を伴う電子カード、及びその製造方法 |
PCT/FR2018/050202 WO2018142055A1 (fr) | 2017-02-01 | 2018-01-30 | Carte électronique à circuit imprimé comprenant une structure de diffraction integrée et procédé de fabrication de celle-ci |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1750852 | 2017-02-01 | ||
FR1750852A FR3062546B1 (fr) | 2017-02-01 | 2017-02-01 | Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3062546A1 FR3062546A1 (fr) | 2018-08-03 |
FR3062546B1 true FR3062546B1 (fr) | 2021-09-10 |
Family
ID=59152993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1750852A Active FR3062546B1 (fr) | 2017-02-01 | 2017-02-01 | Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
Country Status (6)
Country | Link |
---|---|
US (1) | US10912191B2 (fr) |
EP (1) | EP3578018A1 (fr) |
JP (1) | JP2020511774A (fr) |
CN (1) | CN110383958A (fr) |
FR (1) | FR3062546B1 (fr) |
WO (1) | WO2018142055A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI812074B (zh) * | 2022-03-16 | 2023-08-11 | 大陸商芯愛科技(南京)有限公司 | 封裝基板及其製法 |
CN114828407A (zh) * | 2022-03-30 | 2022-07-29 | 青岛歌尔智能传感器有限公司 | 一种感光器件和电子设备 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041849A (en) | 1989-12-26 | 1991-08-20 | Xerox Corporation | Multi-discrete-phase Fresnel acoustic lenses and their application to acoustic ink printing |
US6007183A (en) * | 1997-11-25 | 1999-12-28 | Xerox Corporation | Acoustic metal jet fabrication using an inert gas |
US6302524B1 (en) * | 1998-10-13 | 2001-10-16 | Xerox Corporation | Liquid level control in an acoustic droplet emitter |
US6925856B1 (en) * | 2001-11-07 | 2005-08-09 | Edc Biosystems, Inc. | Non-contact techniques for measuring viscosity and surface tension information of a liquid |
KR100580753B1 (ko) * | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
JP2006324398A (ja) * | 2005-05-18 | 2006-11-30 | Ngk Spark Plug Co Ltd | 配線基板 |
KR100827317B1 (ko) * | 2005-09-07 | 2008-05-06 | 삼성전기주식회사 | 연성 기판을 이용한 초소형 광 변조기 모듈 |
US7719170B1 (en) | 2007-01-11 | 2010-05-18 | University Of Southern California | Self-focusing acoustic transducer with fresnel lens |
US8221963B2 (en) * | 2007-12-27 | 2012-07-17 | Seiko Epson Corporation | Method for producing fine structure |
WO2009115946A1 (fr) * | 2008-03-18 | 2009-09-24 | Philips Intellectual Property & Standards Gmbh | Module de capteur optique |
JP5173907B2 (ja) * | 2009-03-25 | 2013-04-03 | トッパン・フォームズ株式会社 | 配線基材の製造方法 |
WO2010122458A1 (fr) * | 2009-04-20 | 2010-10-28 | Koninklijke Philips Electronics N.V. | Textile électroluminescent présentant une couche de diffusion de lumière à transmission optique accrue |
JP2011187108A (ja) * | 2010-03-05 | 2011-09-22 | Hitachi Maxell Ltd | 偏光性回折格子及びその製造方法、並びに、その偏光性回折格子を用いた光ピックアップ装置 |
JP2011210945A (ja) * | 2010-03-30 | 2011-10-20 | Brother Industries Ltd | 多層プリント配線板の製造方法 |
CN102742352B (zh) * | 2010-04-22 | 2016-08-31 | 出光兴产株式会社 | 有机电致发光元件、照明装置及光输出层的形成方法 |
CN103221740B (zh) * | 2010-11-18 | 2015-02-25 | 日本电气株式会社 | 光源单元和具有其的投影显示设备 |
JP4962635B1 (ja) * | 2011-03-15 | 2012-06-27 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
JP6042103B2 (ja) * | 2012-05-30 | 2016-12-14 | ユー・ディー・シー アイルランド リミテッド | 有機電界発光素子 |
KR101420514B1 (ko) * | 2012-10-23 | 2014-07-17 | 삼성전기주식회사 | 전자부품들이 구비된 기판구조 및 전자부품들이 구비된 기판구조의 제조방법 |
EP2802009B1 (fr) * | 2013-05-08 | 2021-03-24 | ams AG | Dispositif d'imagerie intégré pour un rayonnement infrarouge et procédé de production |
EP3783398A1 (fr) * | 2014-05-13 | 2021-02-24 | Toppan Printing Co., Ltd. | Feuille de transfert de structure de diffraction et support l'utilisant pour prévenir la contrefaçon |
DE102014013563A1 (de) * | 2014-09-18 | 2016-03-24 | Plastic Electronic Gmbh | Verfahren zur Herstellung einer bestückt umformbaren, hinterspritzbaren Schaltungsträgereinheit,sowie Schaltungsträgereinheit |
US10091887B2 (en) * | 2015-04-02 | 2018-10-02 | Tactotek Oy | Multi-material structure with embedded electronics |
JP6657941B2 (ja) * | 2015-12-28 | 2020-03-04 | 凸版印刷株式会社 | 液晶積層体、および、液晶積層体の製造方法 |
US10642057B2 (en) * | 2017-07-20 | 2020-05-05 | Benq Materials Corporation | Light redirecting film and method for manufacturing the same |
-
2017
- 2017-02-01 FR FR1750852A patent/FR3062546B1/fr active Active
-
2018
- 2018-01-30 CN CN201880009838.3A patent/CN110383958A/zh active Pending
- 2018-01-30 JP JP2019541226A patent/JP2020511774A/ja active Pending
- 2018-01-30 US US16/480,303 patent/US10912191B2/en active Active
- 2018-01-30 EP EP18706787.1A patent/EP3578018A1/fr not_active Withdrawn
- 2018-01-30 WO PCT/FR2018/050202 patent/WO2018142055A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
US20190373720A1 (en) | 2019-12-05 |
CN110383958A (zh) | 2019-10-25 |
FR3062546A1 (fr) | 2018-08-03 |
US10912191B2 (en) | 2021-02-02 |
WO2018142055A1 (fr) | 2018-08-09 |
EP3578018A1 (fr) | 2019-12-11 |
JP2020511774A (ja) | 2020-04-16 |
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