FR2667981B1 - - Google Patents
Info
- Publication number
- FR2667981B1 FR2667981B1 FR9012607A FR9012607A FR2667981B1 FR 2667981 B1 FR2667981 B1 FR 2667981B1 FR 9012607 A FR9012607 A FR 9012607A FR 9012607 A FR9012607 A FR 9012607A FR 2667981 B1 FR2667981 B1 FR 2667981B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Products (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9012607A FR2667981A1 (fr) | 1990-10-12 | 1990-10-12 | Procede d'assemblage de deux couches constituees de materiaux differents et son application a l'encapsulation hermetique de circuits hybrides. |
| EP91402675A EP0481846A1 (fr) | 1990-10-12 | 1991-10-08 | Procédé d'assemblage d'un capot métallique sur un substrat portant un circuit intégré |
| JP3290921A JPH04280654A (ja) | 1990-10-12 | 1991-10-09 | 集積回路を有する基板上への金属容器の組立て法 |
| US07/774,346 US5201456A (en) | 1990-10-12 | 1991-10-10 | Process for assembly of a metal can on a substrate bearing an integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9012607A FR2667981A1 (fr) | 1990-10-12 | 1990-10-12 | Procede d'assemblage de deux couches constituees de materiaux differents et son application a l'encapsulation hermetique de circuits hybrides. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2667981A1 FR2667981A1 (fr) | 1992-04-17 |
| FR2667981B1 true FR2667981B1 (US06299757-20011009-C00006.png) | 1997-02-28 |
Family
ID=9401166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9012607A Granted FR2667981A1 (fr) | 1990-10-12 | 1990-10-12 | Procede d'assemblage de deux couches constituees de materiaux differents et son application a l'encapsulation hermetique de circuits hybrides. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5201456A (US06299757-20011009-C00006.png) |
| EP (1) | EP0481846A1 (US06299757-20011009-C00006.png) |
| JP (1) | JPH04280654A (US06299757-20011009-C00006.png) |
| FR (1) | FR2667981A1 (US06299757-20011009-C00006.png) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2758630B1 (fr) * | 1997-01-21 | 1999-04-09 | Thomson Tubes Electroniques | Procede de scellement etanche d'un detecteur de rayonnement a l'etat solide et detecteur obtenu par ce procede |
| US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
| US6342407B1 (en) | 2000-12-07 | 2002-01-29 | International Business Machines Corporation | Low stress hermetic seal |
| US7743963B1 (en) | 2005-03-01 | 2010-06-29 | Amerasia International Technology, Inc. | Solderable lid or cover for an electronic circuit |
| US10632168B2 (en) | 2017-04-06 | 2020-04-28 | Sustain Holdings, Llc | Collagen peptide-based medicament compositions and devices and methods of production and use thereof |
| JP2022530402A (ja) | 2019-04-22 | 2022-06-29 | サステイン ホールディングス，エルエルシー | コラーゲン・ペプチド系医薬組成物および装置、ならびにそれらの製造方法および使用 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3020182A (en) * | 1958-09-26 | 1962-02-06 | Gen Electric | Ceramic-to-metal seal and method of making the same |
| GB1431919A (en) * | 1973-08-15 | 1976-04-14 | Atomic Energy Authority Uk | Microcircuit packages |
| GB1468973A (en) * | 1975-07-18 | 1977-03-30 | Atomic Energy Authority Uk | Microcircuit packages |
| US4338380A (en) * | 1976-04-05 | 1982-07-06 | Brunswick Corporation | Method of attaching ceramics to metals for high temperature operation and laminated composite |
| JPS60110156A (ja) * | 1983-11-21 | 1985-06-15 | Hitachi Ltd | 固体撮像素子の製造方法 |
| EP0178481B1 (en) * | 1984-09-19 | 1993-02-10 | Olin Corporation | Hermetically sealed semiconductor package |
| JPS61193473A (ja) * | 1985-02-21 | 1986-08-27 | Fujitsu Ltd | 積層回路基板のピンリ−ド |
| US4704626A (en) * | 1985-07-08 | 1987-11-03 | Olin Corporation | Graded sealing systems for semiconductor package |
| JPS62241356A (ja) * | 1986-04-14 | 1987-10-22 | Hitachi Ltd | 半導体パツケ−ジ |
-
1990
- 1990-10-12 FR FR9012607A patent/FR2667981A1/fr active Granted
-
1991
- 1991-10-08 EP EP91402675A patent/EP0481846A1/fr not_active Withdrawn
- 1991-10-09 JP JP3290921A patent/JPH04280654A/ja not_active Withdrawn
- 1991-10-10 US US07/774,346 patent/US5201456A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04280654A (ja) | 1992-10-06 |
| US5201456A (en) | 1993-04-13 |
| EP0481846A1 (fr) | 1992-04-22 |
| FR2667981A1 (fr) | 1992-04-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |