FR2655508A1 - Method of producing boxes with several compartments for encapsulation of microelectronic circuits - Google Patents

Method of producing boxes with several compartments for encapsulation of microelectronic circuits Download PDF

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Publication number
FR2655508A1
FR2655508A1 FR8915845A FR8915845A FR2655508A1 FR 2655508 A1 FR2655508 A1 FR 2655508A1 FR 8915845 A FR8915845 A FR 8915845A FR 8915845 A FR8915845 A FR 8915845A FR 2655508 A1 FR2655508 A1 FR 2655508A1
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FR
France
Prior art keywords
compartments
encapsulation
common wall
metals
encapsulation box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8915845A
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French (fr)
Other versions
FR2655508B1 (en
Inventor
Prouteau Jean Pierre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEPT DOLOY SA
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SEPT DOLOY SA
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Filing date
Publication date
Application filed by SEPT DOLOY SA filed Critical SEPT DOLOY SA
Priority to FR8915845A priority Critical patent/FR2655508B1/en
Publication of FR2655508A1 publication Critical patent/FR2655508A1/en
Application granted granted Critical
Publication of FR2655508B1 publication Critical patent/FR2655508B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The present invention relates to the manufacture of the body of hermetic boxes used for encapsulation of integrated circuits used in microelectronics. It consists in producing the body of the box by brazing a common wall 1 slid between two slots 5 and 6 milled into a rectangular frame 9 constituting the periphery of the box. This technology has the advantages of being of low cost, of allowing precise positioning of the common wall 1 and of leaving the choice of the metal of this wall independent of that of the periphery of the box.

Description

La présente invention s'applique à la fabrication de boîtiers métal liques à sorties multiples, isolantes et hermétiques, destinés à l'encapsulation des circuits intégrés, employés en microélectronique. The present invention applies to the manufacture of metal enclosures with multiple outputs, insulating and hermetic, intended for the encapsulation of integrated circuits, used in microelectronics.

Il est souvent indispensable pour des raisons d'encombrement et afin de réduire au minimum la longueur des connexions, d'utiliser des boîtiers comportant des compartiments superposés, séparés par une paroi commune. It is often essential for reasons of space and in order to minimize the length of the connections, to use boxes comprising superimposed compartments, separated by a common wall.

L'objet de la présente invention est la réalisation du corps métallique de ces boîtiers. The object of the present invention is the production of the metal body of these housings.

La figure 1 montre un tel boîtier, le pointillé accentué indiquant -la position de la cloison commune 1 sur laquelle seront fixés, de part et d'autre, les circuits à protéger qui seront raccordés aux différentes sorties isolantes hermétiques 2, situées sur le pourtour d'un ou des deux compartiments et aux traversées isolantes hermétiques dans la paroi commune (et/ou dans d'éventuelles cloisons du ou des compartiments) - L'encapsulation se terminera par la soudure de couvercles sur chacune des deux faces 3 et 4. Figure 1 shows such a housing, the accented dotted line indicating -the position of the common partition 1 on which will be fixed, on both sides, the circuits to be protected which will be connected to the various hermetic insulating outputs 2, located on the periphery one or two compartments and the hermetic insulating crossings in the common wall (and / or in any partitions of the compartment or compartments) - The encapsulation will end with the welding of covers on each of the two faces 3 and 4.

La figure 2 montre le même boîtier coupé par un plan perpendiculaire à la paroi commune. Figure 2 shows the same housing cut by a plane perpendicular to the common wall.

Suivant la technique connue, la réalisation du corps d'un tel boîtier -se fait: - par usinage dans un bloc parallélipipédique de métal, méthode très onéreu
se en matière et en temps d'usinage, - par brasage d'une paroi à l'intérieur d'un cadre métallique rectangulai
re, cette paroi étant positionnée par un calibre de brasage.According to the known technique, the production of the body of such a housing is done: - by machining in a parallelepipedal block of metal, a very expensive method
in terms of material and machining time, - by brazing a wall inside a rectangular metal frame
re, this wall being positioned by a brazing gauge.

- Cette dernière méthode est délicate à mettre en oeuvre, en parti ou lier pour obtenir un positionnement précis de la paroi commune.- This last method is difficult to implement, in part or to link to obtain a precise positioning of the common wall.

Suivant la présente invention, illustrée par la figure 3, le corps du boîtier est obtenu par fraisage, à la position voulue, d'une fente 5 et 6 dans chacun des petits côtés 7 et 8, d'un cadre métallique rectangulaire -9. La largeur de ces fentes est égale à l'épaisseur de la paroi commune, dont la largeur est égale à la largeur intérieure du cadre rectangulaire 9.  According to the present invention, illustrated in Figure 3, the body of the housing is obtained by milling, in the desired position, a slot 5 and 6 in each of the short sides 7 and 8, of a rectangular metal frame -9. The width of these slots is equal to the thickness of the common wall, the width of which is equal to the interior width of the rectangular frame 9.

