FR2852735B1 - Structure sonos locale pour memoire non volatile a semiconducteur et procede de fabrication - Google Patents
Structure sonos locale pour memoire non volatile a semiconducteur et procede de fabricationInfo
- Publication number
- FR2852735B1 FR2852735B1 FR0400051A FR0400051A FR2852735B1 FR 2852735 B1 FR2852735 B1 FR 2852735B1 FR 0400051 A FR0400051 A FR 0400051A FR 0400051 A FR0400051 A FR 0400051A FR 2852735 B1 FR2852735 B1 FR 2852735B1
- Authority
- FR
- France
- Prior art keywords
- gate
- semiconductor memory
- volatile semiconductor
- manufacturing
- sonos structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 239000012212 insulator Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7923—Programmable transistors with more than two possible different levels of programmation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/954—Making oxide-nitride-oxide device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Une structure SONOS locale ayant une grille en deux parties et une structure ONO auto-alignée comprend : un substrat (1002); une structure ONO (1030) sur le substrat; une première couche de grille (1032) sur la structure ONO et en alignement avec celle-ci; un isolant de grille (1023) sur le substrat à côté de la structure ONO; et une seconde couche de grille (1034) sur la première couche de grille (1032) et sur l'isolant de grille (1023). Les première et seconde couches de grille (1032, 1034) sont connectées électriquement ensemble. La structure ONO (1030) et les première et seconde couches de grille (1032, 1034) définissent ensemble une structure SONOS locale à au moins 1 bit pour un dispositif de mémoire non volatile à semiconducteur.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/388,631 US6815764B2 (en) | 2003-03-17 | 2003-03-17 | Local SONOS-type structure having two-piece gate and self-aligned ONO and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2852735A1 FR2852735A1 (fr) | 2004-09-24 |
FR2852735B1 true FR2852735B1 (fr) | 2006-09-22 |
Family
ID=32927304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0400051A Expired - Fee Related FR2852735B1 (fr) | 2003-03-17 | 2004-01-06 | Structure sonos locale pour memoire non volatile a semiconducteur et procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (2) | US6815764B2 (fr) |
JP (1) | JP4445273B2 (fr) |
KR (1) | KR100546353B1 (fr) |
CN (1) | CN1326245C (fr) |
FR (1) | FR2852735B1 (fr) |
Families Citing this family (65)
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US20040004863A1 (en) * | 2002-07-05 | 2004-01-08 | Chih-Hsin Wang | Nonvolatile electrically alterable memory device and array made thereby |
KR100475087B1 (ko) * | 2002-08-19 | 2005-03-10 | 삼성전자주식회사 | 국부적 sonos 구조를 갖는 불휘발성 메모리 소자의제조 방법 |
US6849905B2 (en) * | 2002-12-23 | 2005-02-01 | Matrix Semiconductor, Inc. | Semiconductor device with localized charge storage dielectric and method of making same |
KR100480645B1 (ko) * | 2003-04-01 | 2005-03-31 | 삼성전자주식회사 | 역자기 정합 방식을 이용한 트윈―ono 형태의sonos 메모리 소자 제조 방법 |
US7297634B2 (en) * | 2003-06-06 | 2007-11-20 | Marvell World Trade Ltd. | Method and apparatus for semiconductor device and semiconductor memory device |
US7759719B2 (en) | 2004-07-01 | 2010-07-20 | Chih-Hsin Wang | Electrically alterable memory cell |
US7550800B2 (en) * | 2003-06-06 | 2009-06-23 | Chih-Hsin Wang | Method and apparatus transporting charges in semiconductor device and semiconductor memory device |
US7613041B2 (en) | 2003-06-06 | 2009-11-03 | Chih-Hsin Wang | Methods for operating semiconductor device and semiconductor memory device |
