FR2689681A1 - Mfg. multiple compartment boxes for encapsulating micro-circuits - by assembling each compartment by pressing and punching and welding together back-to-back, pref. on base plate - Google Patents

Abstract

The method involves drilling the walls of each compartment with holes to take hermetically sealed electrical connections between each compartment. The welding together is done at a higher temperature than that required to seal the connections. The compartments (18-22) may be welded to a plate (23) equipped with fixing holes. The plate is made of the same metal as the compartments to improve heat dissipation during use. In this way any number of compartments may be formed from individual ones. USE/ADVANTAGE - Multiple output, insulated, sealed metal boxes for integrated circuits. Minimum interconnection length and consequent size reduction.

Description

The present invention applies to the manufacture of metal cases
insulated and hermetic multiple output liquefies
encapsulation of integrated circuits, used in microelectronics.

It is often essential for reasons of space and in order
to minimize the length of connections, to use boxes
third with overlapping compartments, separated by a wall
common.

The object of the present invention is the production of the metal body.
than these boxes.

Figure 1 shows such a case, the accented dotted line indicating
the position of the common partition 1 on which will be fixed, by hand
and on the other, the circuits to be protected which will be connected to the different
hermetic isolating outlets2, located around one or more
two compartments and with airtight insulating bushings in the wall
common (and / or in possible partitions of the compartment (s)).

The encapsulation will end with the welding of lids on cha
one of the two faces 3 and 4.

Figure 2 shows the same box cut by a perpendicular plane
to the common wall.

According to the known technique, the production of the body of such a housing
is done:
- by machining in a rectangular metal block, method
very expensive in terms of material and machining time.

 by brazing a wall inside a rectangular metal frame, this wall being positioned by a brazing gauge.

 The latter method is difficult to implement, in particular for the precise positioning of the common wall.

According to the present invention, a box with several compartments is produced by assembling-brazing two or more bodies with comparti
unique.

 These single compartment bodies are obtained by stamping and punching, therefore in an economical manner.

 Brazing must be carried out at a temperature higher than that of the sealing which is carried out subsequently.

 Holes can be drilled in the common walls, if there must be hrmetic crossings making electrical connections between the different compartments.

 Several configurations can thus be produced.

Figure 3 shows the stamped and punched body of a bowl
single compartment tier, before sealing.

Figure 4- represents a body of a host with two cavities
obtained according to the principle of the present invention by brazing
back to back of two bodies 5 and 6, stamped and stamped, identical
to that of figure 3.

The -figure-S represents a housing body with three cavities,
consisting of two stamped and punched bodies 7 and 8, plus
small, brazed on the back of a third body 9 identical to that
in Figure 3.

Figure 6 shows a housing body with 5 compartments
consisting of 5 bodies of single housings 10,11,12, 13 and 14
back to back straps.

 This technique can be used for a higher number of compartments, the principle remaining to constitute the body of a box with several compartments by means of a back-to-back brazing assembly of stamped and punched bodies with a single compartment.

Figure 7 shows a housing body with two compartments
consisting of two stamped and punched, brazed bodies 15 and 16
on either side of a plate 17 which protrudes at each end
and provided with holes so as to allow the housing to be fixed.

 This plate 17 can be made of the same metal as the bodies 15 and 16 or of a metal having better thermal conductivity, in order to improve the heat dissipation and the distribution of temperatures during operation.

 As illustrated in FIG. 8, this configuration with an interposed plate 23 and housings with a compartment 18.19, 20.2t, 22 brazed on either side, can be extended to the production of a housing body comprising a any number of compartments, each of which initially consists of a pressed and punched body with a single compartment.

Claims (6)

R E V E N D i C A T I O N S 1 Encapsulation box with two compartments for circuits  microelectronics characterized in that the housing body is  obtained by back-to-back brazing of two pressed bodies 5 and 6 and  hallmarked in a compartment (figure 4). 2 Encapsulation box with several compartments for circuits  microelectronics characterized in that the housing body  is obtained by back-to-back brazing of several bodies 7,8 and 9  (figure 5) or 10,11,12,13 and 14 (figure 6) stamped and punched  to a compartment. 3 Encapsulation boot with several compartments for circuits  microelectronics characterized in that the body of the housing  is obtained by back-to-back brazing on either side of a plate  17 (figure 7) or 23 (figure 8) of bodies 15 and 16 or 18,19,20,21  and 22 stamped and punched, these plates 17 or 23 being the same  metal than that of the bodies constituting the housing. 4 Encapsulation box with several compartments for circuits  microelectronics characterized in that the housing body  is obtained by back-to-back brazing on either side of a plate  17 (figure 7) or 23 (figure 8) of bodies 15 and 16 or 18,19,20,21  and 22 end caps and punched, these plates 17 or 23 being formed  of a metal chosen to improve heat dissipation and  temperature distribution during operation of the assembly.