La longueur de cette paroi commune est plus grande que celle du cadre rectangulaire 9 afin de constituer, de part et d'autre du cadre les pattes de fixation.
Cette paroi commune 1 est ensuite glissée en bout dans la fente d'un côté et poussée jusqu'à ce qu'elle s'engage dans la fente du côté opposé. L'ensemble est ensuite brasé au four dans un calibre très simple.The length of this common wall is greater than that of the rectangular frame 9 in order to constitute, on either side of the frame, the fixing lugs.
This common wall 1 is then slid at the end into the slot on one side and pushed until it engages in the slot on the opposite side. The whole is then brazed in the oven in a very simple size.

La figure 4 montre le boîtier terminé.Figure 4 shows the finished case.

Pour la réalisation de boîtiers complexes, des cloisons transversales peuvent être brasées dans un ou les deux compartiments du corps du boîtier en même temps que la paroi commune. For the production of complex boxes, transverse partitions can be brazed in one or both compartments of the body of the box at the same time as the common wall.

L'usinage des divers trous nécessaires au scellement des sorties isolantes hermétiques peut se faire avant ou après assemblage par brasage. The machining of the various holes necessary for sealing the hermetic insulating outlets can be done before or after assembly by brazing.

Cette technique de réalisation peut s'appliquer à tous les métaux, métaux composites, métaux co-laminés ou alliages utilisés pour la fabrication des boîtiers d'encapsulation. La paroi commune 1 peut être constituée par le même métal que l'anneau rectangulaire périphérique ou par un autre métal. This production technique can be applied to all metals, composite metals, co-laminated metals or alloys used for the manufacture of encapsulation packages. The common wall 1 can be formed by the same metal as the peripheral rectangular ring or by another metal.

Les avantages de cette technologie sont: - une économie importante sur la matière et le temps d'usinage, - un positionnement précis de la paroi commune 1, sans nécessité d'em
ployer des calibres de brasage complexes, - la possibilité d'employer des métaux différents pour la paroi commune
1 et l'anneau périphérique ce qui permet le choix le plus judicieux
du métal de la paroi commune 1 pour le type de circuits à encapsuler. The advantages of this technology are: - significant savings in terms of material and machining time, - precise positioning of the common wall 1, without the need for em
bending complex brazing sizes, - the possibility of using different metals for the common wall
1 and the peripheral ring which allows the wisest choice
of the metal of the common wall 1 for the type of circuits to be encapsulated.

Claims (4)

REVENDICATIONS re (9) (figure 3.). re (9) (figure 3.). cun des petits côtés (7,8) du pourtour constitué par un cadre rectangulai one of the short sides (7,8) of the circumference constituted by a rectangular frame ge d'une paroi commune (1) glissée dans une fente (5,6) fraisée sur cha age of a common wall (1) slid into a slot (5,6) milled on cha microélectroniques dont le corps du boîtier est caractérisé par le brasa microelectronics whose housing body is characterized by the brasa boîtier d'encapsulation à deux ou plusieurs compartiments pour circuits encapsulation box with two or more compartments for circuits 2 Boîtier d'encapsulation suivant la revendication 1, caractérisé par le 2 encapsulation box according to claim 1, characterized by fait que la paroi commune et le pourtour du boîtier sont constitués par fact that the common wall and the periphery of the housing are constituted by des métaux, des métaux composites, des métaux co-laminés ou des alliages metals, composite metals, co-laminated metals or alloys différents. different. 3 Boîtier d'encapsulation suivant l'une des revendicationsl et 9, caracté3 encapsulation box according to one of claimsl and 9, character risé par le fait que de petites cloisons brasées peuvent délimiter dans laughed at by the fact that small brazed partitions can delimit in l'un ou les deux compartiments principaux des enclos plus petits. one or both of the main compartments of the smaller enclosures. 4 Boîtier d'encapsulation suivant l'une des revendications 1 à 3, caracté4 encapsulation box according to one of claims 1 to 3, character risé par le fait, qu'en plus des sorties isolantes hermétiques (2) (figu laughed at by the fact that in addition to the hermetic insulating outputs (2) (fig re 1) situées sur le pourtour d'un ou des deux compartiments, il existe re 1) located around one or both compartments, there are aussi des traversées isolantes hermétiques dans la paroicommune et/ou also hermetic insulating crossings in the common and / or les cloisons du ou des deux compartiments.  the partitions of the two compartments.
FR8915845A 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. Expired - Fee Related FR2655508B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8915845A FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8915845A FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Publications (2)

Publication Number Publication Date
FR2655508A1 true FR2655508A1 (en) 1991-06-07
FR2655508B1 FR2655508B1 (en) 1996-04-19

Family

ID=9388010

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8915845A Expired - Fee Related FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Country Status (1)

Country Link
FR (1) FR2655508B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7224452U (en) * 1972-06-30 1972-11-30 Licentia Shielding can
GB2001805A (en) * 1977-07-25 1979-02-07 Atari Inc Oscillator-modulator apparatus and method therefor
EP0105717A2 (en) * 1982-09-30 1984-04-18 Fujitsu Limited An electronic device comprising integrated circuits
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7224452U (en) * 1972-06-30 1972-11-30 Licentia Shielding can
GB2001805A (en) * 1977-07-25 1979-02-07 Atari Inc Oscillator-modulator apparatus and method therefor
EP0105717A2 (en) * 1982-09-30 1984-04-18 Fujitsu Limited An electronic device comprising integrated circuits
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry

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Publication number Publication date
FR2655508B1 (en) 1996-04-19

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