JPS5544673A - Liquid cooling device for data processor - Google Patents

Liquid cooling device for data processor

Info

Publication number
JPS5544673A
JPS5544673A JP11876878A JP11876878A JPS5544673A JP S5544673 A JPS5544673 A JP S5544673A JP 11876878 A JP11876878 A JP 11876878A JP 11876878 A JP11876878 A JP 11876878A JP S5544673 A JPS5544673 A JP S5544673A
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling
substrate
bag
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11876878A
Inventor
Shunichi Kato
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP11876878A priority Critical patent/JPS5544673A/en
Publication of JPS5544673A publication Critical patent/JPS5544673A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To facilitate the manufacture and maintenance by securing a simple separation between the cooling part and the integrated circuit part mounted with a high termal adhesion performance.
CONSTITUTION: The following component parts are provided: integrated circuit mounting substrate 10; integrated circuit mounting case 11 which can conatin 9 sheets of substrate 10; cooling part case 12; partition frame 13 attached to one side of case 12; silicone rubber bag 14 attached into each partition; and hinge 15 which connects the above two cases together. To drive such device, the two cases are closed with the silicone oil injected into bag 14. Then the heat generated from the integrated circuit on substrate 10 is conveyed to the cooling plate of the opposite side via the silicone oil convecting in bag 14 and then absorbed into the cooling water in the cooling pipe.
COPYRIGHT: (C)1980,JPO&Japio
JP11876878A 1978-09-26 1978-09-26 Liquid cooling device for data processor Pending JPS5544673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11876878A JPS5544673A (en) 1978-09-26 1978-09-26 Liquid cooling device for data processor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11876878A JPS5544673A (en) 1978-09-26 1978-09-26 Liquid cooling device for data processor

Publications (1)

Publication Number Publication Date
JPS5544673A true JPS5544673A (en) 1980-03-29

Family

ID=14744578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11876878A Pending JPS5544673A (en) 1978-09-26 1978-09-26 Liquid cooling device for data processor

Country Status (1)

Country Link
JP (1) JPS5544673A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836433U (en) * 1981-08-29 1983-03-09
US4982153A (en) * 1989-02-06 1991-01-01 Cray Research, Inc. Method and apparatus for cooling an integrated circuit chip during testing
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
EP0461753A2 (en) * 1990-05-08 1991-12-18 International Business Machines Corporation Modular electronic packaging system
US5685363A (en) * 1994-12-08 1997-11-11 Nissin Electric Co., Ltd. Substrate holding device and manufacturing method therefor
FR2932944A1 (en) * 2008-06-20 2009-12-25 Thales Sa Electronic device for avionic application, has composite pad including flexible core that is incorporated in sealed elastic envelope, and assuring interface between electronic component and thermal drain

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836433U (en) * 1981-08-29 1983-03-09
US4982153A (en) * 1989-02-06 1991-01-01 Cray Research, Inc. Method and apparatus for cooling an integrated circuit chip during testing
EP0461753A2 (en) * 1990-05-08 1991-12-18 International Business Machines Corporation Modular electronic packaging system
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5685363A (en) * 1994-12-08 1997-11-11 Nissin Electric Co., Ltd. Substrate holding device and manufacturing method therefor
FR2932944A1 (en) * 2008-06-20 2009-12-25 Thales Sa Electronic device for avionic application, has composite pad including flexible core that is incorporated in sealed elastic envelope, and assuring interface between electronic component and thermal drain

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