FR2607999B1 - Ensemble de circuit electronique commande en temperature - Google Patents

Ensemble de circuit electronique commande en temperature

Info

Publication number
FR2607999B1
FR2607999B1 FR878717090A FR8717090A FR2607999B1 FR 2607999 B1 FR2607999 B1 FR 2607999B1 FR 878717090 A FR878717090 A FR 878717090A FR 8717090 A FR8717090 A FR 8717090A FR 2607999 B1 FR2607999 B1 FR 2607999B1
Authority
FR
France
Prior art keywords
temperature control
electronic circuit
circuit assembly
control electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR878717090A
Other languages
English (en)
Other versions
FR2607999A1 (fr
Inventor
Larry E Eccleston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluke Corp
Original Assignee
John Fluke Manufacturing Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by John Fluke Manufacturing Co Inc filed Critical John Fluke Manufacturing Co Inc
Publication of FR2607999A1 publication Critical patent/FR2607999A1/fr
Application granted granted Critical
Publication of FR2607999B1 publication Critical patent/FR2607999B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR878717090A 1986-12-08 1987-12-08 Ensemble de circuit electronique commande en temperature Expired - Fee Related FR2607999B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/939,522 US4841170A (en) 1986-12-08 1986-12-08 Temperature controlled hybrid assembly

Publications (2)

Publication Number Publication Date
FR2607999A1 FR2607999A1 (fr) 1988-06-10
FR2607999B1 true FR2607999B1 (fr) 1993-10-15

Family

ID=25473317

Family Applications (2)

Application Number Title Priority Date Filing Date
FR878717090A Expired - Fee Related FR2607999B1 (fr) 1986-12-08 1987-12-08 Ensemble de circuit electronique commande en temperature
FR9209720A Pending FR2682552A1 (fr) 1986-12-08 1992-08-05 Ensemble de circuit electronique commande en temperature.

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR9209720A Pending FR2682552A1 (fr) 1986-12-08 1992-08-05 Ensemble de circuit electronique commande en temperature.

Country Status (6)

Country Link
US (1) US4841170A (fr)
JP (1) JPS63278260A (fr)
CN (1) CN87107389A (fr)
DE (1) DE3741579A1 (fr)
FR (2) FR2607999B1 (fr)
GB (1) GB2198593B (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2635612B1 (fr) * 1988-08-18 1992-02-21 Alsthom Cgee Procede et auxiliaire d'ajustage dynamique pour circuit electronique hybride
US5165046A (en) * 1989-11-06 1992-11-17 Micron Technology, Inc. High speed CMOS driver circuit
US5029277A (en) * 1990-02-28 1991-07-02 Motorola, Inc. Optically compensated bipolar transistor
FR2697717B1 (fr) * 1992-10-29 1994-12-16 Thomson Csf Dispositif de réchauffage de cartes électroniques.
US5523619A (en) * 1993-11-03 1996-06-04 International Business Machines Corporation High density memory structure
DE9413550U1 (de) * 1994-08-23 1996-01-11 Dylec Ltd., Saint Peter Port, Guernsey Halbleiteranordnung mit wenigstens einem Halbleiterbauelement
EP0727928B1 (fr) * 1995-02-18 1996-09-18 Hewlett-Packard GmbH Ensemble électronique possédant de meilleures caractéristiques thermiques
DE19645095A1 (de) * 1996-11-01 1998-05-07 Ego Elektro Geraetebau Gmbh Beheizung
DE19851172A1 (de) * 1998-11-06 2000-05-11 Alcatel Sa Anordnung zur Erwärmung einer bestückten gedruckten Schaltung
JP4576238B2 (ja) * 2005-01-06 2010-11-04 オリジン電気株式会社 電子部品装置、及びそれを用いた直流高電圧電源装置
US7278308B2 (en) * 2005-12-08 2007-10-09 Honeywell International Inc. Thermal isolation between heating and sensing for flow sensors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1363163A (fr) * 1963-02-06 1964-06-12 Thomson Houston Comp Francaise Perfectionnements aux étuves pour composants électroniques
US3444399A (en) * 1965-09-24 1969-05-13 Westinghouse Electric Corp Temperature controlled electronic devices
DE1245458B (de) * 1966-04-27 1967-07-27 Telefunken Patent Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist
GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates
US3571517A (en) * 1969-05-08 1971-03-16 Bell Telephone Labor Inc Automatic intercept number identification system
US3897643A (en) * 1969-08-08 1975-08-05 Texas Instruments Inc Integrated heater element array and drive matrix
US3781515A (en) * 1969-08-08 1973-12-25 Texas Instruments Inc Integrated heater element array and drive matrix
US3703651A (en) * 1971-07-12 1972-11-21 Kollmorgen Corp Temperature-controlled integrated circuits
ZA738333B (en) * 1972-11-03 1974-11-27 Shannon Ltd Document filing systems
DE2354719A1 (de) * 1973-11-02 1975-05-15 Licentia Gmbh Anordnung zur temperaturstabilisierung
US4146903A (en) * 1977-09-16 1979-03-27 National Semiconductor Corporation System for limiting power dissipation in a power transistor to less than a destructive level
GB2038102B (en) * 1978-12-20 1982-12-15 Ferranti Ltd Circuit board temperature controller
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
JPS5734355A (en) * 1980-08-06 1982-02-24 Tektronix Inc Integrated circuit device
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector

Also Published As

Publication number Publication date
FR2607999A1 (fr) 1988-06-10
CN87107389A (zh) 1988-06-22
US4841170A (en) 1989-06-20
GB2198593B (en) 1991-07-03
FR2682552A1 (fr) 1993-04-16
DE3741579A1 (de) 1988-06-16
GB2198593A (en) 1988-06-15
GB8728066D0 (en) 1988-01-06
JPS63278260A (ja) 1988-11-15

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Legal Events

Date Code Title Description
ST Notification of lapse