FR2583921B1 - Module de refroidissement par liquide de composants electroniques - Google Patents
Module de refroidissement par liquide de composants electroniquesInfo
- Publication number
- FR2583921B1 FR2583921B1 FR868608866A FR8608866A FR2583921B1 FR 2583921 B1 FR2583921 B1 FR 2583921B1 FR 868608866 A FR868608866 A FR 868608866A FR 8608866 A FR8608866 A FR 8608866A FR 2583921 B1 FR2583921 B1 FR 2583921B1
- Authority
- FR
- France
- Prior art keywords
- electronic components
- liquid cooling
- cooling module
- module
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/47—
-
- H10W40/60—
-
- H10W40/611—
-
- H10W40/77—
-
- H10W40/235—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134842A JPS61292944A (ja) | 1985-06-20 | 1985-06-20 | 集積回路パツケ−ジの液体冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2583921A1 FR2583921A1 (fr) | 1986-12-26 |
| FR2583921B1 true FR2583921B1 (fr) | 1989-04-07 |
Family
ID=15137738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR868608866A Expired FR2583921B1 (fr) | 1985-06-20 | 1986-06-19 | Module de refroidissement par liquide de composants electroniques |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4693303A (enExample) |
| JP (1) | JPS61292944A (enExample) |
| FR (1) | FR2583921B1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
| US4882654A (en) * | 1988-12-22 | 1989-11-21 | Microelectronics And Computer Technology Corporation | Method and apparatus for adjustably mounting a heat exchanger for an electronic component |
| US6665184B2 (en) | 2001-07-13 | 2003-12-16 | Lytron, Inc. | Tapered cold plate |
| US7849914B2 (en) * | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
| SG181180A1 (en) * | 2010-11-12 | 2012-06-28 | Semicaps Pte Ltd | Apparatus and method for cooling a semiconductor device |
| EP2689454B1 (en) * | 2011-03-25 | 2016-03-02 | Koninklijke Philips N.V. | Thermal interface pad material with perforated liner |
| US9917034B2 (en) | 2014-09-26 | 2018-03-13 | Semicaps Pte Ltd | Method and apparatus for cooling a semiconductor device |
| JP7334433B2 (ja) * | 2019-03-19 | 2023-08-29 | 日本電気株式会社 | 放熱構造及び電子部品 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093971A (en) * | 1976-12-10 | 1978-06-06 | Burroughs Corporation | D-I-P On island |
| US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
| US4341432A (en) * | 1979-08-06 | 1982-07-27 | Cutchaw John M | Liquid cooled connector for integrated circuit packages |
| US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
-
1985
- 1985-06-20 JP JP60134842A patent/JPS61292944A/ja active Granted
-
1986
- 1986-06-19 FR FR868608866A patent/FR2583921B1/fr not_active Expired
- 1986-06-19 US US06/876,381 patent/US4693303A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426549B2 (enExample) | 1992-05-07 |
| JPS61292944A (ja) | 1986-12-23 |
| US4693303A (en) | 1987-09-15 |
| FR2583921A1 (fr) | 1986-12-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |