FR2868239B1 - Module de source lumineuse et phare de vehicule l'utilisant - Google Patents
Module de source lumineuse et phare de vehicule l'utilisantInfo
- Publication number
- FR2868239B1 FR2868239B1 FR0502979A FR0502979A FR2868239B1 FR 2868239 B1 FR2868239 B1 FR 2868239B1 FR 0502979 A FR0502979 A FR 0502979A FR 0502979 A FR0502979 A FR 0502979A FR 2868239 B1 FR2868239 B1 FR 2868239B1
- Authority
- FR
- France
- Prior art keywords
- light
- source module
- light source
- same
- vehicle headlight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002105 nanoparticle Substances 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000011230 binding agent Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H12/00—Towers; Masts or poles; Chimney stacks; Water-towers; Methods of erecting such structures
- E04H12/02—Structures made of specified materials
- E04H12/08—Structures made of specified materials of metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Architecture (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004093172 | 2004-03-26 | ||
JP2005052893A JP2005310756A (ja) | 2004-03-26 | 2005-02-28 | 光源モジュールおよび車両用前照灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2868239A1 FR2868239A1 (fr) | 2005-09-30 |
FR2868239B1 true FR2868239B1 (fr) | 2014-01-10 |
Family
ID=34981109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0502979A Expired - Fee Related FR2868239B1 (fr) | 2004-03-26 | 2005-03-25 | Module de source lumineuse et phare de vehicule l'utilisant |
Country Status (6)
Country | Link |
---|---|
US (1) | US7391046B2 (fr) |
JP (1) | JP2005310756A (fr) |
KR (1) | KR100713790B1 (fr) |
CN (1) | CN100356598C (fr) |
DE (1) | DE102005013785B4 (fr) |
FR (1) | FR2868239B1 (fr) |
Families Citing this family (86)
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DE10345157B4 (de) * | 2003-09-29 | 2009-01-08 | Qimonda Ag | Wärmeleitende Verpackung von elektronischen Schaltungseinheiten |
JP2005310756A (ja) | 2004-03-26 | 2005-11-04 | Koito Mfg Co Ltd | 光源モジュールおよび車両用前照灯 |
US7868343B2 (en) | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
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CA2637460A1 (fr) * | 2006-01-18 | 2007-07-26 | Sparkxis B.V. | Nouveaux materiaux monomeres et polymeres |
US7675145B2 (en) * | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7521727B2 (en) | 2006-04-26 | 2009-04-21 | Rohm And Haas Company | Light emitting device having improved light extraction efficiency and method of making same |
US7955531B1 (en) * | 2006-04-26 | 2011-06-07 | Rohm And Haas Electronic Materials Llc | Patterned light extraction sheet and method of making same |
US7569864B2 (en) * | 2006-05-03 | 2009-08-04 | Atomic Energy Council-Institute Of Nuclear Energy Research | Silicon-rich-oxide white light photodiode |
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US8179034B2 (en) * | 2007-07-13 | 2012-05-15 | 3M Innovative Properties Company | Light extraction film for organic light emitting diode display and lighting devices |
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US20100110551A1 (en) * | 2008-10-31 | 2010-05-06 | 3M Innovative Properties Company | Light extraction film with high index backfill layer and passivation layer |
US8791471B2 (en) * | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
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-
2005
- 2005-02-28 JP JP2005052893A patent/JP2005310756A/ja active Pending
- 2005-03-24 DE DE102005013785.7A patent/DE102005013785B4/de not_active Expired - Fee Related
- 2005-03-25 FR FR0502979A patent/FR2868239B1/fr not_active Expired - Fee Related
- 2005-03-25 CN CNB2005100592664A patent/CN100356598C/zh not_active Expired - Fee Related
- 2005-03-25 KR KR1020050024918A patent/KR100713790B1/ko not_active IP Right Cessation
- 2005-03-25 US US11/088,909 patent/US7391046B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100356598C (zh) | 2007-12-19 |
KR20060044761A (ko) | 2006-05-16 |
FR2868239A1 (fr) | 2005-09-30 |
US7391046B2 (en) | 2008-06-24 |
JP2005310756A (ja) | 2005-11-04 |
KR100713790B1 (ko) | 2007-05-04 |
US20050253130A1 (en) | 2005-11-17 |
DE102005013785A1 (de) | 2005-11-10 |
DE102005013785B4 (de) | 2014-03-06 |
DE102005013785A8 (de) | 2006-03-23 |
CN1674315A (zh) | 2005-09-28 |
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