FR2576609B1 - Composition et procede pour former un revetement en palladium en alliages de palladium - Google Patents

Composition et procede pour former un revetement en palladium en alliages de palladium

Info

Publication number
FR2576609B1
FR2576609B1 FR868601092A FR8601092A FR2576609B1 FR 2576609 B1 FR2576609 B1 FR 2576609B1 FR 868601092 A FR868601092 A FR 868601092A FR 8601092 A FR8601092 A FR 8601092A FR 2576609 B1 FR2576609 B1 FR 2576609B1
Authority
FR
France
Prior art keywords
palladium
composition
forming
coating
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR868601092A
Other languages
English (en)
Other versions
FR2576609A1 (fr
Inventor
John R Lovie
Gerardus A Somers
Jan J M Hendriks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of FR2576609A1 publication Critical patent/FR2576609A1/fr
Application granted granted Critical
Publication of FR2576609B1 publication Critical patent/FR2576609B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR868601092A 1985-01-25 1986-01-27 Composition et procede pour former un revetement en palladium en alliages de palladium Expired - Lifetime FR2576609B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8501856A GB2171721B (en) 1985-01-25 1985-01-25 Palladium and palladium alloy plating

Publications (2)

Publication Number Publication Date
FR2576609A1 FR2576609A1 (fr) 1986-08-01
FR2576609B1 true FR2576609B1 (fr) 1991-05-24

Family

ID=10573375

Family Applications (1)

Application Number Title Priority Date Filing Date
FR868601092A Expired - Lifetime FR2576609B1 (fr) 1985-01-25 1986-01-27 Composition et procede pour former un revetement en palladium en alliages de palladium

Country Status (8)

Country Link
US (1) US4715935A (fr)
JP (1) JPS61183490A (fr)
CA (1) CA1291440C (fr)
DE (1) DE3601698A1 (fr)
FR (1) FR2576609B1 (fr)
GB (1) GB2171721B (fr)
HK (1) HK73290A (fr)
SG (1) SG54690G (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880010160A (ko) * 1987-02-24 1988-10-07 로버트 에스.알렉산더 팔라듐 전기도금조 및 도금 방법
US5149420A (en) * 1990-07-16 1992-09-22 Board Of Trustees, Operating Michigan State University Method for plating palladium
JP3171646B2 (ja) * 1992-03-25 2001-05-28 日本エレクトロプレイテイング・エンジニヤース株式会社 白金合金めっき浴及びそれを用いた白金合金めっき品の製造方法
US5894038A (en) * 1997-02-28 1999-04-13 The Whitaker Corporation Direct deposition of palladium
US5846615A (en) * 1997-02-28 1998-12-08 The Whitaker Corporation Direct deposition of a gold layer
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US7981508B1 (en) * 2006-09-12 2011-07-19 Sri International Flexible circuits
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法
US20110147225A1 (en) * 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
ITFI20120098A1 (it) * 2012-05-22 2013-11-23 Bluclad Srl Bagno galvanico a base di palladio e fosforo, suo uso in processi galvanici e leghe ottenute applicando il processo galvanico a detti bagni.
US10815578B2 (en) * 2017-09-08 2020-10-27 Electrode Solutions, LLC Catalyzed cushion layer in a multi-layer electrode
CN117384221B (zh) * 2023-10-12 2024-05-07 贵研化学材料(云南)有限公司 一种草酸合酰胺钯化合物、其制备方法及应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2469727A (en) * 1944-03-30 1949-05-10 Du Pont Electrodeposition of nickel
GB1035850A (en) * 1964-06-12 1966-07-13 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of palladium
SU449996A1 (ru) * 1972-10-17 1974-11-15 Киевский Ордена Ленина Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции Электролит дл осаждени платинопалладиевого сплава
CH572989A5 (fr) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
DE2445538C2 (de) * 1974-09-20 1984-05-30 Schering AG, 1000 Berlin und 4709 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
SE8106867L (sv) * 1980-12-11 1982-06-12 Hooker Chemicals Plastics Corp Elektrolytisk avsettning av palladium och palladiumlegeringar
SE8106868L (sv) * 1980-12-17 1982-06-18 Hooker Chemicals Plastics Corp Vit elektrolytisk avsettning av palladium
US4487665A (en) * 1980-12-17 1984-12-11 Omi International Corporation Electroplating bath and process for white palladium
BE894190A (fr) * 1981-09-11 1982-12-16 Langbein Pfanhauser Werke Ag Procede pour accroitre la resistance a la corrosion d'un alliage palladium-nickel depose par electrolyse
FR2539145B1 (fr) * 1983-01-07 1986-08-29 Omi Int Corp Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede
US4545869A (en) * 1985-01-29 1985-10-08 Omi International Corporation Bath and process for high speed electroplating of palladium

Also Published As

Publication number Publication date
HK73290A (en) 1990-09-21
GB2171721B (en) 1989-06-07
DE3601698C2 (fr) 1989-06-15
JPS61183490A (ja) 1986-08-16
SG54690G (en) 1990-09-07
GB8501856D0 (en) 1985-02-27
CA1291440C (fr) 1991-10-29
DE3601698A1 (de) 1986-07-31
GB2171721A (en) 1986-09-03
JPS6220279B2 (fr) 1987-05-06
US4715935A (en) 1987-12-29
FR2576609A1 (fr) 1986-08-01

Similar Documents

Publication Publication Date Title
IL74266A (en) Method and apparatus for atomization of unstable molten metal streams
EP0164669A3 (en) Process for coating pharmaceutical forms
FR2576609B1 (fr) Composition et procede pour former un revetement en palladium en alliages de palladium
DE3571304D1 (en) Method of squeeze forming metal articles
FR2556335B1 (fr) Composition et procede pour inhiber la formation de tartre
GB2183517B (en) Method of making metal castings
FR2586713B1 (fr) Electrolyte et procede pour former un revetement en alliage de zinc
KR860003650A (ko) 마스크 없는 크래딩 공정용 금속 피복방법
GB2178351B (en) Continuous metal casting method
FR2557153B1 (fr) Procede d'application d'un email sur un metal
BE893533A (fr) Procede et composition pour l'electrodeposition de l'etain
DE3470573D1 (en) Method and apparatus for unilateral electroplating of a moving metal strip
GB2154613B (en) Method and apparatus for coating of wire or strip
DE3565786D1 (en) Method and apparatus for the production of metal products
GB2162863B (en) A method of and apparatus for hot-dip metallizing
DE3573802D1 (en) Method for coating metal surfaces
FR2551079B1 (fr) Compositions perfectionnees pour la dissolution de metaux et procede de dissolution
DE3561150D1 (en) Method for formation of metal compound coating
KR860005043A (ko) 금속 융체내로 첨가제를 증발시키는 방법
FR2555600B1 (fr) Compositions ameliorees pour la dissolution de metaux et procede de dissolution
HUT41293A (en) Method for producing poly-olefine coating of metal tubes
GB2126609B (en) Method and apparatus for production of atomized metal
AU2128988A (en) Apparatus and process for unilateral electroplating of a metal strip
DE3278719D1 (en) A method of high speed electroplating palladium and palladium electroplating solution therefor
GB2097818B (en) Method and apparatus for continuous electro-plating of wire

Legal Events

Date Code Title Description
ST Notification of lapse