JPS5544673A - Liquid cooling device for data processor - Google Patents
Liquid cooling device for data processorInfo
- Publication number
- JPS5544673A JPS5544673A JP11876878A JP11876878A JPS5544673A JP S5544673 A JPS5544673 A JP S5544673A JP 11876878 A JP11876878 A JP 11876878A JP 11876878 A JP11876878 A JP 11876878A JP S5544673 A JPS5544673 A JP S5544673A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling
- bag
- substrate
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To facilitate the manufacture and maintenance by securing a simple separation between the cooling part and the integrated circuit part mounted with a high termal adhesion performance.
CONSTITUTION: The following component parts are provided: integrated circuit mounting substrate 10; integrated circuit mounting case 11 which can conatin 9 sheets of substrate 10; cooling part case 12; partition frame 13 attached to one side of case 12; silicone rubber bag 14 attached into each partition; and hinge 15 which connects the above two cases together. To drive such device, the two cases are closed with the silicone oil injected into bag 14. Then the heat generated from the integrated circuit on substrate 10 is conveyed to the cooling plate of the opposite side via the silicone oil convecting in bag 14 and then absorbed into the cooling water in the cooling pipe.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11876878A JPS5544673A (en) | 1978-09-26 | 1978-09-26 | Liquid cooling device for data processor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11876878A JPS5544673A (en) | 1978-09-26 | 1978-09-26 | Liquid cooling device for data processor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5544673A true JPS5544673A (en) | 1980-03-29 |
Family
ID=14744578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11876878A Pending JPS5544673A (en) | 1978-09-26 | 1978-09-26 | Liquid cooling device for data processor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5544673A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5836433U (en) * | 1981-08-29 | 1983-03-09 | 日本電気株式会社 | data processing equipment |
US4982153A (en) * | 1989-02-06 | 1991-01-01 | Cray Research, Inc. | Method and apparatus for cooling an integrated circuit chip during testing |
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
EP0461753A2 (en) * | 1990-05-08 | 1991-12-18 | International Business Machines Corporation | Modular electronic packaging system |
US5685363A (en) * | 1994-12-08 | 1997-11-11 | Nissin Electric Co., Ltd. | Substrate holding device and manufacturing method therefor |
FR2932944A1 (en) * | 2008-06-20 | 2009-12-25 | Thales Sa | Electronic device for avionic application, has composite pad including flexible core that is incorporated in sealed elastic envelope, and assuring interface between electronic component and thermal drain |
-
1978
- 1978-09-26 JP JP11876878A patent/JPS5544673A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5836433U (en) * | 1981-08-29 | 1983-03-09 | 日本電気株式会社 | data processing equipment |
US4982153A (en) * | 1989-02-06 | 1991-01-01 | Cray Research, Inc. | Method and apparatus for cooling an integrated circuit chip during testing |
EP0461753A2 (en) * | 1990-05-08 | 1991-12-18 | International Business Machines Corporation | Modular electronic packaging system |
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
US5685363A (en) * | 1994-12-08 | 1997-11-11 | Nissin Electric Co., Ltd. | Substrate holding device and manufacturing method therefor |
FR2932944A1 (en) * | 2008-06-20 | 2009-12-25 | Thales Sa | Electronic device for avionic application, has composite pad including flexible core that is incorporated in sealed elastic envelope, and assuring interface between electronic component and thermal drain |
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