DE59709933D1 - Leiterplattenprüfvorrichtung - Google Patents
LeiterplattenprüfvorrichtungInfo
- Publication number
- DE59709933D1 DE59709933D1 DE59709933T DE59709933T DE59709933D1 DE 59709933 D1 DE59709933 D1 DE 59709933D1 DE 59709933 T DE59709933 T DE 59709933T DE 59709933 T DE59709933 T DE 59709933T DE 59709933 D1 DE59709933 D1 DE 59709933D1
- Authority
- DE
- Germany
- Prior art keywords
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19728427 | 1997-07-03 | ||
DE19730516A DE19730516A1 (de) | 1997-07-03 | 1997-07-16 | Leiterplattenprüfvorrichtung |
PCT/EP1997/005656 WO1999001772A1 (de) | 1997-07-03 | 1997-10-15 | Leiterplattenprüfvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59709933D1 true DE59709933D1 (de) | 2003-05-28 |
Family
ID=7834530
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19730516A Withdrawn DE19730516A1 (de) | 1997-07-03 | 1997-07-16 | Leiterplattenprüfvorrichtung |
DE59709933T Expired - Fee Related DE59709933D1 (de) | 1997-07-03 | 1997-10-15 | Leiterplattenprüfvorrichtung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19730516A Withdrawn DE19730516A1 (de) | 1997-07-03 | 1997-07-16 | Leiterplattenprüfvorrichtung |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE19730516A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6191600B1 (en) * | 1999-01-22 | 2001-02-20 | Delaware Capital Formation, Inc. | Scan test apparatus for continuity testing of bare printed circuit boards |
US6788078B2 (en) | 2001-11-16 | 2004-09-07 | Delaware Capital Formation, Inc. | Apparatus for scan testing printed circuit boards |
-
1997
- 1997-07-16 DE DE19730516A patent/DE19730516A1/de not_active Withdrawn
- 1997-10-15 DE DE59709933T patent/DE59709933D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19730516A1 (de) | 1999-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: LUTHER & MAELZER GMBH & CO. KG, 31515 WUNSTORF, DE |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |