FR2668302B1 - Boitier comportant un ou plusieurs circuits integres et procede de fabrication de ce boitier. - Google Patents

Boitier comportant un ou plusieurs circuits integres et procede de fabrication de ce boitier.

Info

Publication number
FR2668302B1
FR2668302B1 FR9112819A FR9112819A FR2668302B1 FR 2668302 B1 FR2668302 B1 FR 2668302B1 FR 9112819 A FR9112819 A FR 9112819A FR 9112819 A FR9112819 A FR 9112819A FR 2668302 B1 FR2668302 B1 FR 2668302B1
Authority
FR
France
Prior art keywords
housing
manufacturing
integrated circuits
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9112819A
Other languages
English (en)
Other versions
FR2668302A1 (fr
Inventor
Mitsuru Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2668302A1 publication Critical patent/FR2668302A1/fr
Application granted granted Critical
Publication of FR2668302B1 publication Critical patent/FR2668302B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
FR9112819A 1990-10-17 1991-10-17 Boitier comportant un ou plusieurs circuits integres et procede de fabrication de ce boitier. Expired - Fee Related FR2668302B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2278107A JP2623952B2 (ja) 1990-10-17 1990-10-17 集積回路パッケージ

Publications (2)

Publication Number Publication Date
FR2668302A1 FR2668302A1 (fr) 1992-04-24
FR2668302B1 true FR2668302B1 (fr) 1998-07-17

Family

ID=17592726

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9112819A Expired - Fee Related FR2668302B1 (fr) 1990-10-17 1991-10-17 Boitier comportant un ou plusieurs circuits integres et procede de fabrication de ce boitier.

Country Status (2)

Country Link
JP (1) JP2623952B2 (fr)
FR (1) FR2668302B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685003A (ja) * 1992-09-01 1994-03-25 Nec Corp 半導体装置およびその製造方法
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519000Y2 (fr) * 1974-09-13 1980-05-06
DE2938096A1 (de) * 1979-09-20 1981-04-02 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiterbauelement
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
JPS61170054A (ja) * 1985-01-23 1986-07-31 Mitsubishi Electric Corp クリツプリ−ド
JPS6284931U (fr) * 1985-11-19 1987-05-30
JPS63142857U (fr) * 1987-03-11 1988-09-20
JPH01283948A (ja) * 1988-05-11 1989-11-15 Hitachi Ltd 樹脂封止型半導体装置
JP2581592B2 (ja) * 1988-09-16 1997-02-12 株式会社日立製作所 フレキシブルピンキャリア及びそれを使用した半導体装置
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package

Also Published As

Publication number Publication date
JPH04152662A (ja) 1992-05-26
FR2668302A1 (fr) 1992-04-24
JP2623952B2 (ja) 1997-06-25

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090630