IT1288274B1 - Disposizione elettrica di componenti con piu' componenti elettrici disposti in un alloggiamento. - Google Patents
Disposizione elettrica di componenti con piu' componenti elettrici disposti in un alloggiamento.Info
- Publication number
- IT1288274B1 IT1288274B1 IT96BZ000052A ITBZ960052A IT1288274B1 IT 1288274 B1 IT1288274 B1 IT 1288274B1 IT 96BZ000052 A IT96BZ000052 A IT 96BZ000052A IT BZ960052 A ITBZ960052 A IT BZ960052A IT 1288274 B1 IT1288274 B1 IT 1288274B1
- Authority
- IT
- Italy
- Prior art keywords
- components
- electrical
- arrangemented
- housing
- arrangement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19543260A DE19543260C2 (de) | 1995-11-20 | 1995-11-20 | Elektrische Bauelementeanordnung mit mehreren in einem Gehäuse angeordneten elektrischen Bauelementen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITBZ960052A0 ITBZ960052A0 (it) | 1996-11-20 |
| ITBZ960052A1 ITBZ960052A1 (it) | 1998-05-20 |
| IT1288274B1 true IT1288274B1 (it) | 1998-09-11 |
Family
ID=7777947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT96BZ000052A IT1288274B1 (it) | 1995-11-20 | 1996-11-20 | Disposizione elettrica di componenti con piu' componenti elettrici disposti in un alloggiamento. |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19543260C2 (de) |
| FR (1) | FR2741503B1 (de) |
| IT (1) | IT1288274B1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19722602C2 (de) * | 1997-05-30 | 2001-03-29 | Lenze Gmbh & Co Kg Aerzen | Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen |
| FR2818491B1 (fr) * | 2000-12-19 | 2004-03-12 | Siemens Ag | Dispositif de refroidissement pour circuit electronique et procede de realisation de ce dispositif |
| US7190589B2 (en) | 2004-10-19 | 2007-03-13 | Cinch Connectors, Inc. | Electronic control enclosure |
| DE102005036966A1 (de) * | 2005-08-05 | 2007-02-22 | Robert Seuffer Gmbh & Co. Kg | Elektrische Bauelementanordnung |
| DE102006018716A1 (de) | 2006-04-20 | 2007-10-25 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Anordnung zur Kontaktierung von Leistungshalbleitern an einer Kühlfläche |
| DE102006039506B3 (de) * | 2006-08-23 | 2008-01-03 | Siemens Ag Österreich | Kühlanordnung |
| JP4548517B2 (ja) * | 2008-05-26 | 2010-09-22 | 株式会社豊田自動織機 | 発熱部品の実装構造及び実装方法 |
| DE102015202142A1 (de) | 2015-02-06 | 2016-08-11 | Mahle International Gmbh | Elektrische Einrichtung |
| CN108336892B (zh) | 2017-05-25 | 2021-11-16 | 泰达电子股份有限公司 | 电源模块及其组装结构与组装方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4707726A (en) * | 1985-04-29 | 1987-11-17 | United Technologies Automotive, Inc. | Heat sink mounting arrangement for a semiconductor |
| DE3703088C2 (de) * | 1987-02-03 | 1995-10-19 | Vdo Schindling | Gehäuse zur Aufnahme von zumindest einer Leiterplatte |
| DE3906973A1 (de) * | 1989-03-04 | 1990-09-13 | Telefunken Electronic Gmbh | Gehaeuse fuer kfz-elektronik |
| US5274193A (en) * | 1992-04-24 | 1993-12-28 | Chrysler Corporation | Heat sink spring and wedge assembly |
| US5225965A (en) * | 1992-04-24 | 1993-07-06 | Chrysler Corporation | Heat sink load spring assembly |
| DE4242944C2 (de) * | 1992-12-18 | 2002-04-25 | Bosch Gmbh Robert | Elektrisches Steuergerät |
| US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
| DE4338392C2 (de) * | 1993-11-10 | 2003-02-06 | Philips Corp Intellectual Pty | Anordnung zur Wärmeabfuhr von auf eine Platine gelöteten elektrischen Bauelementen |
-
1995
- 1995-11-20 DE DE19543260A patent/DE19543260C2/de not_active Expired - Lifetime
-
1996
- 1996-11-18 FR FR9614029A patent/FR2741503B1/fr not_active Expired - Fee Related
- 1996-11-20 IT IT96BZ000052A patent/IT1288274B1/it active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| FR2741503A1 (fr) | 1997-05-23 |
| DE19543260A1 (de) | 1997-05-22 |
| DE19543260C2 (de) | 2001-09-20 |
| FR2741503B1 (fr) | 1998-11-06 |
| ITBZ960052A1 (it) | 1998-05-20 |
| ITBZ960052A0 (it) | 1996-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted |