FR2588146B1 - Procede pour former des circuits electriquement conducteurs sur une plaquette de base. - Google Patents

Procede pour former des circuits electriquement conducteurs sur une plaquette de base.

Info

Publication number
FR2588146B1
FR2588146B1 FR8613498A FR8613498A FR2588146B1 FR 2588146 B1 FR2588146 B1 FR 2588146B1 FR 8613498 A FR8613498 A FR 8613498A FR 8613498 A FR8613498 A FR 8613498A FR 2588146 B1 FR2588146 B1 FR 2588146B1
Authority
FR
France
Prior art keywords
electrically conductive
base wafer
conductive circuits
forming electrically
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8613498A
Other languages
English (en)
French (fr)
Other versions
FR2588146A1 (fr
Inventor
Iwasa Yamahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Research Laboratory Co Ltd
Original Assignee
Asahi Chemical Research Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Research Laboratory Co Ltd filed Critical Asahi Chemical Research Laboratory Co Ltd
Publication of FR2588146A1 publication Critical patent/FR2588146A1/fr
Application granted granted Critical
Publication of FR2588146B1 publication Critical patent/FR2588146B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR8613498A 1985-09-29 1986-09-26 Procede pour former des circuits electriquement conducteurs sur une plaquette de base. Expired - Fee Related FR2588146B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60216041A JPS6276600A (ja) 1985-09-29 1985-09-29 基板に導電回路を形成する方法

Publications (2)

Publication Number Publication Date
FR2588146A1 FR2588146A1 (fr) 1987-04-03
FR2588146B1 true FR2588146B1 (fr) 1994-05-20

Family

ID=16682349

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8613498A Expired - Fee Related FR2588146B1 (fr) 1985-09-29 1986-09-26 Procede pour former des circuits electriquement conducteurs sur une plaquette de base.

Country Status (7)

Country Link
US (1) US4734156A (enExample)
JP (1) JPS6276600A (enExample)
KR (1) KR900001840B1 (enExample)
DE (1) DE3631632A1 (enExample)
FR (1) FR2588146B1 (enExample)
GB (1) GB2181303B (enExample)
NL (1) NL8602455A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
KR900005308B1 (ko) * 1987-12-31 1990-07-27 정풍물산 주식회사 인쇄회로기판과 그의 제조방법
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
EP0406376A1 (en) * 1988-12-24 1991-01-09 Technology Applications Company Limited Improved method for making printed circuits
US4991285A (en) * 1989-11-17 1991-02-12 Rockwell International Corporation Method of fabricating multi-layer board
US5072378A (en) * 1989-12-18 1991-12-10 Storage Technology Corporation Direct access storage device with independently stored parity
DE4227085A1 (de) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
US5336363A (en) * 1993-09-24 1994-08-09 Applied Materials, Inc. Low temperature dry etch of copper
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
US7012811B1 (en) 2000-05-10 2006-03-14 Micron Technology, Inc. Method of tuning a multi-path circuit
JP7125547B2 (ja) * 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765037U (de) * 1958-02-14 1958-04-17 Max Grundig Schaltungsplatte mit in der technik der gedruckten schaltungen aufgebrachten strombahnen.
FR2133155A5 (enExample) * 1971-04-09 1972-11-24 Cii
JPS4876059A (enExample) * 1972-01-14 1973-10-13
JPS50932A (enExample) * 1973-05-04 1975-01-08
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
US4420364A (en) * 1976-11-02 1983-12-13 Sharp Kabushiki Kaisha High-insulation multi-layer device formed on a metal substrate
FR2402379A1 (fr) * 1977-08-31 1979-03-30 Cayrol Pierre Henri Perfectionnements apportes aux circuits imprimes
DE2838982B2 (de) * 1978-09-07 1980-09-18 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verfahren zum Herstellen von Mehrebenen-Leiterplatten
JPS56103260A (en) * 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder
JPS5797970U (enExample) * 1980-12-08 1982-06-16
EP0074605B1 (en) * 1981-09-11 1990-08-29 Kabushiki Kaisha Toshiba Method for manufacturing multilayer circuit substrate
JPS61185994A (ja) * 1985-02-13 1986-08-19 信越化学工業株式会社 耐熱性フレキシブルプリント配線用基板およびその製造方法
US4661372A (en) * 1985-12-23 1987-04-28 General Motors Corporation UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface

Also Published As

Publication number Publication date
GB2181303B (en) 1989-09-06
GB8620904D0 (en) 1986-10-08
DE3631632C2 (enExample) 1992-01-30
FR2588146A1 (fr) 1987-04-03
KR900001840B1 (ko) 1990-03-24
US4734156A (en) 1988-03-29
JPS6276600A (ja) 1987-04-08
KR870003679A (ko) 1987-04-18
GB2181303A (en) 1987-04-15
DE3631632A1 (de) 1987-04-02
JPH0213477B2 (enExample) 1990-04-04
NL8602455A (nl) 1987-04-16

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Legal Events

Date Code Title Description
ST Notification of lapse