FR2570909B1 - Montage de pastille d'imageur a semi-conducteurs - Google Patents

Montage de pastille d'imageur a semi-conducteurs

Info

Publication number
FR2570909B1
FR2570909B1 FR858514214A FR8514214A FR2570909B1 FR 2570909 B1 FR2570909 B1 FR 2570909B1 FR 858514214 A FR858514214 A FR 858514214A FR 8514214 A FR8514214 A FR 8514214A FR 2570909 B1 FR2570909 B1 FR 2570909B1
Authority
FR
France
Prior art keywords
imager
imager chip
light transmissive
exit port
prism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR858514214A
Other languages
English (en)
Other versions
FR2570909A1 (fr
Inventor
Peter Alan Levine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2570909A1 publication Critical patent/FR2570909A1/fr
Application granted granted Critical
Publication of FR2570909B1 publication Critical patent/FR2570909B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
FR858514214A 1984-09-26 1985-09-25 Montage de pastille d'imageur a semi-conducteurs Expired - Fee Related FR2570909B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/654,556 US4622580A (en) 1984-09-26 1984-09-26 Solid-state imager chip mounting

Publications (2)

Publication Number Publication Date
FR2570909A1 FR2570909A1 (fr) 1986-03-28
FR2570909B1 true FR2570909B1 (fr) 1991-05-24

Family

ID=24625334

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858514214A Expired - Fee Related FR2570909B1 (fr) 1984-09-26 1985-09-25 Montage de pastille d'imageur a semi-conducteurs

Country Status (6)

Country Link
US (1) US4622580A (fr)
JP (1) JP2608048B2 (fr)
KR (1) KR940007594B1 (fr)
DE (1) DE3534186C2 (fr)
FR (1) FR2570909B1 (fr)
GB (1) GB2165092B (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028841A (en) * 1989-07-18 1991-07-02 Copytele, Inc. Chip mounting techniques for display apparatus
US5279694A (en) * 1986-12-04 1994-01-18 Copytele, Inc. Chip mounting techniques for display apparatus
NL8801291A (nl) * 1988-05-19 1989-12-18 Philips Nv Optisch samenstel voor een televisiecamera voorzien van een beeldsensor en werkwijze voor het vervaardigen van zulk een optisch samenstel.
US5418566A (en) * 1990-09-10 1995-05-23 Kabushiki Kaisha Toshiba Compact imaging apparatus for electronic endoscope with improved optical characteristics
JP3017780B2 (ja) * 1990-09-10 2000-03-13 株式会社東芝 電子内視鏡撮像装置
JPH0462065U (fr) * 1990-10-11 1992-05-27
US5400108A (en) * 1992-06-04 1995-03-21 Fuji Electric Co., Ltd. Autofocus module assembly
US5340420A (en) * 1993-01-28 1994-08-23 Eastman Kodak Company Method for bonding a color separation filter to an image sensor
FI97264C (fi) * 1994-10-28 1996-11-11 Tvi Temet Vision Ind Oy Menetelmä valoilmaisinrivin asemoimiseksi ja valojako- ja ilmaisinrakenne viivakameraa varten
US6614478B1 (en) * 1999-04-30 2003-09-02 Foveon, Inc. Color separation prisms having solid-state imagers mounted thereon and camera employing same
FR2832252B1 (fr) * 2001-11-14 2004-03-12 St Microelectronics Sa Boitier semi-conducteur a capteur, muni d'un insert de fixation
JP4209608B2 (ja) * 2001-11-14 2009-01-14 信越化学工業株式会社 室温硬化性シリコーンゴム組成物
US7834300B2 (en) * 2005-02-07 2010-11-16 Bae Systems Information And Electronic Systems Integration Inc. Ballistic guidance control for munitions
JP6205228B2 (ja) * 2013-09-30 2017-09-27 オリンパス株式会社 撮像モジュールおよび内視鏡装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5714466Y2 (fr) * 1975-11-18 1982-03-25
US4044374A (en) * 1976-01-19 1977-08-23 Texas Instruments Incorporated Semiconductor device header suitable for vacuum tube applications
US4166280A (en) * 1977-11-04 1979-08-28 Ampex Corporation High performance television color camera employing a camera tube and solid state sensors
US4268119A (en) * 1979-01-22 1981-05-19 Bell & Howell Company Color-separating optical system
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPS5630381A (en) * 1979-08-21 1981-03-26 Toshiba Corp Image pickup unit
US4388128A (en) * 1980-03-17 1983-06-14 Matsushita Electric Industrial Co., Ltd. Solid-state color-image sensor and process for fabricating the same
US4323918A (en) * 1980-08-25 1982-04-06 Rca Corporation Optical assembly for color television
JPS57124982A (en) * 1981-01-28 1982-08-04 Hitachi Ltd Solid-state image pickup device
JPS5947774A (ja) 1982-09-10 1984-03-17 Fuji Electric Co Ltd 光半導体装置
JPS59122086A (ja) * 1982-12-27 1984-07-14 Toshiba Corp 固体撮像装置

Also Published As

Publication number Publication date
FR2570909A1 (fr) 1986-03-28
GB2165092A (en) 1986-04-03
KR940007594B1 (ko) 1994-08-20
GB8523652D0 (en) 1985-10-30
US4622580A (en) 1986-11-11
JP2608048B2 (ja) 1997-05-07
DE3534186C2 (de) 1994-11-24
DE3534186A1 (de) 1986-04-03
KR860002727A (ko) 1986-04-28
GB2165092B (en) 1987-12-09
JPS61112480A (ja) 1986-05-30

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Legal Events

Date Code Title Description
ST Notification of lapse