US6958271B1 (en) * | 2003-08-04 | 2005-10-25 | Advanced Micro Devices, Inc. | Method of fabricating a dual-level stacked flash memory cell with a MOSFET storage transistor |
US7067362B2 (en) * | 2003-10-17 | 2006-06-27 | Chartered Semiconductor Manufacturing Ltd. | Integrated circuit with protected implantation profiles and method for the formation thereof |
KR100663344B1 (ko) * | 2004-06-17 | 2007-01-02 | 삼성전자주식회사 | 적어도 두 개의 다른 채널농도를 갖는 비휘발성 플래시메모리 소자 및 그 제조방법 |
JP4795660B2 (ja) * | 2004-09-29 | 2011-10-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7473589B2 (en) | 2005-12-09 | 2009-01-06 | Macronix International Co., Ltd. | Stacked thin film transistor, non-volatile memory devices and methods for fabricating the same |
US7709334B2 (en) * | 2005-12-09 | 2010-05-04 | Macronix International Co., Ltd. | Stacked non-volatile memory device and methods for fabricating the same |
US8482052B2 (en) | 2005-01-03 | 2013-07-09 | Macronix International Co., Ltd. | Silicon on insulator and thin film transistor bandgap engineered split gate memory |
US20060198189A1 (en) * | 2005-01-03 | 2006-09-07 | Macronix International Co., Ltd. | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays |
US7642585B2 (en) * | 2005-01-03 | 2010-01-05 | Macronix International Co., Ltd. | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays |
US8264028B2 (en) * | 2005-01-03 | 2012-09-11 | Macronix International Co., Ltd. | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays |
US7315474B2 (en) | 2005-01-03 | 2008-01-01 | Macronix International Co., Ltd | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays |
US7636257B2 (en) * | 2005-06-10 | 2009-12-22 | Macronix International Co., Ltd. | Methods of operating p-channel non-volatile memory devices |
US7368789B1 (en) | 2005-06-13 | 2008-05-06 | Actel Corporation | Non-volatile programmable memory cell and array for programmable logic array |
US7768056B1 (en) * | 2005-06-13 | 2010-08-03 | Actel Corporation | Isolated-nitride-region non-volatile memory cell and fabrication method |
US7411244B2 (en) * | 2005-06-28 | 2008-08-12 | Chih-Hsin Wang | Low power electrically alterable nonvolatile memory cells and arrays |
US7576386B2 (en) | 2005-08-04 | 2009-08-18 | Macronix International Co., Ltd. | Non-volatile memory semiconductor device having an oxide-nitride-oxide (ONO) top dielectric layer |
US7763927B2 (en) | 2005-12-15 | 2010-07-27 | Macronix International Co., Ltd. | Non-volatile memory device having a nitride-oxide dielectric layer |
US8330232B2 (en) * | 2005-08-22 | 2012-12-11 | Macronix International Co., Ltd. | Nonvolatile memory device and method of forming the same |
KR100652433B1 (ko) * | 2005-09-08 | 2006-12-01 | 삼성전자주식회사 | 다중 비트 저장이 가능한 비휘발성 메모리 소자 및 그 제조방법 |
US7391652B2 (en) * | 2006-05-05 | 2008-06-24 | Macronix International Co., Ltd. | Method of programming and erasing a p-channel BE-SONOS NAND flash memory |
US7907450B2 (en) | 2006-05-08 | 2011-03-15 | Macronix International Co., Ltd. | Methods and apparatus for implementing bit-by-bit erase of a flash memory device |
US7414889B2 (en) * | 2006-05-23 | 2008-08-19 | Macronix International Co., Ltd. | Structure and method of sub-gate and architectures employing bandgap engineered SONOS devices |
US7948799B2 (en) | 2006-05-23 | 2011-05-24 | Macronix International Co., Ltd. | Structure and method of sub-gate NAND memory with bandgap engineered SONOS devices |
TWI300931B (en) * | 2006-06-20 | 2008-09-11 | Macronix Int Co Ltd | Method of operating non-volatile memory device |
US7746694B2 (en) * | 2006-07-10 | 2010-06-29 | Macronix International Co., Ltd. | Nonvolatile memory array having modified channel region interface |
