FR2872630B1 - Circuit integre tolerant au phenomene de verrouillage - Google Patents
Circuit integre tolerant au phenomene de verrouillageInfo
- Publication number
- FR2872630B1 FR2872630B1 FR0407309A FR0407309A FR2872630B1 FR 2872630 B1 FR2872630 B1 FR 2872630B1 FR 0407309 A FR0407309 A FR 0407309A FR 0407309 A FR0407309 A FR 0407309A FR 2872630 B1 FR2872630 B1 FR 2872630B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- locking phenomenon
- tolerant integrated
- tolerant
- phenomenon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0921—Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0407309A FR2872630B1 (fr) | 2004-07-01 | 2004-07-01 | Circuit integre tolerant au phenomene de verrouillage |
US11/172,609 US7868392B2 (en) | 2004-07-01 | 2005-06-30 | Integrated circuit tolerant to the locking phenomenon |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0407309A FR2872630B1 (fr) | 2004-07-01 | 2004-07-01 | Circuit integre tolerant au phenomene de verrouillage |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2872630A1 FR2872630A1 (fr) | 2006-01-06 |
FR2872630B1 true FR2872630B1 (fr) | 2006-12-01 |
Family
ID=34947675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0407309A Expired - Fee Related FR2872630B1 (fr) | 2004-07-01 | 2004-07-01 | Circuit integre tolerant au phenomene de verrouillage |
Country Status (2)
Country | Link |
---|---|
US (1) | US7868392B2 (fr) |
FR (1) | FR2872630B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115050736B (zh) * | 2022-06-10 | 2023-05-23 | 深圳市晶扬电子有限公司 | 低压工艺的静电保护器件及整体静电防护方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1175503A (fr) * | 1981-07-17 | 1984-10-02 | Andreas Demetriou | Circuit d'excitation a cmos |
JPS60111454A (ja) * | 1983-11-21 | 1985-06-17 | Mitsubishi Electric Corp | 半導体集積回路 |
JPS60152055A (ja) * | 1984-01-20 | 1985-08-10 | Matsushita Electric Ind Co Ltd | 相補型mos半導体装置 |
US4881107A (en) * | 1987-07-03 | 1989-11-14 | Nissan Motor Company, Ltd. | IC device having a vertical MOSFET and an auxiliary component |
IT1268070B1 (it) * | 1994-06-06 | 1997-02-20 | Cselt Centro Studi Lab Telecom | Circuito in tecnologia cmos per il pilotaggo ad alta velocita' di sorgenti ottiche. |
US5721445A (en) * | 1995-03-02 | 1998-02-24 | Lucent Technologies Inc. | Semiconductor device with increased parasitic emitter resistance and improved latch-up immunity |
US6222254B1 (en) * | 1997-03-31 | 2001-04-24 | Intel Corporation | Thermal conducting trench in a semiconductor structure and method for forming the same |
US6005797A (en) * | 1998-03-20 | 1999-12-21 | Micron Technology, Inc. | Latch-up prevention for memory cells |
JP3928837B2 (ja) * | 1999-09-13 | 2007-06-13 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US6493275B2 (en) * | 2000-08-07 | 2002-12-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit device and electronic equipment |
JP4199476B2 (ja) * | 2002-04-12 | 2008-12-17 | 株式会社ルネサステクノロジ | 半導体装置の保護回路 |
-
2004
- 2004-07-01 FR FR0407309A patent/FR2872630B1/fr not_active Expired - Fee Related
-
2005
- 2005-06-30 US US11/172,609 patent/US7868392B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR2872630A1 (fr) | 2006-01-06 |
US7868392B2 (en) | 2011-01-11 |
US20060081938A1 (en) | 2006-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090331 |