FR2782230B1 - Carte de circuits imprimes - Google Patents

Carte de circuits imprimes

Info

Publication number
FR2782230B1
FR2782230B1 FR9810151A FR9810151A FR2782230B1 FR 2782230 B1 FR2782230 B1 FR 2782230B1 FR 9810151 A FR9810151 A FR 9810151A FR 9810151 A FR9810151 A FR 9810151A FR 2782230 B1 FR2782230 B1 FR 2782230B1
Authority
FR
France
Prior art keywords
printed circuits
circuits card
card
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9810151A
Other languages
English (en)
Other versions
FR2782230A1 (fr
Inventor
Michel Bremond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BULL ELECTRONICS ANGERS
Original Assignee
BULL ELECTRONICS ANGERS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BULL ELECTRONICS ANGERS filed Critical BULL ELECTRONICS ANGERS
Priority to FR9810151A priority Critical patent/FR2782230B1/fr
Priority to EP99936698A priority patent/EP1103169A1/fr
Priority to PCT/FR1999/001943 priority patent/WO2000008900A1/fr
Publication of FR2782230A1 publication Critical patent/FR2782230A1/fr
Application granted granted Critical
Publication of FR2782230B1 publication Critical patent/FR2782230B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR9810151A 1998-08-06 1998-08-06 Carte de circuits imprimes Expired - Fee Related FR2782230B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9810151A FR2782230B1 (fr) 1998-08-06 1998-08-06 Carte de circuits imprimes
EP99936698A EP1103169A1 (fr) 1998-08-06 1999-08-05 Carte de circuits imprimes
PCT/FR1999/001943 WO2000008900A1 (fr) 1998-08-06 1999-08-05 Carte de circuits imprimes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9810151A FR2782230B1 (fr) 1998-08-06 1998-08-06 Carte de circuits imprimes

Publications (2)

Publication Number Publication Date
FR2782230A1 FR2782230A1 (fr) 2000-02-11
FR2782230B1 true FR2782230B1 (fr) 2000-09-08

Family

ID=9529492

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9810151A Expired - Fee Related FR2782230B1 (fr) 1998-08-06 1998-08-06 Carte de circuits imprimes

Country Status (3)

Country Link
EP (1) EP1103169A1 (fr)
FR (1) FR2782230B1 (fr)
WO (1) WO2000008900A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069646B2 (en) 2000-06-19 2006-07-04 Nortel Networks Limited Techniques for reducing the number of layers in a multilayer signal routing device
US7281326B1 (en) 2000-06-19 2007-10-16 Nortel Network Limited Technique for routing conductive traces between a plurality of electronic components of a multilayer signal routing device
US7256354B2 (en) 2000-06-19 2007-08-14 Wyrzykowska Aneta O Technique for reducing the number of layers in a multilayer circuit board
US7069650B2 (en) * 2000-06-19 2006-07-04 Nortel Networks Limited Method for reducing the number of layers in a multilayer signal routing device
US7259336B2 (en) 2000-06-19 2007-08-21 Nortel Networks Limited Technique for improving power and ground flooding

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages
JP3050807B2 (ja) * 1996-06-19 2000-06-12 イビデン株式会社 多層プリント配線板

Also Published As

Publication number Publication date
EP1103169A1 (fr) 2001-05-30
FR2782230A1 (fr) 2000-02-11
WO2000008900A1 (fr) 2000-02-17

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Legal Events

Date Code Title Description
ST Notification of lapse