FR2801138A1 - REACTION TUBE FOR THE MANUFACTURE OF A SEMICONDUCTOR WAFER - Google Patents

Abstract

Reaction tube for producing a semiconductor wafer (1), received in the space (2) of a tube body (3), one wall (3b) of which has a number of through holes; temperature sensing devices formed on the through holes sense the temperature of the wafer (1). Each of the temperature sensing devices comprises a cylindrical cap (6) which closes the corresponding through-hole and which supports the semiconductor wafer (1). A temperature sensor fixing member, inserted into the cylindrical cap (6) through the through-hole, comprises a cylindrical part to be screwed into the cap (6) and the outer peripheral surface of which has grooves for bringing a thermocouple to the upper part of the cap (6).

Description

BACKGROUND OF THE INVENTION

1. Field of the invention

  The present invention relates to a reaction tube.

  tion for the manufacture of a semiconductor wafer and, more particularly, a reaction tube for forming a film on a semiconductor wafer intended for use in the device for manufacturing a batch of chips

of semiconductors.

2. Description of the prior art

  In the case where the semiconductor wafer is treated to form a film thereon in the reaction tube, the temperature of the semiconductor wafer and the quality of the film formed thereon are closely

  related to each other, so it is necessary to con-

  accurately monitor the temperature of the semi-insert

  conductor in the reaction tube.

  Consequently, in the reaction tube convention-

  nel, the temperature of the semiconductor wafer in

  the reaction tube is measured by a rayon thermometer-

  infrared during treatment, or conditions of

  temperature for film formation are determined beforehand

  Minerally by using a false plate fitted with a thermocouple on it to control the temperature of

this semiconductor wafer.

  However, the temperature of the platelet

  semiconductor cannot be measured correctly by the therm

  infrared radiation mometer because the rate of heat radiation from the semiconductor wafer varies according to

  the temperature or type of film to be formed.

  In addition, when using the false plate, the thermocouple must be mounted on a surface of a thin plate. However, the thermocouple is easily removed from the wafer and it is necessary to provide an additional device such as a bushing to ensure the airtightness of the thermocouple conducting wires which

  pass from the inside to the outside of the reaction tube.

SUMMARY OF THE INVENTION

  Consequently, the present invention aims to

  create a reaction tube that is free of the above faults

  above. To this end, the present invention relates to a

  reaction tube for the production of a semi-insert

  conductor, characterized in that it comprises a tube body provided with a space for receiving therein a plate of

  semiconductor, a number of through holes pre-

  seen in a wall of the tube body, and temperature sensing devices formed respectively on the through holes to sense the temperature of the wafer

  semiconductor in the reception area, each of the

  temperature detection devices including a cy-

  lindrique arranged in this reception space to close the corresponding through hole and to support the semiconductor wafer in this space, and a fixing element

  temperature sensor to be inserted in the case

  cylindrical puchon through the through hole starting from

the outside of the tube body.

  According to another characteristic of the invention, the temperature detector fixing element comprises a cylindrical part intended to be screwed into the cap,

  and grooves formed on the outer peripheral surface

  of the cylindrical part to bring a thermocouple to

the top of the cap.

  According to yet another characteristic of

  the invention, the temperature sensor fixing element

  ture comprises a cylindrical part intended to be intro

  duite in the cap, grooves formed on the outer peripheral surface of the cylindrical part to bring a thermocouple to the upper part of the cap, and a flange provided on one end of the cylindrical part

  so as to be screwed into the through hole.

  These and other aspects and others

  aims of the present invention will be better appreciated and understood.

  taken from reading the detailed description which follows and which

  refers to the accompanying drawings. It will be understood, however, that the

  description which follows, although it indicates modes of reaction

  Preferential reading of the present invention, is given only by way of illustration and not by limitation. Many changes and modifications can be made while remaining within the spirit and scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

  The present invention will be described below from

  in more detail using embodiments re-

  shown in the accompanying drawings in which:

  * Figure 1 is a plan view of a reaction tube

  the present invention; * Figure 2 is a side view, in vertical section, of the reaction tube according to the present invention; * Figure 3 is a side view, in vertical section, of a temperature detection device of the reaction tube of the present invention; * Figure 4 is a perspective view of an element of

  fixing the temperature detector shown in figure

  gure 3; * Figure 5 is a side view, in vertical section, of the

  temperature detection device shown in figure

  gure 3, in a combined state; * Figure 6 is a side view, in vertical section, of a temperature detection device according to another embodiment of the present invention; and * Figure 7 is a side view, in vertical section, of a

  device for processing a semi-insert

driver.

