FR2637417A1 - Procede de fabrication industrielle de dispositifs composites avec formation de cavites dont chacune contient un element semi-conducteur - Google Patents
Procede de fabrication industrielle de dispositifs composites avec formation de cavites dont chacune contient un element semi-conducteurInfo
- Publication number
- FR2637417A1 FR2637417A1 FR8912738A FR8912738A FR2637417A1 FR 2637417 A1 FR2637417 A1 FR 2637417A1 FR 8912738 A FR8912738 A FR 8912738A FR 8912738 A FR8912738 A FR 8912738A FR 2637417 A1 FR2637417 A1 FR 2637417A1
- Authority
- FR
- France
- Prior art keywords
- sheet
- semiconductor element
- cavity formation
- industrial manufacture
- composite devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8822962A GB2223354B (en) | 1988-09-30 | 1988-09-30 | Semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2637417A1 true FR2637417A1 (fr) | 1990-04-06 |
Family
ID=10644513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8912738A Withdrawn FR2637417A1 (fr) | 1988-09-30 | 1989-09-29 | Procede de fabrication industrielle de dispositifs composites avec formation de cavites dont chacune contient un element semi-conducteur |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH02244659A (ja) |
DE (1) | DE3931996A1 (ja) |
FR (1) | FR2637417A1 (ja) |
GB (1) | GB2223354B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4319944C2 (de) * | 1993-06-03 | 1998-07-23 | Schulz Harder Juergen | Mehrfach-Substrat sowie Verfahren zu seiner Herstellung |
JP3541491B2 (ja) * | 1994-06-22 | 2004-07-14 | セイコーエプソン株式会社 | 電子部品 |
US5832600A (en) * | 1995-06-06 | 1998-11-10 | Seiko Epson Corporation | Method of mounting electronic parts |
US5880011A (en) * | 1996-06-19 | 1999-03-09 | Pacific Trinetics Corporation | Method and apparatus for manufacturing pre-terminated chips |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926746A (en) * | 1973-10-04 | 1975-12-16 | Minnesota Mining & Mfg | Electrical interconnection for metallized ceramic arrays |
US4021839A (en) * | 1975-10-16 | 1977-05-03 | Rca Corporation | Diode package |
DE2925509A1 (de) * | 1978-07-18 | 1980-01-31 | Mitsumi Electric Co | Packung fuer schaltungselemente |
US4525597A (en) * | 1982-10-30 | 1985-06-25 | Ngk Insulators, Ltd. | Ceramic leadless packages and a process for manufacturing the same |
WO1986006212A1 (en) * | 1985-04-12 | 1986-10-23 | Hughes Aircraft Company | Mini chip carrier slotted array |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL271208A (ja) * | 1960-11-10 | |||
FR2538961B1 (fr) * | 1982-12-30 | 1985-07-12 | Europ Composants Electron | Embase pour circuit integre |
FR2564826B1 (fr) * | 1984-05-25 | 1986-08-22 | Thomson Csf | Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane |
-
1988
- 1988-09-30 GB GB8822962A patent/GB2223354B/en not_active Expired - Fee Related
-
1989
- 1989-09-26 DE DE3931996A patent/DE3931996A1/de not_active Withdrawn
- 1989-09-28 JP JP1253684A patent/JPH02244659A/ja active Pending
- 1989-09-29 FR FR8912738A patent/FR2637417A1/fr not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926746A (en) * | 1973-10-04 | 1975-12-16 | Minnesota Mining & Mfg | Electrical interconnection for metallized ceramic arrays |
US4021839A (en) * | 1975-10-16 | 1977-05-03 | Rca Corporation | Diode package |
DE2925509A1 (de) * | 1978-07-18 | 1980-01-31 | Mitsumi Electric Co | Packung fuer schaltungselemente |
US4525597A (en) * | 1982-10-30 | 1985-06-25 | Ngk Insulators, Ltd. | Ceramic leadless packages and a process for manufacturing the same |
WO1986006212A1 (en) * | 1985-04-12 | 1986-10-23 | Hughes Aircraft Company | Mini chip carrier slotted array |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPH02244659A (ja) | 1990-09-28 |
DE3931996A1 (de) | 1990-04-05 |
GB2223354A (en) | 1990-04-04 |
GB8822962D0 (en) | 1988-11-09 |
GB2223354B (en) | 1992-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |