FR3057261B1 - Capteur micromecanique et son procede de fabrication - Google Patents

Capteur micromecanique et son procede de fabrication Download PDF

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Publication number
FR3057261B1
FR3057261B1 FR1759457A FR1759457A FR3057261B1 FR 3057261 B1 FR3057261 B1 FR 3057261B1 FR 1759457 A FR1759457 A FR 1759457A FR 1759457 A FR1759457 A FR 1759457A FR 3057261 B1 FR3057261 B1 FR 3057261B1
Authority
FR
France
Prior art keywords
manufacturing process
substrate
micromechanical sensor
functional layer
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1759457A
Other languages
English (en)
Other versions
FR3057261A1 (fr
Inventor
Christoph Schelling
Jochen Beintner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR3057261A1 publication Critical patent/FR3057261A1/fr
Application granted granted Critical
Publication of FR3057261B1 publication Critical patent/FR3057261B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0323—Grooves
    • B81B2203/033—Trenches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/017—Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

Capteur micromécanique (100) comportant : un substrat (10), une première couche fonctionnelle (20) installée sur le substrat (10), une seconde couche fonctionnelle (30) installée sur la première couche fonctionnelle (20) et ayant des structures micromécaniques mobiles (31). Une cavité (11) est réalisée dans le substrat (10) en dessous des structures micromécaniques mobiles (31), et - une structure de sillon vertical (40), entoure les structures micromécaniques mobiles (31), et s'étend dans le substrat (10) jusqu'à la cavité (11).
FR1759457A 2016-10-12 2017-10-10 Capteur micromecanique et son procede de fabrication Active FR3057261B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016219807.6A DE102016219807A1 (de) 2016-10-12 2016-10-12 Mikromechanischer Sensor
DE102016219807.6 2016-10-12

Publications (2)

Publication Number Publication Date
FR3057261A1 FR3057261A1 (fr) 2018-04-13
FR3057261B1 true FR3057261B1 (fr) 2021-04-23

Family

ID=60019876

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1759457A Active FR3057261B1 (fr) 2016-10-12 2017-10-10 Capteur micromecanique et son procede de fabrication

Country Status (5)

Country Link
US (1) US10954120B2 (fr)
CN (1) CN109843788B (fr)
DE (1) DE102016219807A1 (fr)
FR (1) FR3057261B1 (fr)
WO (1) WO2018069028A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11231441B2 (en) * 2015-05-15 2022-01-25 Invensense, Inc. MEMS structure for offset minimization of out-of-plane sensing accelerometers
DE102018214113B4 (de) * 2018-08-21 2021-05-06 Robert Bosch Gmbh Verfahren zur Herstellung eines MEMS-Sensors
DE102018222724A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Verfahren zum Herstellen einer dreidimensional stressentkoppelten Substratanordnung
CN110668391B (zh) * 2019-08-27 2023-04-07 华东光电集成器件研究所 一种具有应力释放功能的双端固支板式mems结构
DE102019214261B3 (de) * 2019-09-19 2020-08-20 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches System und mikromechanisches System
DE102023201732A1 (de) 2023-02-27 2024-08-29 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines mikroelektromechanischen Bauelements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3762136B2 (ja) 1998-04-24 2006-04-05 株式会社東芝 半導体装置
DE102004036032A1 (de) 2003-12-16 2005-07-21 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein Halbleiterbauelement, insbesondere ein Membransensor
ATE368863T1 (de) 2004-03-02 2007-08-15 Colibrys S A Mikroelektromechanisches system
NL2000566C2 (nl) * 2007-03-30 2008-10-02 Elmos Advanced Packaging B V Sensorelement en sensorsamenstel met omhulling.
CN103224216B (zh) * 2012-01-31 2016-12-21 台湾积体电路制造股份有限公司 具有衬底通孔的微电子机械系统(mems)结构及其形成方法
EP2871455B1 (fr) * 2013-11-06 2020-03-04 Invensense, Inc. Capteur de pression
DE102014200512B4 (de) * 2014-01-14 2017-06-08 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
DE102014202923A1 (de) * 2014-02-18 2015-08-20 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE102014210945A1 (de) 2014-06-06 2015-12-17 Robert Bosch Gmbh MEMS-Bauelement mit einer Stressentkopplungsstruktur und Bauteil mit einem solchen MEMS-Bauelement

Also Published As

Publication number Publication date
FR3057261A1 (fr) 2018-04-13
US20200048072A1 (en) 2020-02-13
DE102016219807A1 (de) 2018-04-12
CN109843788B (zh) 2023-03-10
US10954120B2 (en) 2021-03-23
WO2018069028A1 (fr) 2018-04-19
CN109843788A (zh) 2019-06-04

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