US7772068B2 (en) | 2006-08-30 | 2010-08-10 | Macronix International Co., Ltd. | Method of manufacturing non-volatile memory |
US7811890B2 (en) | 2006-10-11 | 2010-10-12 | Macronix International Co., Ltd. | Vertical channel transistor structure and manufacturing method thereof |
US8772858B2 (en) | 2006-10-11 | 2014-07-08 | Macronix International Co., Ltd. | Vertical channel memory and manufacturing method thereof and operating method using the same |
US7851848B2 (en) | 2006-11-01 | 2010-12-14 | Macronix International Co., Ltd. | Cylindrical channel charge trapping devices with effectively high coupling ratios |
WO2008059768A1 (fr) * | 2006-11-14 | 2008-05-22 | Nec Corporation | Dispositif à semi-conducteur |
US8101989B2 (en) * | 2006-11-20 | 2012-01-24 | Macronix International Co., Ltd. | Charge trapping devices with field distribution layer over tunneling barrier |
KR101005638B1 (ko) * | 2006-12-04 | 2011-01-05 | 주식회사 하이닉스반도체 | 반도체 메모리 소자 및 제조방법 |
US7838923B2 (en) | 2007-08-09 | 2010-11-23 | Macronix International Co., Ltd. | Lateral pocket implant charge trapping devices |
US7737488B2 (en) | 2007-08-09 | 2010-06-15 | Macronix International Co., Ltd. | Blocking dielectric engineered charge trapping memory cell with high speed erase |
US7816727B2 (en) | 2007-08-27 | 2010-10-19 | Macronix International Co., Ltd. | High-κ capped blocking dielectric bandgap engineered SONOS and MONOS |
JP4937866B2 (ja) * | 2007-09-12 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7643349B2 (en) * | 2007-10-18 | 2010-01-05 | Macronix International Co., Ltd. | Efficient erase algorithm for SONOS-type NAND flash |
US7848148B2 (en) * | 2007-10-18 | 2010-12-07 | Macronix International Co., Ltd. | One-transistor cell semiconductor on insulator random access memory |
US8072023B1 (en) | 2007-11-12 | 2011-12-06 | Marvell International Ltd. | Isolation for non-volatile memory cell array |
US8120088B1 (en) | 2007-12-07 | 2012-02-21 | Marvell International Ltd. | Non-volatile memory cell and array |
US7902587B2 (en) * | 2008-04-17 | 2011-03-08 | United Microelectronics Corp. | Non-volatile memory cell |
US8068370B2 (en) * | 2008-04-18 | 2011-11-29 | Macronix International Co., Ltd. | Floating gate memory device with interpoly charge trapping structure |
US8081516B2 (en) * | 2009-01-02 | 2011-12-20 | Macronix International Co., Ltd. | Method and apparatus to suppress fringing field interference of charge trapping NAND memory |
US8861273B2 (en) * | 2009-04-21 | 2014-10-14 | Macronix International Co., Ltd. | Bandgap engineered charge trapping memory in two-transistor nor architecture |
US8471328B2 (en) | 2010-07-26 | 2013-06-25 | United Microelectronics Corp. | Non-volatile memory and manufacturing method thereof |
CN102610538B (zh) * | 2011-01-25 | 2015-04-08 | 上海华虹宏力半导体制造有限公司 | 通过测量隧穿电场来快速评价sonos可靠性的方法 |
US9240405B2 (en) | 2011-04-19 | 2016-01-19 | Macronix International Co., Ltd. | Memory with off-chip controller |
US8969881B2 (en) * | 2012-02-17 | 2015-03-03 | International Rectifier Corporation | Power transistor having segmented gate |
US8987098B2 (en) | 2012-06-19 | 2015-03-24 | Macronix International Co., Ltd. | Damascene word line |
CN103855162B (zh) * | 2012-12-05 | 2016-12-21 | 上海华虹宏力半导体制造有限公司 | 堆叠栅型sonos闪存存储器及其制造方法 |
US9379126B2 (en) | 2013-03-14 | 2016-06-28 | Macronix International Co., Ltd. | Damascene conductor for a 3D device |
US9099538B2 (en) | 2013-09-17 | 2015-08-04 | Macronix International Co., Ltd. | Conductor with a plurality of vertical extensions for a 3D device |
US9559113B2 (en) | 2014-05-01 | 2017-01-31 | Macronix International Co., Ltd. | SSL/GSL gate oxide in 3D vertical channel NAND |
