FR2960083B1 - Dispositif sur un substrat semi-conducteur pour une installation rfid ainsi qu'un procede de fabrication - Google Patents

Dispositif sur un substrat semi-conducteur pour une installation rfid ainsi qu'un procede de fabrication Download PDF

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Publication number
FR2960083B1
FR2960083B1 FR1153999A FR1153999A FR2960083B1 FR 2960083 B1 FR2960083 B1 FR 2960083B1 FR 1153999 A FR1153999 A FR 1153999A FR 1153999 A FR1153999 A FR 1153999A FR 2960083 B1 FR2960083 B1 FR 2960083B1
Authority
FR
France
Prior art keywords
manufacture
semiconductor substrate
rfid installation
rfid
installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1153999A
Other languages
English (en)
Other versions
FR2960083A1 (fr
Inventor
Tjalf Pirk
Andreas Krauss
Laura Bohne
Janpeter Wolff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2960083A1 publication Critical patent/FR2960083A1/fr
Application granted granted Critical
Publication of FR2960083B1 publication Critical patent/FR2960083B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Radar Systems Or Details Thereof (AREA)
FR1153999A 2010-05-11 2011-05-10 Dispositif sur un substrat semi-conducteur pour une installation rfid ainsi qu'un procede de fabrication Expired - Fee Related FR2960083B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010028868.3 2010-05-11
DE102010028868.3A DE102010028868B4 (de) 2010-05-11 2010-05-11 Halbleitersubstratbasierte Anordnung für eine RFID-Einrichtung, RFID-Einrichtung und Verfahren zur Herstellung einer solchen halbleitersubstratbasierten Anordnung

Publications (2)

Publication Number Publication Date
FR2960083A1 FR2960083A1 (fr) 2011-11-18
FR2960083B1 true FR2960083B1 (fr) 2018-05-04

Family

ID=44859743

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1153999A Expired - Fee Related FR2960083B1 (fr) 2010-05-11 2011-05-10 Dispositif sur un substrat semi-conducteur pour une installation rfid ainsi qu'un procede de fabrication

Country Status (4)

Country Link
US (1) US9608307B2 (fr)
CN (1) CN102243718B (fr)
DE (1) DE102010028868B4 (fr)
FR (1) FR2960083B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9107335B2 (en) 2013-02-19 2015-08-11 Infineon Technologies Ag Method for manufacturing an integrated circuit and an integrated circuit
DE102013104148A1 (de) 2013-04-24 2014-10-30 Infineon Technologies Ag Funkkommunikationsprozessoranordnung
DE102013011812A1 (de) * 2013-07-16 2015-01-22 Peter-Joachim Neymann Elektronische Chipkarte
DE102013109200A1 (de) 2013-08-26 2015-02-26 Infineon Technologies Austria Ag Chip, Chip-Anordnung und Verfahren zum Herstellen eines Chips

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110696A (en) * 1990-11-09 1992-05-05 Bell Communications Research Rechargeable lithiated thin film intercalation electrode battery
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US6130602A (en) * 1996-05-13 2000-10-10 Micron Technology, Inc. Radio frequency data communications device
US6104280A (en) * 1997-10-20 2000-08-15 Micron Technology, Inc. Method of manufacturing and testing an electronic device, and an electronic device
KR100296741B1 (ko) 1999-05-11 2001-07-12 박호군 트렌치 구조를 갖는 전지 및 그 제조방법
WO2003037652A1 (fr) * 2001-10-31 2003-05-08 Hayes Lemmerz International, Inc. Roue monobloc usinee pour vehicule et procede de production correspondant
US6700491B2 (en) 2002-06-14 2004-03-02 Sensormatic Electronics Corporation Radio frequency identification tag with thin-film battery for antenna
US20060032046A1 (en) * 2002-10-17 2006-02-16 Menachem Nathan Thin-film cathode for 3-dimensional microbattery and method for preparing such cathode
AU2003300153A1 (en) * 2003-01-02 2004-07-29 Cymbet Corporation Solid-state battery-powered devices and manufacturing methods
US7603144B2 (en) 2003-01-02 2009-10-13 Cymbet Corporation Active wireless tagging system on peel and stick substrate
WO2004104912A1 (fr) 2003-05-26 2004-12-02 Omron Corporation Support d'information, support d'enregistrement d'informations, capteur, procede de gestion d'articles
WO2005112591A2 (fr) * 2004-05-14 2005-12-01 Wavezero, Inc. Antennes et balises d'identification rf et leur procede de fabrication
CN101019137A (zh) * 2004-05-14 2007-08-15 波零公司 射频天线和标签以及用于制造射频天线和射频标签的方法
JP2007183919A (ja) 2005-12-05 2007-07-19 Nec Corp Ｒｆｉｄタグ
US8791358B1 (en) * 2008-10-02 2014-07-29 Banpil Photonics Inc. Energy scavenging devices and manufacturing thereof

Also Published As

Publication number Publication date
CN102243718A (zh) 2011-11-16
DE102010028868A1 (de) 2011-11-17
CN102243718B (zh) 2017-04-12
US20110278363A1 (en) 2011-11-17
DE102010028868B4 (de) 2019-11-14
FR2960083A1 (fr) 2011-11-18
US9608307B2 (en) 2017-03-28

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