FR3041860B1 - Appareil pour monter des composants sur un substrat - Google Patents

Appareil pour monter des composants sur un substrat Download PDF

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Publication number
FR3041860B1
FR3041860B1 FR1658082A FR1658082A FR3041860B1 FR 3041860 B1 FR3041860 B1 FR 3041860B1 FR 1658082 A FR1658082 A FR 1658082A FR 1658082 A FR1658082 A FR 1658082A FR 3041860 B1 FR3041860 B1 FR 3041860B1
Authority
FR
France
Prior art keywords
substrate
mounting components
mounting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1658082A
Other languages
English (en)
Other versions
FR3041860A1 (fr
Inventor
Norbert Bilewicz
Hubert Selhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of FR3041860A1 publication Critical patent/FR3041860A1/fr
Application granted granted Critical
Publication of FR3041860B1 publication Critical patent/FR3041860B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/008—Systems specially adapted to form image relays or chained systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/149—Beam splitting or combining systems operating by reflection only using crossed beamsplitting surfaces, e.g. cross-dichroic cubes or X-cubes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Operations Research (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
FR1658082A 2015-09-28 2016-08-31 Appareil pour monter des composants sur un substrat Active FR3041860B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CHCH1401/15 2015-09-28
CH01401/15A CH711570B1 (de) 2015-09-28 2015-09-28 Vorrichtung für die Montage von Bauelementen auf einem Substrat.

Publications (2)

Publication Number Publication Date
FR3041860A1 FR3041860A1 (fr) 2017-03-31
FR3041860B1 true FR3041860B1 (fr) 2018-11-16

Family

ID=58282076

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1658082A Active FR3041860B1 (fr) 2015-09-28 2016-08-31 Appareil pour monter des composants sur un substrat

Country Status (11)

Country Link
US (1) US10288413B2 (fr)
JP (1) JP6881923B2 (fr)
KR (1) KR102491721B1 (fr)
CN (1) CN106559977B (fr)
CH (1) CH711570B1 (fr)
DE (1) DE102016116235B4 (fr)
FR (1) FR3041860B1 (fr)
MX (1) MX365047B (fr)
MY (1) MY178737A (fr)
SG (1) SG10201607243PA (fr)
TW (1) TWI700515B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9929121B2 (en) * 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7299728B2 (ja) * 2019-03-22 2023-06-28 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法
US20220216077A1 (en) * 2021-01-06 2022-07-07 Samsung Electronics Co., Ltd. Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
CN115943483A (zh) * 2021-01-18 2023-04-07 株式会社新川 位置控制装置、位置控制方法、位置控制程序以及接合装置

Family Cites Families (29)

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JPS6163099A (ja) * 1984-09-04 1986-04-01 松下電器産業株式会社 電子部品取付装置
EP0449481B1 (fr) 1990-03-19 1996-01-31 Hitachi, Ltd. Dispositif et méthode de transport de composants
JPH04199600A (ja) * 1990-11-29 1992-07-20 Juki Corp 部品実装装置
US5878484A (en) 1992-10-08 1999-03-09 Tdk Corporation Chip-type circuit element mounting apparatus
JPH07115296A (ja) 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
GB9323978D0 (en) * 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
EP0897657B1 (fr) * 1996-04-23 2002-02-27 Matsushita Electric Industrial Co., Ltd. Appareil de montage de composants electroniques
JP3925986B2 (ja) * 1996-12-16 2007-06-06 富士通株式会社 高さ測定装置及び高さ測定方法
DE19934619A1 (de) 1999-07-23 2001-01-25 Merten Kg Pulsotronic Inspektionsvorrichtung für Bauteile
US20010055069A1 (en) 2000-03-10 2001-12-27 Hudson Edison T. One camera system for component to substrate registration
DE10128111A1 (de) * 2001-06-11 2003-02-20 Bosch Gmbh Robert Vorrichtung zur Montage von Bauelementen auf einem Substrat
JP4684504B2 (ja) * 2001-09-28 2011-05-18 リコーマイクロエレクトロニクス株式会社 物品製造システム
JP4119179B2 (ja) * 2002-07-04 2008-07-16 富士通株式会社 マルチベンダー対応ｓｍｄ搭載システム
EP1588597A1 (fr) 2003-01-14 2005-10-26 Koninklijke Philips Electronics N.V. Machine adaptee pour placer un composant sur un substrat et procede correspondant
US7025244B2 (en) * 2003-02-10 2006-04-11 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP2005101211A (ja) 2003-09-24 2005-04-14 Yamaha Motor Co Ltd 部品認識装置及び同装置を搭載した表面実装機並びに部品試験装置
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JP2007294727A (ja) * 2006-04-26 2007-11-08 I-Pulse Co Ltd 撮像装置およびこれを用いた表面実装機、部品試験装置、ならびにスクリーン印刷装置
JP4796461B2 (ja) * 2006-09-05 2011-10-19 ヤマハ発動機株式会社 実装機の部品管理装置および部品管理方法
KR101353470B1 (ko) 2006-10-09 2014-01-22 삼성테크윈 주식회사 부품 실장기용 부품 인식 장치
NL1032761C2 (nl) 2006-10-27 2008-04-29 Assembleon Bv Inrichting geschikt voor het plaatsen van een component op een substraat.
DE102010013505A1 (de) 2010-03-31 2011-10-06 Rohwedder Ag Vorrichtung zum Erfassen eines sich bewegenden Objektes
JP2012008261A (ja) * 2010-06-23 2012-01-12 Hamamatsu Photonics Kk 画像生成装置
JP5701067B2 (ja) * 2011-01-06 2015-04-15 富士機械製造株式会社 部品補給時の案内装置
JP2014007328A (ja) * 2012-06-26 2014-01-16 Shibuya Kogyo Co Ltd ボンディング装置
JP6120516B2 (ja) * 2012-10-03 2017-04-26 富士機械製造株式会社 部品補給システム
JP6093214B2 (ja) * 2013-03-19 2017-03-08 ヤマハ発動機株式会社 部品実装装置
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.

Also Published As

Publication number Publication date
JP2017069554A (ja) 2017-04-06
CN106559977B (zh) 2020-02-07
MX2016012518A (es) 2017-03-27
FR3041860A1 (fr) 2017-03-31
KR102491721B1 (ko) 2023-01-25
CH711570B1 (de) 2019-02-15
CH711570A1 (en) 2017-03-31
DE102016116235B4 (de) 2021-01-07
CN106559977A (zh) 2017-04-05
SG10201607243PA (en) 2017-04-27
TWI700515B (zh) 2020-08-01
MY178737A (en) 2020-10-20
US20170092613A1 (en) 2017-03-30
JP6881923B2 (ja) 2021-06-02
KR20170037837A (ko) 2017-04-05
US10288413B2 (en) 2019-05-14
MX365047B (es) 2019-03-29
DE102016116235A1 (de) 2017-03-30
TW201721222A (zh) 2017-06-16

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