CN104952734B (zh) * | 2015-07-16 | 2020-01-24 | 矽力杰半导体技术(杭州)有限公司 | 半导体结构及其制造方法 |
CN112289811B (zh) * | 2020-10-28 | 2022-06-24 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法、显示装置 |
KR20220123910A (ko) | 2021-03-02 | 2022-09-13 | 서강대학교산학협력단 | Mosfet 소자 및 그 제조 방법 |
KR102583235B1 (ko) | 2022-03-18 | 2023-09-26 | 서강대학교산학협력단 | Mosfet 소자 및 그 제조 방법 |
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US5445984A (en) * | 1994-11-28 | 1995-08-29 | United Microelectronics Corporation | Method of making a split gate flash memory cell |
US6768165B1 (en) | 1997-08-01 | 2004-07-27 | Saifun Semiconductors Ltd. | Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping |
US5851881A (en) * | 1997-10-06 | 1998-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making monos flash memory for multi-level logic |
US6281545B1 (en) * | 1997-11-20 | 2001-08-28 | Taiwan Semiconductor Manufacturing Company | Multi-level, split-gate, flash memory cell |
WO2000034984A2 (fr) | 1998-12-07 | 2000-06-15 | Intel Corporation | Transistor a porte encochee |
US6168995B1 (en) * | 1999-01-12 | 2001-01-02 | Lucent Technologies Inc. | Method of fabricating a split gate memory cell |
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US6272050B1 (en) * | 1999-05-28 | 2001-08-07 | Vlsi Technology, Inc. | Method and apparatus for providing an embedded flash-EEPROM technology |
US6255166B1 (en) * | 1999-08-05 | 2001-07-03 | Aalo Lsi Design & Device Technology, Inc. | Nonvolatile memory cell, method of programming the same and nonvolatile memory array |
US6388293B1 (en) | 1999-10-12 | 2002-05-14 | Halo Lsi Design & Device Technology, Inc. | Nonvolatile memory cell, operating method of the same and nonvolatile memory array |
US6720614B2 (en) * | 2001-08-07 | 2004-04-13 | Macronix International Co., Ltd. | Operation method for programming and erasing a data in a P-channel sonos memory cell |
JP2003258128A (ja) * | 2002-02-27 | 2003-09-12 | Nec Electronics Corp | 不揮発性半導体記憶装置およびその製造方法ならびにその動作方法 |
US6750103B1 (en) * | 2002-02-27 | 2004-06-15 | Advanced Micro Devices, Inc. | NROM cell with N-less channel |
US6642573B1 (en) * | 2002-03-13 | 2003-11-04 | Advanced Micro Devices, Inc. | Use of high-K dielectric material in modified ONO structure for semiconductor devices |
US20040000689A1 (en) * | 2002-06-28 | 2004-01-01 | Erh-Kun Lai | Dual-bit MONOS/SONOS memory structure with non-continuous floating gate |
US6774432B1 (en) * | 2003-02-05 | 2004-08-10 | Advanced Micro Devices, Inc. | UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL |
-
2003
- 2003-03-17 US US10/388,631 patent/US6815764B2/en not_active Expired - Fee Related
- 2003-07-28 KR KR1020030052088A patent/KR100546353B1/ko not_active IP Right Cessation
-
2004
- 2004-01-05 CN CNB200410001272XA patent/CN1326245C/zh not_active Expired - Fee Related
- 2004-01-06 FR FR0400051A patent/FR2852735B1/fr not_active Expired - Fee Related
- 2004-01-08 JP JP2004003450A patent/JP4445273B2/ja not_active Expired - Fee Related
- 2004-09-30 US US10/953,553 patent/US7060563B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7060563B2 (en) | 2006-06-13 |
US20050048702A1 (en) | 2005-03-03 |
CN1531095A (zh) | 2004-09-22 |
FR2852735A1 (fr) | 2004-09-24 |
US6815764B2 (en) | 2004-11-09 |
US20040183126A1 (en) | 2004-09-23 |
JP4445273B2 (ja) | 2010-04-07 |
CN1326245C (zh) | 2007-07-11 |
KR20040082019A (ko) | 2004-09-23 |
KR100546353B1 (ko) | 2006-01-26 |
JP2004282029A (ja) | 2004-10-07 |
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Legal Events
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Effective date: 20140930 |