FR2598557B1 - METHOD FOR MANUFACTURING A MEMBER ISOLATION REGION OF A SEMICONDUCTOR DEVICE - Google Patents

METHOD FOR MANUFACTURING A MEMBER ISOLATION REGION OF A SEMICONDUCTOR DEVICE

Info

Publication number
FR2598557B1
FR2598557B1 FR878705903A FR8705903A FR2598557B1 FR 2598557 B1 FR2598557 B1 FR 2598557B1 FR 878705903 A FR878705903 A FR 878705903A FR 8705903 A FR8705903 A FR 8705903A FR 2598557 B1 FR2598557 B1 FR 2598557B1
Authority
FR
France
Prior art keywords
manufacturing
semiconductor device
isolation region
member isolation
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR878705903A
Other languages
French (fr)
Other versions
FR2598557A1 (en
Inventor
Isamu Namose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62053453A external-priority patent/JPS63184352A/en
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of FR2598557A1 publication Critical patent/FR2598557A1/en
Application granted granted Critical
Publication of FR2598557B1 publication Critical patent/FR2598557B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
    • H01L21/76235—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls trench shape altered by a local oxidation of silicon process step, e.g. trench corner rounding by LOCOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
FR878705903A 1986-05-09 1987-04-27 METHOD FOR MANUFACTURING A MEMBER ISOLATION REGION OF A SEMICONDUCTOR DEVICE Expired - Lifetime FR2598557B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10596586 1986-05-09
JP22770986 1986-09-26
JP62053453A JPS63184352A (en) 1986-05-09 1987-03-09 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
FR2598557A1 FR2598557A1 (en) 1987-11-13
FR2598557B1 true FR2598557B1 (en) 1990-03-30

Family

ID=27294953

Family Applications (1)

Application Number Title Priority Date Filing Date
FR878705903A Expired - Lifetime FR2598557B1 (en) 1986-05-09 1987-04-27 METHOD FOR MANUFACTURING A MEMBER ISOLATION REGION OF A SEMICONDUCTOR DEVICE

Country Status (6)

Country Link
DE (1) DE3715092A1 (en)
FR (1) FR2598557B1 (en)
GB (1) GB2190241B (en)
HK (1) HK28791A (en)
NL (1) NL190591C (en)
SG (1) SG60090G (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1189143B (en) * 1986-05-16 1988-01-28 Sgs Microelettronica Spa PROCEDURE FOR THE IMPLEMENTATION OF THE INSULATION OF INTEGRATED CIRCUITS WITH A VERY HIGH INTEGRATION SCALE, IN PARTICULAR IN MOS AND CMOS TECHNOLOGY
JPH0442948A (en) * 1990-06-06 1992-02-13 Mitsubishi Electric Corp Manufacture of semiconductor device
KR920020676A (en) * 1991-04-09 1992-11-21 김광호 Device Separation Method of Semiconductor Device
JPH0574927A (en) * 1991-09-13 1993-03-26 Nec Corp Production of semiconductor device
KR0147630B1 (en) * 1995-04-21 1998-11-02 김광호 Insulating method of semiconductor device
KR980006053A (en) * 1996-06-26 1998-03-30 문정환 Method for forming a separation film of a semiconductor device
CN102683290A (en) * 2011-03-08 2012-09-19 无锡华润上华半导体有限公司 ROM (read only memory) device and manufacturing method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL170348C (en) * 1970-07-10 1982-10-18 Philips Nv METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE APPLYING TO A SURFACE OF A SEMICONDUCTOR BODY AGAINST DOTTING AND AGAINST THERMAL OXIDICATION MASK MATERIAL, PRE-FRIENDLY COVERING THE WINDOWS OF THE WINDOWS IN THE MATERIALS The semiconductor body with the mask is subjected to a thermal oxidation treatment to form an oxide pattern that at least partially fills in the recesses.
JPS5578540A (en) * 1978-12-08 1980-06-13 Hitachi Ltd Manufacture of semiconductor device
US4238278A (en) * 1979-06-14 1980-12-09 International Business Machines Corporation Polycrystalline silicon oxidation method for making shallow and deep isolation trenches
JPS5694646A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Forming method for oxidized film
JPS5694647A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Forming method for oxidized film
US4394196A (en) * 1980-07-16 1983-07-19 Tokyo Shibaura Denki Kabushiki Kaisha Method of etching, refilling and etching dielectric grooves for isolating micron size device regions
JPS5893342A (en) * 1981-11-30 1983-06-03 Toshiba Corp Manufacture of semiconductor device
US4435446A (en) * 1982-11-15 1984-03-06 Hewlett-Packard Company Edge seal with polysilicon in LOCOS process
JPS6054453A (en) * 1983-09-05 1985-03-28 Oki Electric Ind Co Ltd Manufacture of semiconductor integrated circuit device

Also Published As

Publication number Publication date
GB2190241A (en) 1987-11-11
NL190591C (en) 1994-05-02
DE3715092A1 (en) 1987-11-12
NL190591B (en) 1993-12-01
HK28791A (en) 1991-04-26
NL8701087A (en) 1987-12-01
DE3715092C2 (en) 1993-07-29
GB2190241B (en) 1989-12-13
GB8710281D0 (en) 1987-06-03
FR2598557A1 (en) 1987-11-13
SG60090G (en) 1990-09-07

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