FR2741503B1 - Agencement de plusieurs composants electriques disposes dans un boitier - Google Patents

Agencement de plusieurs composants electriques disposes dans un boitier

Info

Publication number
FR2741503B1
FR2741503B1 FR9614029A FR9614029A FR2741503B1 FR 2741503 B1 FR2741503 B1 FR 2741503B1 FR 9614029 A FR9614029 A FR 9614029A FR 9614029 A FR9614029 A FR 9614029A FR 2741503 B1 FR2741503 B1 FR 2741503B1
Authority
FR
France
Prior art keywords
arrangement
case
electrical components
components arranged
several electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9614029A
Other languages
English (en)
French (fr)
Other versions
FR2741503A1 (fr
Inventor
Matthias Brand
Helmut Plener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Seuffer GmbH and Co KG
Original Assignee
Robert Seuffer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Seuffer GmbH and Co KG filed Critical Robert Seuffer GmbH and Co KG
Publication of FR2741503A1 publication Critical patent/FR2741503A1/fr
Application granted granted Critical
Publication of FR2741503B1 publication Critical patent/FR2741503B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9614029A 1995-11-20 1996-11-18 Agencement de plusieurs composants electriques disposes dans un boitier Expired - Fee Related FR2741503B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19543260A DE19543260C2 (de) 1995-11-20 1995-11-20 Elektrische Bauelementeanordnung mit mehreren in einem Gehäuse angeordneten elektrischen Bauelementen

Publications (2)

Publication Number Publication Date
FR2741503A1 FR2741503A1 (fr) 1997-05-23
FR2741503B1 true FR2741503B1 (fr) 1998-11-06

Family

ID=7777947

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9614029A Expired - Fee Related FR2741503B1 (fr) 1995-11-20 1996-11-18 Agencement de plusieurs composants electriques disposes dans un boitier

Country Status (3)

Country Link
DE (1) DE19543260C2 (de)
FR (1) FR2741503B1 (de)
IT (1) IT1288274B1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19722602C2 (de) * 1997-05-30 2001-03-29 Lenze Gmbh & Co Kg Aerzen Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
FR2818491B1 (fr) * 2000-12-19 2004-03-12 Siemens Ag Dispositif de refroidissement pour circuit electronique et procede de realisation de ce dispositif
US7190589B2 (en) 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
DE102005036966A1 (de) * 2005-08-05 2007-02-22 Robert Seuffer Gmbh & Co. Kg Elektrische Bauelementanordnung
DE102006018716A1 (de) 2006-04-20 2007-10-25 Ebm-Papst Mulfingen Gmbh & Co. Kg Anordnung zur Kontaktierung von Leistungshalbleitern an einer Kühlfläche
DE102006039506B3 (de) * 2006-08-23 2008-01-03 Siemens Ag Österreich Kühlanordnung
JP4548517B2 (ja) * 2008-05-26 2010-09-22 株式会社豊田自動織機 発熱部品の実装構造及び実装方法
DE102015202142A1 (de) 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
CN108336892B (zh) 2017-05-25 2021-11-16 泰达电子股份有限公司 电源模块及其组装结构与组装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
DE3703088C2 (de) * 1987-02-03 1995-10-19 Vdo Schindling Gehäuse zur Aufnahme von zumindest einer Leiterplatte
DE3906973A1 (de) * 1989-03-04 1990-09-13 Telefunken Electronic Gmbh Gehaeuse fuer kfz-elektronik
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5225965A (en) * 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
DE4242944C2 (de) * 1992-12-18 2002-04-25 Bosch Gmbh Robert Elektrisches Steuergerät
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
DE4338392C2 (de) * 1993-11-10 2003-02-06 Philips Corp Intellectual Pty Anordnung zur Wärmeabfuhr von auf eine Platine gelöteten elektrischen Bauelementen

Also Published As

Publication number Publication date
FR2741503A1 (fr) 1997-05-23
DE19543260A1 (de) 1997-05-22
DE19543260C2 (de) 2001-09-20
ITBZ960052A1 (it) 1998-05-20
ITBZ960052A0 (it) 1996-11-20
IT1288274B1 (it) 1998-09-11

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse

Effective date: 20160729