FR3014614B1 - Machine electrique rotative dotee d'un convertisseur de puissance - Google Patents

Machine electrique rotative dotee d'un convertisseur de puissance Download PDF

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Publication number
FR3014614B1
FR3014614B1 FR1454985A FR1454985A FR3014614B1 FR 3014614 B1 FR3014614 B1 FR 3014614B1 FR 1454985 A FR1454985 A FR 1454985A FR 1454985 A FR1454985 A FR 1454985A FR 3014614 B1 FR3014614 B1 FR 3014614B1
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France
Prior art keywords
switching element
rotor
electric machine
rotary electric
power converter
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Active
Application number
FR1454985A
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English (en)
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FR3014614A1 (fr
Inventor
Masaki Kato
Masahiko Fujita
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of FR3014614A1 publication Critical patent/FR3014614A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
    • H02K9/227—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

L'invention concerne une machine électrique rotative (2) dotée d'un convertisseur de puissance (3) qui comprend un stator (4) ; un rotor (5) ; un capteur qui fournit en sortie un signal de position de rotation (18) du rotor (5) ; un carter (6) qui contient le stator (4) et le rotor (5) ; un module de champ (24) qui est connecté à l'enroulement de rotor (5) ; des modules d'alimentation (23), chacun desquels est connecté à chacun des enroulements de stator (11) et comprend un détecteur de courant, un premier élément de commutation connecté en série à un second élément de commutation ; un dissipateur thermique fixé au module de champ (24) et aux modules d'alimentation (23) ; et un substrat de commande (25) qui fournit en sortie des signaux de commande. Ledit détecteur de courant, ledit premier élément de commutation et ledit second élément de commutation sont moulés avec une résine isolante.
FR1454985A 2013-12-09 2014-06-02 Machine electrique rotative dotee d'un convertisseur de puissance Active FR3014614B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013253767A JP5752218B2 (ja) 2013-12-09 2013-12-09 電力変換装置付き回転電機
JP2013253767 2013-12-09

Publications (2)

Publication Number Publication Date
FR3014614A1 FR3014614A1 (fr) 2015-06-12
FR3014614B1 true FR3014614B1 (fr) 2020-01-10

Family

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FR1454985A Active FR3014614B1 (fr) 2013-12-09 2014-06-02 Machine electrique rotative dotee d'un convertisseur de puissance

Country Status (3)

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US (1) US9203288B2 (fr)
JP (1) JP5752218B2 (fr)
FR (1) FR3014614B1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6058062B2 (ja) * 2015-04-16 2017-01-11 三菱電機株式会社 回転電機
JP6485705B2 (ja) 2015-12-18 2019-03-20 株式会社デンソー 電力変換装置および回転電機
JP2017127097A (ja) * 2016-01-13 2017-07-20 株式会社デンソー 制御装置一体型回転電機
JP6261642B2 (ja) * 2016-04-04 2018-01-17 三菱電機株式会社 電力半導体装置
US20170317562A1 (en) * 2016-04-29 2017-11-02 Denso Corporation Rotating electric machine integrated with controller
JP6696457B2 (ja) * 2016-04-29 2020-05-20 株式会社デンソー 制御装置一体型回転電機
JP6580015B2 (ja) 2016-10-05 2019-09-25 三菱電機株式会社 モールド樹脂封止型パワー半導体装置
JP6272518B1 (ja) * 2017-01-25 2018-01-31 三菱電機株式会社 回転電機
JP6509311B1 (ja) * 2017-11-30 2019-05-08 三菱電機株式会社 電力変換装置および電力変換装置付回転電機
JP7032274B2 (ja) * 2018-09-20 2022-03-08 トヨタ自動車株式会社 樹脂成形方法
JP2021072724A (ja) * 2019-10-31 2021-05-06 株式会社デンソー 電力変換装置
JP7086238B1 (ja) 2021-01-22 2022-06-17 三菱電機株式会社 制御装置一体型回転電機

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100285388B1 (ko) * 1992-11-02 2001-03-15 이마이 기요스케 초음파 장치
JP4512211B2 (ja) * 1999-01-25 2010-07-28 株式会社日立産機システム 電流制御回路、インバータ制御装置、インバータ装置、および電力変換装置
US6194856B1 (en) * 1999-01-25 2001-02-27 Hitachi, Ltd. Motor driving apparatus including a modularized current control circuit and method of controlling the same
WO2002063760A1 (fr) * 2001-02-08 2002-08-15 Stridsberg Innovation Ab Systeme moteur de haute fiabilite
JP4275614B2 (ja) * 2004-12-10 2009-06-10 三菱電機株式会社 車両用回転電機
JP2006174541A (ja) * 2004-12-13 2006-06-29 Mitsubishi Electric Corp 回転電機
JP4402057B2 (ja) * 2006-02-21 2010-01-20 三菱電機株式会社 制御装置一体型回転電機
JP4942825B2 (ja) * 2010-01-18 2012-05-30 三菱電機株式会社 制御装置一体型回転電機
JP5532984B2 (ja) * 2010-02-04 2014-06-25 株式会社デンソー 車両用回転電機
JP5300784B2 (ja) * 2010-05-21 2013-09-25 三菱電機株式会社 半導体モジュール及び半導体モジュールを搭載した回転電機
JP5270718B2 (ja) * 2011-05-27 2013-08-21 三菱電機株式会社 電力供給ユニット一体型回転電機
CN103503132B (zh) 2011-06-09 2016-06-01 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
FR3014614A1 (fr) 2015-06-12
US9203288B2 (en) 2015-12-01
JP2015115966A (ja) 2015-06-22
JP5752218B2 (ja) 2015-07-22
US20150162808A1 (en) 2015-06-11

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