FR2932944B1 - Dispositif electronique comportant une interface thermique elastique avec des composants electroniques - Google Patents

Dispositif electronique comportant une interface thermique elastique avec des composants electroniques

Info

Publication number
FR2932944B1
FR2932944B1 FR0803460A FR0803460A FR2932944B1 FR 2932944 B1 FR2932944 B1 FR 2932944B1 FR 0803460 A FR0803460 A FR 0803460A FR 0803460 A FR0803460 A FR 0803460A FR 2932944 B1 FR2932944 B1 FR 2932944B1
Authority
FR
France
Prior art keywords
thermal interface
electronic device
elastic thermal
electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0803460A
Other languages
English (en)
Other versions
FR2932944A1 (fr
Inventor
Georges Moulin
Serge Parbaud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0803460A priority Critical patent/FR2932944B1/fr
Publication of FR2932944A1 publication Critical patent/FR2932944A1/fr
Application granted granted Critical
Publication of FR2932944B1 publication Critical patent/FR2932944B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0803460A 2008-06-20 2008-06-20 Dispositif electronique comportant une interface thermique elastique avec des composants electroniques Active FR2932944B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0803460A FR2932944B1 (fr) 2008-06-20 2008-06-20 Dispositif electronique comportant une interface thermique elastique avec des composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0803460A FR2932944B1 (fr) 2008-06-20 2008-06-20 Dispositif electronique comportant une interface thermique elastique avec des composants electroniques

Publications (2)

Publication Number Publication Date
FR2932944A1 FR2932944A1 (fr) 2009-12-25
FR2932944B1 true FR2932944B1 (fr) 2010-09-03

Family

ID=40385519

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0803460A Active FR2932944B1 (fr) 2008-06-20 2008-06-20 Dispositif electronique comportant une interface thermique elastique avec des composants electroniques

Country Status (1)

Country Link
FR (1) FR2932944B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3058262A1 (fr) * 2016-10-31 2018-05-04 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif electronique protege

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544673A (en) * 1978-09-26 1980-03-29 Nec Corp Liquid cooling device for data processor
JPS58188188A (ja) * 1982-04-27 1983-11-02 富士通株式会社 プリント配線板放熱構造
DE58902852D1 (de) * 1988-05-05 1993-01-14 Siemens Nixdorf Inf Syst Anordnung zur konvektiven kuehlung von elektronischen bauelementen, insbesondere von integrierten halbleiterschaltungen.
JPH06268113A (ja) * 1993-03-16 1994-09-22 Nippon Steel Corp 電子機器用の放熱部材
JP3492656B2 (ja) * 2001-08-28 2004-02-03 埼玉日本電気株式会社 熱伝導シートの製造方法
JP4811936B2 (ja) * 2006-08-02 2011-11-09 オムロンオートモーティブエレクトロニクス株式会社 電子機器の製造方法、電子機器

Also Published As

Publication number Publication date
FR2932944A1 (fr) 2009-12-25

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