FR2605829A1 - Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules - Google Patents

Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules Download PDF

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Publication number
FR2605829A1
FR2605829A1 FR8714714A FR8714714A FR2605829A1 FR 2605829 A1 FR2605829 A1 FR 2605829A1 FR 8714714 A FR8714714 A FR 8714714A FR 8714714 A FR8714714 A FR 8714714A FR 2605829 A1 FR2605829 A1 FR 2605829A1
Authority
FR
France
Prior art keywords
piston
face
tubular casing
module according
electrical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR8714714A
Other languages
English (en)
French (fr)
Inventor
David Horne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of FR2605829A1 publication Critical patent/FR2605829A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8714714A 1986-10-24 1987-10-23 Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules Pending FR2605829A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
FR2605829A1 true FR2605829A1 (fr) 1988-04-29

Family

ID=10606235

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8714714A Pending FR2605829A1 (fr) 1986-10-24 1987-10-23 Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules

Country Status (4)

Country Link
JP (1) JPS6486541A (enrdf_load_stackoverflow)
DE (2) DE3735985A1 (enrdf_load_stackoverflow)
FR (1) FR2605829A1 (enrdf_load_stackoverflow)
GB (2) GB8625472D0 (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (de) * 1990-12-17 1992-07-02 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE9100467U1 (de) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart Gehäuse eines elektrischen Steuergerätes
DE4104888C2 (de) * 1991-02-18 1994-09-08 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
DE19901445C2 (de) * 1999-01-15 2002-07-11 Siemens Ag Halbleiter-Kühl-Anordnung
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (de) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
US7699102B2 (en) 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
EP2634798A1 (de) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Elektrische Vorrichtung mit Kühlgehäuse
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector
EP3098557B1 (en) * 2015-05-26 2019-03-27 Advantech Co., Ltd. Dynamic heat conduction system
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (en) * 1978-06-29 1980-01-09 International Business Machines Corporation Methods of fabricating electrical apparatus comprising one or more heat generating electrical components
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (en) * 1978-06-29 1980-01-09 International Business Machines Corporation Methods of fabricating electrical apparatus comprising one or more heat generating electrical components
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 20, no. 7, décembre 1977, NEW YORK US pages 2761 - 2762; R.C. CHU: "DESIGN FOR PROVIDING THERMAL INTERFACE BETWEEN NARROW THERMAL INTERFACE GAPS" *
TECHNICAL DIGEST - WESTERN ELECTRIC. no. 25, janvier 1972, NEW YORK US pages 39 - 40; N.E. HARWICK-BTL: "COMBINED HEAT CONDUCTOR AND PROTECTIVE TRANSISTOR PACKAGE" *

Also Published As

Publication number Publication date
DE8714174U1 (de) 1988-03-03
GB8724682D0 (en) 1987-11-25
GB8625472D0 (en) 1986-11-26
DE3735985A1 (de) 1988-05-11
JPS6486541A (en) 1989-03-31
DE3735985C2 (enrdf_load_stackoverflow) 1992-10-15
GB2197538B (en) 1990-04-04
GB2197538A (en) 1988-05-18

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