FR2541824B1 - Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en parallele - Google Patents
Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en paralleleInfo
- Publication number
- FR2541824B1 FR2541824B1 FR8402394A FR8402394A FR2541824B1 FR 2541824 B1 FR2541824 B1 FR 2541824B1 FR 8402394 A FR8402394 A FR 8402394A FR 8402394 A FR8402394 A FR 8402394A FR 2541824 B1 FR2541824 B1 FR 2541824B1
- Authority
- FR
- France
- Prior art keywords
- multiplicity
- parallel
- power device
- similar elements
- device consisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01019—Potassium [K]
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- H01L2924/01023—Vanadium [V]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01058—Cerium [Ce]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Bipolar Transistors (AREA)
- Die Bonding (AREA)
- Emergency Protection Circuit Devices (AREA)
- Noodles (AREA)
- Electronic Switches (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8319832A IT1212708B (it) | 1983-02-28 | 1983-02-28 | Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2541824A1 FR2541824A1 (fr) | 1984-08-31 |
FR2541824B1 true FR2541824B1 (fr) | 1985-12-27 |
Family
ID=11161650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8402394A Expired FR2541824B1 (fr) | 1983-02-28 | 1984-02-17 | Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en parallele |
Country Status (6)
Country | Link |
---|---|
US (1) | US4881117A (fr) |
JP (1) | JPS59165441A (fr) |
DE (1) | DE3406420A1 (fr) |
FR (1) | FR2541824B1 (fr) |
GB (1) | GB2135824B (fr) |
IT (1) | IT1212708B (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3529341A1 (de) * | 1985-08-16 | 1987-02-19 | Telefunken Electronic Gmbh | Solarzellen-modul |
FR2617636A1 (fr) * | 1987-07-02 | 1989-01-06 | Neiman Sa | Procede de fabrication d'un composant electronique de puissance et composants obtenus par ce procede |
FR2620862B1 (fr) * | 1987-09-17 | 1990-04-06 | Thomson Semiconducteurs | Montage en parallele de transistors mos de puissance |
DE3802821A1 (de) * | 1988-01-30 | 1989-08-03 | Bosch Gmbh Robert | Leistungstransistor |
FR2652983B1 (fr) * | 1989-10-11 | 1993-04-30 | Alsthom Gec | Montage en cascade d'etages de transistors en parallele realise en circuit hybride. |
DE69115799T2 (de) * | 1990-08-28 | 1996-07-11 | Ibm | Herstellung von Halbleiterpackungen |
DE59107655D1 (de) * | 1991-02-22 | 1996-05-09 | Asea Brown Boveri | Abschaltbares Hochleistungs-Halbleiterbauelement |
US5250847A (en) * | 1991-06-27 | 1993-10-05 | Motorola, Inc. | Stress isolating signal path for integrated circuits |
DE4130160A1 (de) * | 1991-09-11 | 1993-03-25 | Export Contor Aussenhandel | Elektronische schaltung |
DE19638090C2 (de) * | 1996-09-18 | 2001-11-29 | Infineon Technologies Ag | Stromanschluß für Leistungshalbleiterbauelement |
EP1209742A1 (fr) * | 2000-11-22 | 2002-05-29 | ABB Schweiz AG | Module semi-conductrice à haut prestation et utilisation de la meme |
DE102004056984A1 (de) * | 2004-11-25 | 2006-06-08 | Siemens Ag | Stromrichteranordnung |
DE102004061936A1 (de) * | 2004-12-22 | 2006-07-06 | Siemens Ag | Anordnung eines Halbleitermoduls und einer elektrischen Verschienung |
DE102004061908B4 (de) * | 2004-12-22 | 2009-07-30 | Siemens Ag | Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat |
US8833169B2 (en) * | 2011-12-09 | 2014-09-16 | General Electric Company | System and method for inspection of a part with dual multi-axis robotic devices |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1250009B (fr) * | 1962-07-28 | |||
US3996603A (en) * | 1974-10-18 | 1976-12-07 | Motorola, Inc. | RF power semiconductor package and method of manufacture |
JPS5442986A (en) * | 1977-09-09 | 1979-04-05 | Omron Tateisi Electronics Co | Menufacture of semiconductor device |
US4247864A (en) * | 1978-03-06 | 1981-01-27 | Amp Incorporated | Light emitting diode assembly |
US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
DE3106376A1 (de) * | 1981-02-20 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern |
-
1983
- 1983-02-28 IT IT8319832A patent/IT1212708B/it active
-
1984
- 1984-02-17 FR FR8402394A patent/FR2541824B1/fr not_active Expired
- 1984-02-22 DE DE19843406420 patent/DE3406420A1/de not_active Withdrawn
- 1984-02-23 US US06/582,793 patent/US4881117A/en not_active Expired - Lifetime
- 1984-02-27 GB GB08405012A patent/GB2135824B/en not_active Expired
- 1984-02-28 JP JP59035474A patent/JPS59165441A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB8405012D0 (en) | 1984-04-04 |
FR2541824A1 (fr) | 1984-08-31 |
GB2135824B (en) | 1986-10-01 |
IT1212708B (it) | 1989-11-30 |
DE3406420A1 (de) | 1984-08-30 |
IT8319832A0 (it) | 1983-02-28 |
JPS59165441A (ja) | 1984-09-18 |
US4881117A (en) | 1989-11-14 |
GB2135824A (en) | 1984-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
D6 | Patent endorsed licences of rights | ||
ST | Notification of lapse |