FR2771321B1 - Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede - Google Patents

Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede

Info

Publication number
FR2771321B1
FR2771321B1 FR9714849A FR9714849A FR2771321B1 FR 2771321 B1 FR2771321 B1 FR 2771321B1 FR 9714849 A FR9714849 A FR 9714849A FR 9714849 A FR9714849 A FR 9714849A FR 2771321 B1 FR2771321 B1 FR 2771321B1
Authority
FR
France
Prior art keywords
assembling
structures
assembly obtained
soldering
cord
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9714849A
Other languages
English (en)
Other versions
FR2771321A1 (fr
Inventor
Guy Parat
Alexandra Cobbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR9714849A priority Critical patent/FR2771321B1/fr
Priority to EP98955739A priority patent/EP1034061A1/fr
Priority to PCT/FR1998/002525 priority patent/WO1999026752A1/fr
Priority to JP2000521941A priority patent/JP2001523584A/ja
Publication of FR2771321A1 publication Critical patent/FR2771321A1/fr
Application granted granted Critical
Publication of FR2771321B1 publication Critical patent/FR2771321B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Lasers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9714849A 1997-11-26 1997-11-26 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede Expired - Fee Related FR2771321B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9714849A FR2771321B1 (fr) 1997-11-26 1997-11-26 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede
EP98955739A EP1034061A1 (fr) 1997-11-26 1998-11-25 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede
PCT/FR1998/002525 WO1999026752A1 (fr) 1997-11-26 1998-11-25 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede
JP2000521941A JP2001523584A (ja) 1997-11-26 1998-11-25 ２つの構造をはんだビードを用いて組み立てる方法および該方法によって得られた組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9714849A FR2771321B1 (fr) 1997-11-26 1997-11-26 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede

Publications (2)

Publication Number Publication Date
FR2771321A1 FR2771321A1 (fr) 1999-05-28
FR2771321B1 true FR2771321B1 (fr) 1999-12-17

Family

ID=9513806

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9714849A Expired - Fee Related FR2771321B1 (fr) 1997-11-26 1997-11-26 Procede d'assemblage de deux structures par un cordon de brasure et assemblage obtenu par ce procede

Country Status (4)

Country Link
EP (1) EP1034061A1 (fr)
JP (1) JP2001523584A (fr)
FR (1) FR2771321B1 (fr)
WO (1) WO1999026752A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2895924B1 (fr) 2006-01-10 2009-09-25 Valeo Electronique Sys Liaison Procede de brasage entre eux d'au moins deux organes empiles

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255839A (en) * 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
JPH06295937A (ja) * 1993-03-26 1994-10-21 Nec Corp 光電素子の実装方法
NL9400508A (nl) * 1994-03-30 1995-11-01 Hans Peter Peloschek Werkwijze voor het monteren van elektronische componenten middels solderbumps en toepassingen en voortbrengselen hiervan.

Also Published As

Publication number Publication date
EP1034061A1 (fr) 2000-09-13
FR2771321A1 (fr) 1999-05-28
WO1999026752A1 (fr) 1999-06-03
JP2001523584A (ja) 2001-11-27

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Legal Events

Date Code Title Description
ST Notification of lapse