  DESCRIPTION OF THE PREFERENTIAL DESIGN MODES

  As shown in Figures 1 to 5, a tube

  of reaction according to a first embodiment of the pre-

  sente invention comprises a flat tube body 3 made of high purity quartz and provided with a space 2 to receive therein for example a semiconductor wafer 1

  disc-shaped, a pipe 4 mounted on a first end

  mite 3a of the tube body 3 to introduce a treatment gas

  ment in the space 2 inside the tube body 3, a number of through holes 5 provided on a bottom wall 3b of the tube body 3 to communicate

  space 2 with the outside of the tube body 3, and

  temperature detection devices formed on the lower wall

  3b in correspondence with the respective through holes 5 to detect the temperature of the wafer

semiconductor 1 in space 2.

  Each of the temperature sensing devices

  ture comprises a cylindrical cap 6 for supporting the wafer 1 in the space 2, the open side of each of these temperature detection devices being fixed to the bottom wall 3b for example by welding, so as to close the

  through hole 5 corresponding, part of female thread

  3c melle formed on the inner peripheral surface of the

  through hole 5 on the lower side thereof, and an ele

  temperature sensor fixing element 9 to be

  introduced into the cylindrical cap 6 through the through hole

health 5.

  The temperature sensor fixing element 9 comprises a cylindrical part 8b made of quartz and having to be introduced into the cap 6, grooves 8c formed on both sides of the outer peripheral surface of the cylindrical part 8b, a flange 8a formed on the lower part of the cylindrical part 8b, a male thread part 7 formed on the outer peripheral surface

  of the 8th flange so as to be screwed into the

  female thread tie 3c of the through hole 5, through holes 8d formed vertically in the flange 8a so as to communicate respectively with the grooves 8c, and

  a groove 8e formed horizontally on the lower surface

  flange 8a to receive a fixing tool

such as a screwdriver.

  A thermocouple 11 extends so as to pass to

  through the through holes 8d and the grooves 8c for at-

  dyeing a measurement part 10 of the thermocouple 11 at the location of a ceiling surface 6a of the cap 6. In FIG. 5, the reference numeral 12 designates lead wires

  current for thermocouple 10, and reference 13 desi-

  gene insulators made of electrically insulating quartz,

  for current supply wires 12.

  Figure 6 shows a detection device

  temperature of the reaction tube according to the other reaction mode

  of the present invention. In this latter embodiment, a female thread part 18 is provided on

  the inner peripheral surface of the cap 6, and a part

  8f male thread tie is provided on the peripheral surface

  that exterior of the cylindrical part 8b.

  In this embodiment, the fixing element

  tion 9 of the temperature sensor can be attached directly

cap 6.

  The reaction tube according to the present invention, as well as the semiconductor wafer 1 resting on the caps 6, are introduced into a space 15 inside.

  the heating oven 14, as shown in FIG. 7.

  The reference numeral 16 designates two heat equalization plates arranged in the space 15 opposite the tube body 3, and the reference numeral 17 designates a

furnace heating element 14.

EFFECT OF THE INVENTION

  The present invention provides substantial advantages.

  load bearing compared to the conventional reaction tube. For example, according to the present invention, the temperature of the semiconductor wafer can be measured and properly controlled during processing. In addition, the thermocouple is not fixed directly to the semiconductor wafer, and is not positioned inside the tube body, so it is not necessary to provide crossings of any airtight supply for the wires

  thermocouple current supply.

Claims (3)

R E V E N D I C A T I ON S   ) Reaction tube for the manufacture of a semiconductor wafer (1), characterized in that it comprises: * a tube body (3) provided with a space (2) for receiving therein a semiconductor wafer (1), a number of through holes (5) provided in a wall (3a) of the tube body (3), and   * temperature detection devices trained respectively   through the through holes (5) to detect the temperature of the semiconductor wafer (1) in   space (2), each of the time detection devices   temperature comprising a cylindrical cap (6) disposed   in the space (2) to close the through hole (5) cor-   corresponding and to support the semi-insert   conductor (1) in space (2), and a fixing element   tion of temperature sensor (9) to be introduced into the cylindrical cap (6) through the through hole   (5) starting from the outside of the tube body (3).   2) Reaction tube according to claim 1, characterized in that   the temperature sensor fixing element (9) comprises   takes a cylindrical part (8b) intended to be screwed into the cap (6), and grooves (8c) formed on the outer peripheral surface of the cylindrical part (8b) to bring a thermocouple (11) to the upper part (6a ) of cap (6).   3) Reaction tube according to claim 1, characterized in that   the temperature sensor fixing element (9) comprises   takes a cylindrical part (8b) intended to be introduced   in the cap (6), grooves (8c) formed on the surface   outer peripheral face of the cylindrical part (8b) for bringing a thermocouple (11) to the upper part (6a)   of the cap (6), and a flange (8a) provided on an end   mity of the cylindrical part (8b) so as to come vis- be in the through hole (5).