FR2632478B1 - Raccordement electrique de groupes constitutifs hybrides, a des plaques de circuits imprimes - Google Patents

Raccordement electrique de groupes constitutifs hybrides, a des plaques de circuits imprimes

Info

Publication number
FR2632478B1
FR2632478B1 FR8904076A FR8904076A FR2632478B1 FR 2632478 B1 FR2632478 B1 FR 2632478B1 FR 8904076 A FR8904076 A FR 8904076A FR 8904076 A FR8904076 A FR 8904076A FR 2632478 B1 FR2632478 B1 FR 2632478B1
Authority
FR
France
Prior art keywords
printed circuit
hybrid
circuit board
contact areas
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8904076A
Other languages
English (en)
Other versions
FR2632478A1 (fr
Inventor
Manfred Nitsch
Peter Werner
Dieter Guenther
Herbert Arnold
Willy Bentz
Michael Horbelt
Willi Gansert
Dietrich Bergfried
Werner Auth
Ulrich Konzelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2632478A1 publication Critical patent/FR2632478A1/fr
Application granted granted Critical
Publication of FR2632478B1 publication Critical patent/FR2632478B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
FR8904076A 1988-04-22 1989-03-29 Raccordement electrique de groupes constitutifs hybrides, a des plaques de circuits imprimes Expired - Fee Related FR2632478B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3813565A DE3813565A1 (de) 1988-04-22 1988-04-22 Elektrischer anschluss von hybridbaugruppen

Publications (2)

Publication Number Publication Date
FR2632478A1 FR2632478A1 (fr) 1989-12-08
FR2632478B1 true FR2632478B1 (fr) 1996-06-14

Family

ID=6352630

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8904076A Expired - Fee Related FR2632478B1 (fr) 1988-04-22 1989-03-29 Raccordement electrique de groupes constitutifs hybrides, a des plaques de circuits imprimes

Country Status (3)

Country Link
US (1) US5168430A (fr)
DE (1) DE3813565A1 (fr)
FR (1) FR2632478B1 (fr)

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DE9102204U1 (fr) * 1991-02-25 1991-05-16 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5308264A (en) * 1993-04-15 1994-05-03 United Technologies Corporation Modular backshell interface system
JPH06326246A (ja) * 1993-05-13 1994-11-25 Mitsubishi Electric Corp 厚膜回路基板及びその製造方法
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
TW258829B (fr) * 1994-01-28 1995-10-01 Ibm
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
DE4416096A1 (de) * 1994-04-19 1995-10-26 Deutsche Telephonwerk Kabel Kontaktierung von Betätigungs- und Anzeigemitteln
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
MX9706676A (es) † 1995-03-02 1997-11-29 Raychem Sa Nv Empaque sellado para proteccion ambiental de electronicos.
US5633533A (en) * 1995-07-26 1997-05-27 International Business Machines Corporation Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5767623A (en) * 1995-09-11 1998-06-16 Planar Systems, Inc. Interconnection between an active matrix electroluminescent display and an electrical cable
US5826126A (en) * 1996-01-26 1998-10-20 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed circuit board housing structure for a camera
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
US5777855A (en) * 1996-06-18 1998-07-07 Eastman Kodak Company Method and apparatus for connecting flexible circuits to printed circuit boards
US5773884A (en) * 1996-06-27 1998-06-30 International Business Machines Corporation Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6326696B1 (en) 1998-02-04 2001-12-04 International Business Machines Corporation Electronic package with interconnected chips
US6300566B1 (en) 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
US6014320A (en) * 1998-03-30 2000-01-11 Hei, Inc. High density stacked circuit module
DE19833928B4 (de) * 1998-07-28 2005-05-25 Infineon Technologies Ag Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen
DE19834720C2 (de) * 1998-07-31 2000-09-14 Siemens Ag Sensoreinrichtung zur Erfassung von biometrischen Merkmalen
US6674869B2 (en) 2000-02-23 2004-01-06 Hei, Inc. Hearing-aid assembly using folded flex circuits
JP4522564B2 (ja) 2000-09-22 2010-08-11 富士通株式会社 電子機器
JP2002141631A (ja) * 2000-10-31 2002-05-17 Yazaki Corp フレキシブル回路体の接続構造
DE10057494A1 (de) * 2000-11-20 2002-06-13 Siemens Ag Anordnung auf einem Schaltungsträger und einer Leiterplatte oder einer Leiterplattenanordnung
DE10063876B4 (de) * 2000-12-21 2009-02-26 Continental Automotive Gmbh Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle
US7529100B2 (en) * 2003-12-16 2009-05-05 Tpo Displays Corp. Flexible printed circuit board (FPC) for liquid crystal display (LCD) module
TWM269683U (en) * 2005-01-03 2005-07-01 High Tech Comp Corp Flexible printed circuit board and reinforcing structure thereof
KR100713536B1 (ko) * 2005-06-07 2007-04-30 삼성전자주식회사 전자기기의 연성회로
DE102008052244A1 (de) * 2008-10-18 2010-04-22 Carl Freudenberg Kg Flexible Leiterplatte
CN102026475B (zh) * 2009-09-22 2012-03-21 群康科技(深圳)有限公司 软性印刷电路板及显示器制造方法
DE102013000077A1 (de) * 2013-01-08 2014-07-10 Carl Freudenberg Kg Anordnung mit einer flexiblen Leiterplatte
US9955596B2 (en) 2016-08-10 2018-04-24 Seagate Technology Llc PCBA cartridge sub-assembly
JP2022023485A (ja) * 2020-07-27 2022-02-08 キヤノン株式会社 電子機器

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DE145361C (fr) *
US3221286A (en) * 1961-07-31 1965-11-30 Sperry Rand Corp Connector for printed circuit strip transmission line
DE1591513A1 (de) * 1967-07-10 1970-02-12 Siemens Ag Anordnung zur Verbindung gedruckter Schaltungsplatten
US3579206A (en) * 1968-12-16 1971-05-18 Rca Corp Low inductance interconnection of cryoelectric memory system
US3766439A (en) * 1972-01-12 1973-10-16 Gen Electric Electronic module using flexible printed circuit board with heat sink means
US3971127A (en) * 1975-09-10 1976-07-27 Bell Telephone Laboratories, Incorporated Method of fabricating a printed wiring board assembly
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
US4509095A (en) * 1982-03-08 1985-04-02 Rockwell International Corporation Flexible circuit board interconnect having low thermal conductivity
JPS59198790A (ja) * 1983-04-26 1984-11-10 イビデン株式会社 プリント配線基板
DE8317500U1 (de) * 1983-06-15 1986-10-02 Siemens AG, 1000 Berlin und 8000 München Anordnung zum Verbinden von Schaltungsplatinen
DE3412296A1 (de) * 1984-04-03 1985-10-03 Brown, Boveri & Cie Ag, 6800 Mannheim Hybridschaltung in multilayer-technik
US4858071A (en) * 1987-02-24 1989-08-15 Nissan Motor Co., Ltd. Electronic circuit apparatus

Also Published As

Publication number Publication date
DE3813565A1 (de) 1989-11-02
US5168430A (en) 1992-12-01
FR2632478A1 (fr) 1989-12-08

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Legal Events

Date Code Title Description
ST Notification of lapse