FR2680284B1 - Dispositif de connexion a tres faible pas et procede de fabrication. - Google Patents

Dispositif de connexion a tres faible pas et procede de fabrication.

Info

Publication number
FR2680284B1
FR2680284B1 FR9110178A FR9110178A FR2680284B1 FR 2680284 B1 FR2680284 B1 FR 2680284B1 FR 9110178 A FR9110178 A FR 9110178A FR 9110178 A FR9110178 A FR 9110178A FR 2680284 B1 FR2680284 B1 FR 2680284B1
Authority
FR
France
Prior art keywords
manufacturing
connection device
low pit
pit connection
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9110178A
Other languages
English (en)
Other versions
FR2680284A1 (fr
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9110178A priority Critical patent/FR2680284B1/fr
Publication of FR2680284A1 publication Critical patent/FR2680284A1/fr
Application granted granted Critical
Publication of FR2680284B1 publication Critical patent/FR2680284B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
FR9110178A 1991-08-09 1991-08-09 Dispositif de connexion a tres faible pas et procede de fabrication. Expired - Fee Related FR2680284B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9110178A FR2680284B1 (fr) 1991-08-09 1991-08-09 Dispositif de connexion a tres faible pas et procede de fabrication.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9110178A FR2680284B1 (fr) 1991-08-09 1991-08-09 Dispositif de connexion a tres faible pas et procede de fabrication.

Publications (2)

Publication Number Publication Date
FR2680284A1 FR2680284A1 (fr) 1993-02-12
FR2680284B1 true FR2680284B1 (fr) 1993-12-03

Family

ID=9416097

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9110178A Expired - Fee Related FR2680284B1 (fr) 1991-08-09 1991-08-09 Dispositif de connexion a tres faible pas et procede de fabrication.

Country Status (1)

Country Link
FR (1) FR2680284B1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049976A (en) 1993-11-16 2000-04-18 Formfactor, Inc. Method of mounting free-standing resilient electrical contact structures to electronic components
US6655023B1 (en) 1993-11-16 2003-12-02 Formfactor, Inc. Method and apparatus for burning-in semiconductor devices in wafer form
US7737709B2 (en) 2000-03-17 2010-06-15 Formfactor, Inc. Methods for planarizing a semiconductor contactor
US7948252B2 (en) 2001-07-11 2011-05-24 Formfactor, Inc. Multilayered probe card
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
CN105789939A (zh) * 2016-03-08 2016-07-20 广东明路电力电子有限公司 五金弹性触头

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0792517B1 (fr) * 1994-11-15 2003-10-22 Formfactor, Inc. Structures de contact electrique obtenues par configuration d'un fil souple
EP0792519B1 (fr) * 1994-11-15 2003-03-26 Formfactor, Inc. Elements d'interconnexion pour composants micro-electroniques
EP0795200B1 (fr) * 1994-11-15 2007-10-24 FormFactor, Inc. Montage de composants electroniques sur une carte a circuits imprimees
KR100335167B1 (ko) * 1994-11-15 2002-05-04 이고르 와이. 칸드로스 반도체 장치를 시험하는 방법
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
JP2004500699A (ja) * 1999-05-27 2004-01-08 ナノネクサス　インコーポレイテッド 集積回路ウェーハのプローブカード組立体の構造および製造方法
DE10001956C1 (de) * 2000-01-18 2001-10-31 Kostal Leopold Gmbh & Co Kg Elektrisches Verbindungsglied sowie elektrischer Verbinder mit einem solchen Verbindungsglied
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof
JP2002063961A (ja) * 2000-06-07 2002-02-28 Yazaki Corp 雌端子、及び、雌端子と雄端子との接続構造
DE10034613A1 (de) * 2000-07-17 2002-01-31 Kostal Leopold Gmbh & Co Kg Anordnung zum lötfreien elektrischen Verbinden von zwei elektrischen Flachleitungen sowie Verbindungssystem zum Erstellen einer solchen Anordnung
DE10304324B4 (de) * 2003-02-04 2005-01-27 Festo Ag & Co Elektrische Anschlussvorrichtung
KR100443999B1 (ko) 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
EP3673541B1 (fr) * 2017-08-23 2023-10-11 Samtec, Inc. Réceptacle d'émetteur-récepteur doté d'une cage emi et d'attaches de lunette qui offrent une efficacité de protection élevée

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB866052A (en) * 1957-04-18 1961-04-26 Ass Elect Ind Improvements relating to electrical connections
FR1449649A (fr) * 1965-04-14 1966-05-06 Radiotechnique Connecteur pour contacts plans répartis à des niveaux différents
FR2305095A1 (fr) * 1975-03-20 1976-10-15 Bonhomme F R Perfectionnements aux dispositifs de connexion pour cartes a circuits imprimes
US4983126A (en) * 1989-06-15 1991-01-08 Siemens Aktiengesellschaft Apparatus for electrical connection of insertable electrical assemblies

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049976A (en) 1993-11-16 2000-04-18 Formfactor, Inc. Method of mounting free-standing resilient electrical contact structures to electronic components
US6215670B1 (en) 1993-11-16 2001-04-10 Formfactor, Inc. Method for manufacturing raised electrical contact pattern of controlled geometry
US6538214B2 (en) 1993-11-16 2003-03-25 Formfactor, Inc. Method for manufacturing raised electrical contact pattern of controlled geometry
US6655023B1 (en) 1993-11-16 2003-12-02 Formfactor, Inc. Method and apparatus for burning-in semiconductor devices in wafer form
US6818840B2 (en) 1993-11-16 2004-11-16 Formfactor, Inc. Method for manufacturing raised electrical contact pattern of controlled geometry
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US7737709B2 (en) 2000-03-17 2010-06-15 Formfactor, Inc. Methods for planarizing a semiconductor contactor
US8427183B2 (en) 2000-03-17 2013-04-23 Formfactor, Inc. Probe card assembly having an actuator for bending the probe substrate
US7948252B2 (en) 2001-07-11 2011-05-24 Formfactor, Inc. Multilayered probe card
CN105789939A (zh) * 2016-03-08 2016-07-20 广东明路电力电子有限公司 五金弹性触头
CN105789939B (zh) * 2016-03-08 2018-10-26 广东明路电力电子有限公司 五金弹性触头

Also Published As

Publication number Publication date
FR2680284A1 (fr) 1993-02-12

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